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RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-166.V1.0
Base Material:
PTFE Based, Ceramic Filled Fiberglass
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thmil (0.762mm), 60mil (1.524mm)ickness:
10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..
Highlight:

60mil Coating RF Circuit Board

,

Hasl Surface Finish RF Circuit Board

,

PTFE Based RF Circuit Board

Product Description

 

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications

 

RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.

 

RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.

 

Our PCB Capability (RF-60TC)

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Benefits:

1. Improved loss tangent

- Lower insertion loss

- Enhanced antenna gain / efficiency

 

2. High thermal conductivity

- Exceptional thermal management

- Lower operating temperature

- Higher power application

- Long term reliablity

 

3. Enhanced dimensional stability

 

4. Low Z-axis CTE

- Multilayer application available

- Reliable plated through hole

 

5. Excellent adhesion to metal

- Lower profile copper available

- Heavy metal back available

 

6. Stable DK over frequency

7. Stable DK over temperature

 

8. Low moisture absorption

 

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 0

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 1

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 2

 

Applications:

High power amplifier

Miniaturized antennas (GPS / PATCH / RFID Reader)

Filters, couplers, dividers

Satellites

 

Typical Value of RF-60TC

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0

 

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 3

 

products
PRODUCTS DETAILS
RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-166.V1.0
Base Material:
PTFE Based, Ceramic Filled Fiberglass
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thmil (0.762mm), 60mil (1.524mm)ickness:
10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

60mil Coating RF Circuit Board

,

Hasl Surface Finish RF Circuit Board

,

PTFE Based RF Circuit Board

Product Description

 

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications

 

RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.

 

RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.

 

Our PCB Capability (RF-60TC)

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Benefits:

1. Improved loss tangent

- Lower insertion loss

- Enhanced antenna gain / efficiency

 

2. High thermal conductivity

- Exceptional thermal management

- Lower operating temperature

- Higher power application

- Long term reliablity

 

3. Enhanced dimensional stability

 

4. Low Z-axis CTE

- Multilayer application available

- Reliable plated through hole

 

5. Excellent adhesion to metal

- Lower profile copper available

- Heavy metal back available

 

6. Stable DK over frequency

7. Stable DK over temperature

 

8. Low moisture absorption

 

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 0

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 1

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 2

 

Applications:

High power amplifier

Miniaturized antennas (GPS / PATCH / RFID Reader)

Filters, couplers, dividers

Satellites

 

Typical Value of RF-60TC

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0

 

RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish 3

 

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