logo
Home ProductsCustom PCBs

High Frequency CuClad 217 Copper Clad Laminate

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

High Frequency CuClad 217 Copper Clad Laminate

High Frequency CuClad 217 Copper Clad Laminate
High Frequency CuClad 217 Copper Clad Laminate

Large Image :  High Frequency CuClad 217 Copper Clad Laminate

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

High Frequency CuClad 217 Copper Clad Laminate

Description
Part Number: CuClad 217 Laminate Thickness: 0.25mm, 0.51mm, 0.79mm, 1.57mm
Laminate Size: 18"X12"(457X305mm); 18"X24"(457X610mm) Copper Weight: 0.5OZ(0.018mm)1OZ(0.035mm)
Highlight:

High Frequency CuClad 217 laminate

,

Copper Clad Laminate with high frequency

,

CuClad 217 PCB material

CuClad® laminates are composite materials composed of woven fiberglass and polytetrafluoroethylene (PTFE), engineered specifically for deployment as printed circuit board (PCB) substrates. By precisely regulating the fiberglass-to-PTFE ratio, CuClad laminates deliver a diversified product portfolio: ranging from variants with ultra-low dielectric constant and loss tangent to highly reinforced grades optimized for enhanced dimensional stability.


Compared with non-woven fiberglass-reinforced PTFE laminates of equivalent dielectric constants, the woven fiberglass reinforcement in CuClad products confers superior dimensional stability. The consistent, tightly controlled PTFE coating process applied to the fiberglass cloth enables Rogers to supply laminates with a broader spectrum of dielectric constant options, as well as improved dielectric constant uniformity relative to comparable non-woven fiberglass-reinforced alternatives. These performance attributes position CuClad as a preferred material solution for fabricating filters, couplers, and low-noise amplifiers.


A defining characteristic of CuClad laminates is their cross-ply construction: successive layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This unique design ensures true electrical and mechanical isotropy across the XY plane—a feature exclusive to CuClad laminates that no other woven or non-woven fiberglass-reinforced PTFE laminates on the market can match. For certain phased array antenna applications, designers have verified that this level of isotropy is a critical performance prerequisite.


CuClad 217 (with a dielectric constant Er of 2.17–2.20) leverages a low fiberglass-to-PTFE ratio to achieve the minimum dielectric constant and dissipation factor among all fiberglass-reinforced PTFE laminates. Combined, these properties facilitate faster signal propagation speeds and elevated signal-to-noise ratios.

High Frequency CuClad 217 Copper Clad Laminate 0

Features & Benefits
-Cross-ply woven fiberglass structure, with alternating plies oriented at 90° to each other
-High PTFE-to-glass ratio
-Superior dielectric constant uniformity versus comparable non-woven fiberglass-reinforced laminates
-Electrical and mechanical isotropy in the XY plane
-Ultra-low signal loss
-Ideal for circuits sensitive to dielectric constant (Er) variations

Typical Applications
-Military electronics systems (including radars, electronic countermeasures (ECM), and electronic support measures (ESM))
-Microwave components (such as low-noise amplifiers (LNAs), filters, and couplers)

Properties Test Method Condition CuClad 217
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -160
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 2.3×10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4×10⁶
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus(kpsi) ASTM D-638 A, 23°C 275, 219
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6
Compressive Modulus(kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus(kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kv) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02

Coefficient of Thermal Expansion (ppm/°C)

- X Axis

- Y Axis

- Z Axis

IPC TM-650 2.4.24

Mettler 3000

Thermomechanical

Analyzer

0°C to 100°C 29
28
246
Thermal Conductivity ASTM E-1225 100°C 0.26

Outgassing - Total Mass Loss (%)

Collected Volatile Condensable Material (%)

Water Vapor Regain (%)

Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤10⁻⁶ torr

 

 

0.01

0.01

0.00

NO

Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets UL94-V0

 

High Frequency CuClad 217 Copper Clad Laminate 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)