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High Frequency CuClad 217 Copper Clad Laminate

High Frequency CuClad 217 Copper Clad Laminate

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
CuClad 217
Laminate Thickness:
0.25mm, 0.51mm, 0.79mm, 1.57mm
Laminate Size:
18"X12"(457X305mm); 18"X24"(457X610mm)
Copper Weight:
0.5OZ(0.018mm)1OZ(0.035mm)
Highlight:

High Frequency CuClad 217 laminate

,

Copper Clad Laminate with high frequency

,

CuClad 217 PCB material

Product Description

CuClad® laminates are composite materials composed of woven fiberglass and polytetrafluoroethylene (PTFE), engineered specifically for deployment as printed circuit board (PCB) substrates. By precisely regulating the fiberglass-to-PTFE ratio, CuClad laminates deliver a diversified product portfolio: ranging from variants with ultra-low dielectric constant and loss tangent to highly reinforced grades optimized for enhanced dimensional stability.


Compared with non-woven fiberglass-reinforced PTFE laminates of equivalent dielectric constants, the woven fiberglass reinforcement in CuClad products confers superior dimensional stability. The consistent, tightly controlled PTFE coating process applied to the fiberglass cloth enables Rogers to supply laminates with a broader spectrum of dielectric constant options, as well as improved dielectric constant uniformity relative to comparable non-woven fiberglass-reinforced alternatives. These performance attributes position CuClad as a preferred material solution for fabricating filters, couplers, and low-noise amplifiers.


A defining characteristic of CuClad laminates is their cross-ply construction: successive layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This unique design ensures true electrical and mechanical isotropy across the XY plane—a feature exclusive to CuClad laminates that no other woven or non-woven fiberglass-reinforced PTFE laminates on the market can match. For certain phased array antenna applications, designers have verified that this level of isotropy is a critical performance prerequisite.


CuClad 217 (with a dielectric constant Er of 2.17–2.20) leverages a low fiberglass-to-PTFE ratio to achieve the minimum dielectric constant and dissipation factor among all fiberglass-reinforced PTFE laminates. Combined, these properties facilitate faster signal propagation speeds and elevated signal-to-noise ratios.

High Frequency CuClad 217 Copper Clad Laminate 0

Features & Benefits
-Cross-ply woven fiberglass structure, with alternating plies oriented at 90° to each other
-High PTFE-to-glass ratio
-Superior dielectric constant uniformity versus comparable non-woven fiberglass-reinforced laminates
-Electrical and mechanical isotropy in the XY plane
-Ultra-low signal loss
-Ideal for circuits sensitive to dielectric constant (Er) variations

Typical Applications
-Military electronics systems (including radars, electronic countermeasures (ECM), and electronic support measures (ESM))
-Microwave components (such as low-noise amplifiers (LNAs), filters, and couplers)

Properties Test Method Condition CuClad 217
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -160
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 2.3×10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4×10⁶
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus(kpsi) ASTM D-638 A, 23°C 275, 219
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6
Compressive Modulus(kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus(kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kv) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02

Coefficient of Thermal Expansion (ppm/°C)

- X Axis

- Y Axis

- Z Axis

IPC TM-650 2.4.24

Mettler 3000

Thermomechanical

Analyzer

0°C to 100°C 29
28
246
Thermal Conductivity ASTM E-1225 100°C 0.26

Outgassing - Total Mass Loss (%)

Collected Volatile Condensable Material (%)

Water Vapor Regain (%)

Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤10⁻⁶ torr

 

 

0.01

0.01

0.00

NO

Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets UL94-V0

 

High Frequency CuClad 217 Copper Clad Laminate 1

products
PRODUCTS DETAILS
High Frequency CuClad 217 Copper Clad Laminate
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
CuClad 217
Laminate Thickness:
0.25mm, 0.51mm, 0.79mm, 1.57mm
Laminate Size:
18"X12"(457X305mm); 18"X24"(457X610mm)
Copper Weight:
0.5OZ(0.018mm)1OZ(0.035mm)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

High Frequency CuClad 217 laminate

,

Copper Clad Laminate with high frequency

,

CuClad 217 PCB material

Product Description

CuClad® laminates are composite materials composed of woven fiberglass and polytetrafluoroethylene (PTFE), engineered specifically for deployment as printed circuit board (PCB) substrates. By precisely regulating the fiberglass-to-PTFE ratio, CuClad laminates deliver a diversified product portfolio: ranging from variants with ultra-low dielectric constant and loss tangent to highly reinforced grades optimized for enhanced dimensional stability.


Compared with non-woven fiberglass-reinforced PTFE laminates of equivalent dielectric constants, the woven fiberglass reinforcement in CuClad products confers superior dimensional stability. The consistent, tightly controlled PTFE coating process applied to the fiberglass cloth enables Rogers to supply laminates with a broader spectrum of dielectric constant options, as well as improved dielectric constant uniformity relative to comparable non-woven fiberglass-reinforced alternatives. These performance attributes position CuClad as a preferred material solution for fabricating filters, couplers, and low-noise amplifiers.


A defining characteristic of CuClad laminates is their cross-ply construction: successive layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This unique design ensures true electrical and mechanical isotropy across the XY plane—a feature exclusive to CuClad laminates that no other woven or non-woven fiberglass-reinforced PTFE laminates on the market can match. For certain phased array antenna applications, designers have verified that this level of isotropy is a critical performance prerequisite.


CuClad 217 (with a dielectric constant Er of 2.17–2.20) leverages a low fiberglass-to-PTFE ratio to achieve the minimum dielectric constant and dissipation factor among all fiberglass-reinforced PTFE laminates. Combined, these properties facilitate faster signal propagation speeds and elevated signal-to-noise ratios.

High Frequency CuClad 217 Copper Clad Laminate 0

Features & Benefits
-Cross-ply woven fiberglass structure, with alternating plies oriented at 90° to each other
-High PTFE-to-glass ratio
-Superior dielectric constant uniformity versus comparable non-woven fiberglass-reinforced laminates
-Electrical and mechanical isotropy in the XY plane
-Ultra-low signal loss
-Ideal for circuits sensitive to dielectric constant (Er) variations

Typical Applications
-Military electronics systems (including radars, electronic countermeasures (ECM), and electronic support measures (ESM))
-Microwave components (such as low-noise amplifiers (LNAs), filters, and couplers)

Properties Test Method Condition CuClad 217
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -160
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 2.3×10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4×10⁶
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus(kpsi) ASTM D-638 A, 23°C 275, 219
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6
Compressive Modulus(kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus(kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kv) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02

Coefficient of Thermal Expansion (ppm/°C)

- X Axis

- Y Axis

- Z Axis

IPC TM-650 2.4.24

Mettler 3000

Thermomechanical

Analyzer

0°C to 100°C 29
28
246
Thermal Conductivity ASTM E-1225 100°C 0.26

Outgassing - Total Mass Loss (%)

Collected Volatile Condensable Material (%)

Water Vapor Regain (%)

Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤10⁻⁶ torr

 

 

0.01

0.01

0.00

NO

Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets UL94-V0

 

High Frequency CuClad 217 Copper Clad Laminate 1

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