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F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

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China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm
F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

Large Image :  F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

Description
Part Number: F4BM217 Laminate Thickness: 0.1mm-12mm
Laminate Size: 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm Copper Weight: 0.5OZ(0.018mm)1OZ(0.035mm)1.5OZ(0.05mm)2OZ(0.08mm)
Highlight:

F4BM217 Copper Clad Pcb Material

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460X610mm Copper Clad Pcb Material

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500X600mm copper clad laminates

Wangling's F4BM217 is a high-performance composite laminate engineered for advanced RF and microwave applications. It is manufactured through a precise formulation and lamination process, combining woven fiberglass cloth with PTFE resin and film to achieve superior and consistent electrical properties.

 

This next-generation material offers significant performance enhancements over its predecessor, F4B220, featuring lower dielectric loss, higher insulation resistance, and improved overall stability. F4BM217 serves as a reliable, high-quality domestic alternative to comparable imported laminates.

 

F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Utilizes standard Electrodeposited (ED) copper foil. This variant is a cost-effective solution for general high-frequency applications where Passive Intermodulation (PIM) is not a critical requirement.


F4BME217: Pairs the same dielectric with Reverse-Treated Foil (RTF) copper. This combination delivers excellent PIM performance, enables more precise line definition, and reduces conductor loss for demanding, high-precision circuits.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BM217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BM217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficient of Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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