|
Product Details:
Payment & Shipping Terms:
|
| Base Material: | PTFE Based, Ceramic Filled Fiberglass | Layer Count: | Double Layer, Multilayer, Hybrid PCB |
|---|---|---|---|
| PCB Thmil (0.762mm), 60mil (1.524mm)ickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30 | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc.. | ||
| High Light: | 60mil Coating RF Circuit Board,Hasl Surface Finish RF Circuit Board,PTFE Based RF Circuit Board |
||
RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications
RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.
RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.
Our PCB Capability (RF-60TC)
| PCB Material: | PTFE based, ceramic filled fiberglass |
| Designation: | RF-60TC |
| Dielectric constant: | 6.15 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
Benefits:
1. Improved loss tangent
- Lower insertion loss
- Enhanced antenna gain / efficiency
2. High thermal conductivity
- Exceptional thermal management
- Lower operating temperature
- Higher power application
- Long term reliablity
3. Enhanced dimensional stability
4. Low Z-axis CTE
- Multilayer application available
- Reliable plated through hole
5. Excellent adhesion to metal
- Lower profile copper available
- Heavy metal back available
6. Stable DK over frequency
7. Stable DK over temperature
8. Low moisture absorption
Applications:
High power amplifier
Miniaturized antennas (GPS / PATCH / RFID Reader)
Filters, couplers, dividers
Satellites
Typical Value of RF-60TC
| RF-60TC Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
| TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
| Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
| Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
| Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
| Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
| CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
| CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
| Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
| Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
| Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
| Flammability Rating | UL 94 | V-0 | V-0 | ||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
