logo
products
PRODUCTS DETAILS
Home > Products >
RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board

RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
RF-10
Layer Count:
2-layer
PCB Thickness:
0.75mm
PCB Size:
90mm × 70mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Highlight:

Circuit Board RF-10 PCB

,

1OZ RF-10 PCB

,

High Reliability RF-10 PCB

Product Description

Utilizing RF-10 copper clad laminate as the base material, this 2-layer rigid PCB is tailored for high-performance RF applications. RF-10 integrates ceramic filled PTFE and woven fiberglass, endowing the PCB with high dielectric constant, low dissipation factor, and excellent dimensional stability. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including microstrip patch antennas and GPS antenna systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material RF-10 (ceramic filled PTFE + woven fiberglass copper clad laminate)
Board Dimensions 90mm × 70mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 6 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 44; Via plating thickness: 20 μm
Finished Board Thickness 0.75mm
Finished Copper Weight 1oz (1.4 mils)
Surface Finish Immersion gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm (1oz)
Substrate Core RF-10 Core 0.635mm (25 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm (1oz)

 

RF-10 Material Introduction

RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 has the advantage of high dielectric constant and low dissipation factor. Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

 

RF-10 laminates are engineered to provide a cost effective substrate with industry acceptable delivery times. RF-10 responds to a need in RF applications for size reduction. RF-10 bonds well to smooth low profile copper. The low dissipation of RF-10 combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.

 

RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 10.2 ± 0.3 at 10GHz
Dissipation Factor 0.0025 at 10GHz
Thermal Conductivity 0.85 W/mk (Unclad)
Coefficient of Thermal Expansion (CTE) X axis: 16 ppm/°C; Y axis: 20 ppm/°C; Z axis: 25 ppm/°C
Moisture Absorption ≤0.08%
Flammability Rating V-0
Surface Finish Advantage Immersion gold ensures excellent solderability and corrosion resistance

 

Core Benefits

High Dk for RF Circuit Size Reduction: Dielectric constant of 10.2 ± 0.3 enables effective miniaturization of RF circuits.

 

Excellent Dimensional Stability: Thin woven fiberglass reinforcement enhances rigidity and dimensional stability, facilitating handling and multilayer circuit applications.

 

Tight Dk Tolerance: Strict control of dielectric constant (±0.3) ensures consistent performance across circuits.

 

Superior Thermal Management: High thermal conductivity (0.85 W/mk) improves heat dissipation efficiency.

 

Excellent Copper Adhesion: Bonds well to smooth low profile copper, optimizing insertion losses at higher frequencies.

 

Low Thermal Expansion: Low X, Y, Z axis CTE ensures stable performance under thermal cycling.

 

Excellent Price/Performance Ratio: Cost-effective substrate with industry-acceptable delivery times.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

Microstrip Patch Antennas

GPS Antennas

Passive Components (filters, couplers, power dividers)

Aircraft Collision Avoidance Systems

Satellite Components

 

RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board 1

products
PRODUCTS DETAILS
RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
RF-10
Layer Count:
2-layer
PCB Thickness:
0.75mm
PCB Size:
90mm × 70mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Circuit Board RF-10 PCB

,

1OZ RF-10 PCB

,

High Reliability RF-10 PCB

Product Description

Utilizing RF-10 copper clad laminate as the base material, this 2-layer rigid PCB is tailored for high-performance RF applications. RF-10 integrates ceramic filled PTFE and woven fiberglass, endowing the PCB with high dielectric constant, low dissipation factor, and excellent dimensional stability. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including microstrip patch antennas and GPS antenna systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material RF-10 (ceramic filled PTFE + woven fiberglass copper clad laminate)
Board Dimensions 90mm × 70mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 6 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 44; Via plating thickness: 20 μm
Finished Board Thickness 0.75mm
Finished Copper Weight 1oz (1.4 mils)
Surface Finish Immersion gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm (1oz)
Substrate Core RF-10 Core 0.635mm (25 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm (1oz)

 

RF-10 Material Introduction

RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 has the advantage of high dielectric constant and low dissipation factor. Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

 

RF-10 laminates are engineered to provide a cost effective substrate with industry acceptable delivery times. RF-10 responds to a need in RF applications for size reduction. RF-10 bonds well to smooth low profile copper. The low dissipation of RF-10 combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.

 

RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 10.2 ± 0.3 at 10GHz
Dissipation Factor 0.0025 at 10GHz
Thermal Conductivity 0.85 W/mk (Unclad)
Coefficient of Thermal Expansion (CTE) X axis: 16 ppm/°C; Y axis: 20 ppm/°C; Z axis: 25 ppm/°C
Moisture Absorption ≤0.08%
Flammability Rating V-0
Surface Finish Advantage Immersion gold ensures excellent solderability and corrosion resistance

 

Core Benefits

High Dk for RF Circuit Size Reduction: Dielectric constant of 10.2 ± 0.3 enables effective miniaturization of RF circuits.

 

Excellent Dimensional Stability: Thin woven fiberglass reinforcement enhances rigidity and dimensional stability, facilitating handling and multilayer circuit applications.

 

Tight Dk Tolerance: Strict control of dielectric constant (±0.3) ensures consistent performance across circuits.

 

Superior Thermal Management: High thermal conductivity (0.85 W/mk) improves heat dissipation efficiency.

 

Excellent Copper Adhesion: Bonds well to smooth low profile copper, optimizing insertion losses at higher frequencies.

 

Low Thermal Expansion: Low X, Y, Z axis CTE ensures stable performance under thermal cycling.

 

Excellent Price/Performance Ratio: Cost-effective substrate with industry-acceptable delivery times.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

Microstrip Patch Antennas

GPS Antennas

Passive Components (filters, couplers, power dividers)

Aircraft Collision Avoidance Systems

Satellite Components

 

RF-10 PCB 25mil Double-layer 1OZ High Reliability Circuit Board 1

sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.