This 2-layer rigid PCB adopts WL-CT350, a thermosetting resin-based high-frequency laminate composed of hydrocarbon resin, ceramics, and fiberglass cloth. Specifically engineered to meet rigorous high-frequency signal transmission requirements, it is highly applicable to base station antennas, automotive radar, and other precision RF systems.
PCB Specifications
| Parameter |
Details |
| Layer Count |
2-Layer (rigid structure) |
| Base Material |
WL-CT350 |
| Board Dimensions |
41.8mm × 51.35mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space |
5 mils (trace) / 7 mils (space) |
| Minimum Hole Size |
0.3mm |
| Vias |
No blind vias; Total vias: 29; Via plating thickness: 20 μm |
| Finished Board Thickness |
1.1mm |
| Finished Copper Weight |
1oz (1.4 mils) for outer layers |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Black silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask |
No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance |
100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name |
Material |
Thickness |
| Top Copper Layer (Copper_layer_1) |
Copper |
35 μm |
| Substrate Core |
WL-CT350 |
1.016mm (40 mil) |
| Bottom Copper Layer (Copper_layer_2) |
Copper |
35 μm |
WL-CT350 Material Introduction
Wangling's WL-CT350 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.
The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.
Key Material Features
| Feature |
Specification/Description |
| Material Composition |
WL-CT350 thermosetting resin-based laminate (hydrocarbon resin, ceramics, fiberglass cloth) |
| Dielectric Constant (Dk) |
3.48 at 10 GHz/23°C |
| Dissipation Factor |
0.0039 at 10 GHz |
| Temperature Coefficient of Dielectric Constant (TCDK) |
52 ppm/°C |
| Thermal Conductivity |
0.7 W/MK |
| Moisture Absorption |
0.05% |
| Coefficient of Thermal Expansion (CTE) |
X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 34 ppm/°C (matched to copper) |
| Glass Transition Temperature (Tg) |
>280 °C |
Core Benefits
Low Loss Performance: Meets high-frequency design requirements, ensuring efficient signal transmission.
Excellent Process Compatibility: Processed with FR4-like techniques, simpler than PTFE materials.
Superior Circuit Stability: Ensures better stability and consistency in circuitry.
High-Temperature Resistance: Excellent high-temperature resistance and temperature stability.
Stable Electrical Properties: Stable temperature coefficient of dielectric constant and loss.
Low Thermal Expansion: CTE matched to copper, reducing thermal stress.
Cost-Effective Substitute: Alternative to similar foreign high-frequency materials.
Low Environmental Sensitivity: 0.05% moisture absorption minimizes performance degradation.
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.
Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Base station antennas and satellite antennas
-Automotive radar, sensors, and navigation systems
-Power amplifiers
-Satellite high-frequency heads
-RF devices and filters
-WIMAX antennas and distributed antennas
Summary
This 2-layer rigid PCB based on WL-CT350 substrate is a high-performance, cost-effective solution tailored for high-frequency microwave and RF applications.As a reliable substitute for similar foreign products, with suitability for mature FR4-like processing and worldwide availability, this PCB serves as an optimal option for high-volume production of precision RF devices.
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