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6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB
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6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB
  • name
  • name

6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-170.V1.0
Base Material:
Fibre Glass Coated PTFE
Layer Count:
1 Layer, 2 Layers And Multi-layer
PCB Thickness:
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc.
Highlight:

High Frequency Taconic PCB

,

PTFE Microwave PCB

,

6.0mm Taconic PCB

Product Description

 

6.0mm F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 50mm x 50mm Size With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.

 

Typical Properties (F4BTM-1/2)

Appearance It complies with the national military standard regulations of microwave printed circuit substrate materials
Part No. F4BTM-1/2 (255) F4BTM-1/2 (265) F4BTM-1/2 (285) F4BTM-1/2 (294) F4BTM-1/2 (300) F4BTM-1/2 (320)
F4BTM-1/2 (338) F4BTM-1/2 (350) F4BTM-1/2 (400) F4BTM-1/2 (440) F4BTM-1/2 (615) F4BTM-1/2 (1020)
Sheet Size(mm) 610 x 460 600 x 500 1220 x 914 1220 x 1000 1500 x 1000  
Dielectric Thickness(mm) 0.254 ±0.025 0.508 ±0.05 0.762 ±0.05 0.787 ±0.05 1.016 ±0.05 1.27 ±0.05
1.524 ±0.05 2.0 ±0.075 3.0 ±0.09 4.0 ±0.1 5.0 ±0.1 6.0 ±0.12
9.0 ±0.18 10.0 ±0.18 12.0 ±0.2      
Exfoliation strength of copper foil Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm
Thermal Stress Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble.
Chemical Properties According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment.
Physical and electrical performance Property Test Condition Unit Value
Density Normal g/cm³ 2.1-3.0
Water Absorption Dip in 20℃±2℃ distilled water for 24 hours % ≦0.05
Operation Temperature High and low temperature box ℃ -50~+260
Coefficient of thermal conductivity   W/(m·K) 0.6 - 0.9
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 2.55~3.0) ppm/℃ x 15
y 15
z 65
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 3.2~3.5) ppm/℃ x 15
y 15
z 55
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 4.0~10.2) ppm/℃ x 12
y 14
z 50
Shrinkage Factor Cook in boiling water for 2 hours % <0.0002
Surface Resistivity 500V DC Normal State M.Ω ≧1 x 106
Constant heat and humidity ≧1 x 105
Volume Resistivity Normal State MΩ.cm ≧1 x 107
Constant Heat and Humidity ≧1 x 106
Surface Electrical Resistance Strength Normal State δ=1mm(Kv/mm) ≧1.2
Constant Heat and Humidity ≧1.1
Dielectric Constant 10GHz εr 2.85 ±0.05 2.94 ±0.05 2.55 ±0.05
3.00 ±0.05 3.20 ±0.05 2.65 ±0.05
3.38 ±0.05 3.50 ±0.05  
4.00 ±0.08 4.40 ±0.1  
6.15 ±0.15 10.2 ±0.25  
Temperature Coefficient of Dielectric Constant Dielectric Constant Value
2.55 2.65 -90
2.85 2.94 -85
3.0 3.2 -75
3.38 -65
3.5 4.0 4.4 -60
6.15 -55
10.2 -50
Dissipation Factor 10 GHz tgδ 2.55-3.0 ≦1.5 x 10-3
tgδ 3.0-3.5 ≦2.0 x 10-2
tgδ 4.0-10.2 ≦2.5 x 10-2
Flame Retardant Resistance UL94 V-0

 

6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB 0

 

Our PCB Capability(F4BTM-1/2)

PCB Material: Fibre glass coated PTFE
Code: F4BTM-1/2 (family series)
Dielectric constant: 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2
Layer count: 1 Layer, 2 Layers and multi-layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc.

 

About US

For 18 years, we have been a leading high-frequency PCB supplier and exporter based in Shenzhen, China, serving a global clientele. We specialize in manufacturing advanced circuit boards for demanding applications, including cellular base stations, satellite communications, radar systems, and millimeter-wave equipment.

Our expertise is built upon a deep understanding of high-frequency materials. We primarily utilize three premier brands: Rogers, Taconic, and Wangling, offering a wide range of dielectric constants from 2.2 to 10.6. This allows us to precisely match material properties to your application's requirements for optimal performance.

Our Core Material Portfolio Includes:

  • Rogers: RO4000® & RO3000® series, RT/duroid®, TMM®, Kappa®

  • Taconic: TLX, TLY, RF series (including RF-35TC)

  • Wangling: AD, TC, and PTFE-based materials

  • Other Brands: Nelco high-performance laminates

6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB 1

 

Tags: 

HASL RF PCB Board,  

Taconic TLX RF PCB Board,  

High Frequency Taconic PCB

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB
  • name
  • name
6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-170.V1.0
Base Material:
Fibre Glass Coated PTFE
Layer Count:
1 Layer, 2 Layers And Multi-layer
PCB Thickness:
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc.
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

High Frequency Taconic PCB

,

PTFE Microwave PCB

,

6.0mm Taconic PCB

Product Description

 

6.0mm F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 50mm x 50mm Size With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.

