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2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold

2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Wangling F4BM220
Layer Count:
2 Layers
PCB Thickness:
0.6mm
PCB Size:
51mm × 67mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Highlight:

F4BM220 PCB Immersion Gold

,

35um double layer board

,

Immersion Gold double layer board

Product Description

This 2-layer rigid double-sided PCB is specifically engineered for high-performance microwave, RF, and radar systems, utilizing Wangling F4BM220 laminate. It harnesses the material's superior electrical properties—low dielectric loss, high insulation resistance, and excellent performance stability—to satisfy the stringent requirements of high-frequency signal transmission.

 

PCB Specification

Parameter Details
Layer Count 2-Layer (double sided, rigid structure)
Base Material Wangling F4BM220 (laminate composed of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film)
Board Dimensions 51mm × 67mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 8 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; total vias: 17; via plating thickness: 20 μm
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Layer (Copper_layer_1) Copper 35 μm
Substrate Layer F4BM220 Core 0.5mm
Bottom Layer (Copper_layer_2) Copper 35 μm

 

F4BM220 Material Introduction

Wangling's F4BM220 laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B220, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

 

F4BM220 and F4BME220 have the same dielectric layer but different copper foil combinations: F4BM220 is paired with ED copper foil, suitable for applications without PIM requirements; F4BME220 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM220 and F4BME220 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.

 

2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 2.2 ± 0.04 at 10GHz
Dissipation Factor 0.001 at 10GHz
Coefficient of Thermal Expansion (CTE) X axis: 25 ppm/°C; Y axis: 34 ppm/°C; Z axis: 240 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -142 ppm/°C (-55°C to 150°C)
Moisture Absorption ≤0.08%
Flammability Rating UL-94 V0
Layer Structure 2-layer rigid construction with F4BM220 core and 35μm copper layers on both sides
Surface Finish Immersion gold, ensuring excellent solderability and corrosion resistance
Silkscreen & Solder Mask No silkscreen or solder mask on both layers, adapting to specific application requirements
Copper Foil Matching Paired with ED copper foil, suitable for applications without PIM requirements

 

Core Benefits

Precise Dielectric Constant Control: Achieved by adjusting the ratio of polytetrafluoroethylene and fiberglass cloth, balancing low loss and dimensional stability.

 

Enhanced Stability: Improved insulation resistance and stable performance compared to F4B220, with reliable operation in various environments.

 

Low Environmental Sensitivity: Moisture absorption ≤0.08%, minimizing performance degradation in humid conditions.

 

Cost-Effective Alternative: Can replace similar foreign products, offering excellent performance at a competitive cost.

 

Safe and Reliable: UL-94 V0 flammability rating meets strict safety standards for electronic applications.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent and reliable performance via strict manufacturing requirements.

Availability: Globally supplied with timely delivery and efficient after-sales support.

 

Typical Applications

-Microwave, RF, and Radar Systems

-Phase Shifters

-Power Dividers, Couplers, Combiners

-Feed Networks

-Phase-Sensitive Antennas, Phased Array Antennas

-Satellite Communications

-Base Station Antennas

 

Summary

The 2-layer rigid PCB with Wangling F4BM220 material is a high-performance solution tailored for microwave, RF, and radar applications. By combining the superior electrical performance (low dielectric loss, high insulation resistance) of F4BM220 with immersion gold surface finish and compliance with IPC-Class-2 standards, it effectively ensures stable high-frequency signal transmission and reliable operation. Its global availability and ability to replace similar foreign products make it a cost-effective and trusted choice for satellite communications, base station antennas, and various precision RF systems.

 

2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold 1

 

products
PRODUCTS DETAILS
2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Wangling F4BM220
Layer Count:
2 Layers
PCB Thickness:
0.6mm
PCB Size:
51mm × 67mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BM220 PCB Immersion Gold

,

35um double layer board

,

Immersion Gold double layer board

Product Description

This 2-layer rigid double-sided PCB is specifically engineered for high-performance microwave, RF, and radar systems, utilizing Wangling F4BM220 laminate. It harnesses the material's superior electrical properties—low dielectric loss, high insulation resistance, and excellent performance stability—to satisfy the stringent requirements of high-frequency signal transmission.

 

PCB Specification

Parameter Details
Layer Count 2-Layer (double sided, rigid structure)
Base Material Wangling F4BM220 (laminate composed of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film)
Board Dimensions 51mm × 67mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 8 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; total vias: 17; via plating thickness: 20 μm
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Layer (Copper_layer_1) Copper 35 μm
Substrate Layer F4BM220 Core 0.5mm
Bottom Layer (Copper_layer_2) Copper 35 μm

 

F4BM220 Material Introduction

Wangling's F4BM220 laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B220, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

 

F4BM220 and F4BME220 have the same dielectric layer but different copper foil combinations: F4BM220 is paired with ED copper foil, suitable for applications without PIM requirements; F4BME220 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM220 and F4BME220 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.

 

2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 2.2 ± 0.04 at 10GHz
Dissipation Factor 0.001 at 10GHz
Coefficient of Thermal Expansion (CTE) X axis: 25 ppm/°C; Y axis: 34 ppm/°C; Z axis: 240 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -142 ppm/°C (-55°C to 150°C)
Moisture Absorption ≤0.08%
Flammability Rating UL-94 V0
Layer Structure 2-layer rigid construction with F4BM220 core and 35μm copper layers on both sides
Surface Finish Immersion gold, ensuring excellent solderability and corrosion resistance
Silkscreen & Solder Mask No silkscreen or solder mask on both layers, adapting to specific application requirements
Copper Foil Matching Paired with ED copper foil, suitable for applications without PIM requirements

 

Core Benefits

Precise Dielectric Constant Control: Achieved by adjusting the ratio of polytetrafluoroethylene and fiberglass cloth, balancing low loss and dimensional stability.

 

Enhanced Stability: Improved insulation resistance and stable performance compared to F4B220, with reliable operation in various environments.

 

Low Environmental Sensitivity: Moisture absorption ≤0.08%, minimizing performance degradation in humid conditions.

 

Cost-Effective Alternative: Can replace similar foreign products, offering excellent performance at a competitive cost.

 

Safe and Reliable: UL-94 V0 flammability rating meets strict safety standards for electronic applications.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent and reliable performance via strict manufacturing requirements.

Availability: Globally supplied with timely delivery and efficient after-sales support.

 

Typical Applications

-Microwave, RF, and Radar Systems

-Phase Shifters

-Power Dividers, Couplers, Combiners

-Feed Networks

-Phase-Sensitive Antennas, Phased Array Antennas

-Satellite Communications

-Base Station Antennas

 

Summary

The 2-layer rigid PCB with Wangling F4BM220 material is a high-performance solution tailored for microwave, RF, and radar applications. By combining the superior electrical performance (low dielectric loss, high insulation resistance) of F4BM220 with immersion gold surface finish and compliance with IPC-Class-2 standards, it effectively ensures stable high-frequency signal transmission and reliable operation. Its global availability and ability to replace similar foreign products make it a cost-effective and trusted choice for satellite communications, base station antennas, and various precision RF systems.

 

2-Layer F4BM220 PCB 35um Copper Thickness Immersion Gold 1

 

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