 

Typical Properties (F4BTM-1/2)

Appearance It complies with the national military standard regulations of microwave printed circuit substrate materials
Part No. F4BTM-1/2 (255) F4BTM-1/2 (265) F4BTM-1/2 (285) F4BTM-1/2 (294) F4BTM-1/2 (300) F4BTM-1/2 (320)
F4BTM-1/2 (338) F4BTM-1/2 (350) F4BTM-1/2 (400) F4BTM-1/2 (440) F4BTM-1/2 (615) F4BTM-1/2 (1020)
Sheet Size(mm) 610 x 460 600 x 500 1220 x 914 1220 x 1000 1500 x 1000  
Dielectric Thickness(mm) 0.254 ±0.025 0.508 ±0.05 0.762 ±0.05 0.787 ±0.05 1.016 ±0.05 1.27 ±0.05
1.524 ±0.05 2.0 ±0.075 3.0 ±0.09 4.0 ±0.1 5.0 ±0.1 6.0 ±0.12
9.0 ±0.18 10.0 ±0.18 12.0 ±0.2      
Exfoliation strength of copper foil Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm
Thermal Stress Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble.
Chemical Properties According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment.
Physical and electrical performance Property Test Condition Unit Value
Density Normal g/cm³ 2.1-3.0
Water Absorption Dip in 20℃±2℃ distilled water for 24 hours % ≦0.05
Operation Temperature High and low temperature box ℃ -50~+260
Coefficient of thermal conductivity   W/(m·K) 0.6 - 0.9
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 2.55~3.0) ppm/℃ x 15
y 15
z 65
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 3.2~3.5) ppm/℃ x 15
y 15
z 55
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 4.0~10.2) ppm/℃ x 12
y 14
z 50
Shrinkage Factor Cook in boiling water for 2 hours % <0.0002
Surface Resistivity 500V DC Normal State M.Ω ≧1 x 106
Constant heat and humidity ≧1 x 105
Volume Resistivity Normal State MΩ.cm ≧1 x 107
Constant Heat and Humidity ≧1 x 106
Surface Electrical Resistance Strength Normal State δ=1mm(Kv/mm) ≧1.2
Constant Heat and Humidity ≧1.1
Dielectric Constant 10GHz εr 2.85 ±0.05 2.94 ±0.05 2.55 ±0.05
3.00 ±0.05 3.20 ±0.05 2.65 ±0.05
3.38 ±0.05 3.50 ±0.05  
4.00 ±0.08 4.40 ±0.1  
6.15 ±0.15 10.2 ±0.25  
Temperature Coefficient of Dielectric Constant Dielectric Constant Value
2.55 2.65 -90
2.85 2.94 -85
3.0 3.2 -75
3.38 -65
3.5 4.0 4.4 -60
6.15 -55
10.2 -50
Dissipation Factor 10 GHz tgδ 2.55-3.0 ≦1.5 x 10-3
tgδ 3.0-3.5 ≦2.0 x 10-2
tgδ 4.0-10.2 ≦2.5 x 10-2
Flame Retardant Resistance UL94 V-0

 

6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB 0

 

Our PCB Capability(F4BTM-1/2)

PCB Material: Fibre glass coated PTFE
Code: F4BTM-1/2 (family series)
Dielectric constant: 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2
Layer count: 1 Layer, 2 Layers and multi-layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc.

 

About US

For 18 years, we have been a leading high-frequency PCB supplier and exporter based in Shenzhen, China, serving a global clientele. We specialize in manufacturing advanced circuit boards for demanding applications, including cellular base stations, satellite communications, radar systems, and millimeter-wave equipment.

Our expertise is built upon a deep understanding of high-frequency materials. We primarily utilize three premier brands: Rogers, Taconic, and Wangling, offering a wide range of dielectric constants from 2.2 to 10.6. This allows us to precisely match material properties to your application's requirements for optimal performance.

Our Core Material Portfolio Includes:

  • Rogers: RO4000® & RO3000® series, RT/duroid®, TMM®, Kappa®

  • Taconic: TLX, TLY, RF series (including RF-35TC)

  • Wangling: AD, TC, and PTFE-based materials

  • Other Brands: Nelco high-performance laminates

6.0mm F4B High Frequency Taconic PCB DK 4.4 PTFE Microwave PCB 1

 

Tags: 

HASL RF PCB Board,

Taconic TLX RF PCB Board,

High Frequency Taconic PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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