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WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper

WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
WL-CT350
Layer Count:
2-layer
PCB Thickness:
1.1mm
PCB Size:
41.8mm × 51.35mm
Silkscreen:
Black
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Highlight:

40mil PCB Wangling

,

2 Layer PCB Wangling

,

35um Copper PCB Wangling

Product Description

This 2-layer rigid PCB adopts WL-CT350, a thermosetting resin-based high-frequency laminate composed of hydrocarbon resin, ceramics, and fiberglass cloth. Specifically engineered to meet rigorous high-frequency signal transmission requirements, it is highly applicable to base station antennas, automotive radar, and other precision RF systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material WL-CT350
Board Dimensions 41.8mm × 51.35mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 7 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 29; Via plating thickness: 20 μm
Finished Board Thickness 1.1mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen Black silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core WL-CT350 1.016mm (40 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

WL-CT350 Material Introduction

Wangling's WL-CT350 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

 

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

 

WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper 0

 

Key Material Features

Feature Specification/Description
Material Composition WL-CT350 thermosetting resin-based laminate (hydrocarbon resin, ceramics, fiberglass cloth)
Dielectric Constant (Dk) 3.48 at 10 GHz/23°C
Dissipation Factor 0.0039 at 10 GHz
Temperature Coefficient of Dielectric Constant (TCDK) 52 ppm/°C
Thermal Conductivity 0.7 W/MK
Moisture Absorption 0.05%
Coefficient of Thermal Expansion (CTE) X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 34 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) >280 °C

 

Core Benefits

Low Loss Performance: Meets high-frequency design requirements, ensuring efficient signal transmission.

 

Excellent Process Compatibility: Processed with FR4-like techniques, simpler than PTFE materials.

 

Superior Circuit Stability: Ensures better stability and consistency in circuitry.

 

High-Temperature Resistance: Excellent high-temperature resistance and temperature stability.

 

Stable Electrical Properties: Stable temperature coefficient of dielectric constant and loss.

 

Low Thermal Expansion: CTE matched to copper, reducing thermal stress.

 

Cost-Effective Substitute: Alternative to similar foreign high-frequency materials.

 

Low Environmental Sensitivity: 0.05% moisture absorption minimizes performance degradation.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Base station antennas and satellite antennas

-Automotive radar, sensors, and navigation systems

-Power amplifiers

-Satellite high-frequency heads

-RF devices and filters

-WIMAX antennas and distributed antennas

 

Summary

This 2-layer rigid PCB based on WL-CT350 substrate is a high-performance, cost-effective solution tailored for high-frequency microwave and RF applications.As a reliable substitute for similar foreign products, with suitability for mature FR4-like processing and worldwide availability, this PCB serves as an optimal option for high-volume production of precision RF devices.

 

WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper 1

products
PRODUCTS DETAILS
WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
WL-CT350
Layer Count:
2-layer
PCB Thickness:
1.1mm
PCB Size:
41.8mm × 51.35mm
Silkscreen:
Black
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

40mil PCB Wangling

,

2 Layer PCB Wangling

,

35um Copper PCB Wangling

Product Description

This 2-layer rigid PCB adopts WL-CT350, a thermosetting resin-based high-frequency laminate composed of hydrocarbon resin, ceramics, and fiberglass cloth. Specifically engineered to meet rigorous high-frequency signal transmission requirements, it is highly applicable to base station antennas, automotive radar, and other precision RF systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material WL-CT350
Board Dimensions 41.8mm × 51.35mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 7 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 29; Via plating thickness: 20 μm
Finished Board Thickness 1.1mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen Black silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core WL-CT350 1.016mm (40 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

WL-CT350 Material Introduction

Wangling's WL-CT350 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

 

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

 

WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper 0

 

Key Material Features

Feature Specification/Description
Material Composition WL-CT350 thermosetting resin-based laminate (hydrocarbon resin, ceramics, fiberglass cloth)
Dielectric Constant (Dk) 3.48 at 10 GHz/23°C
Dissipation Factor 0.0039 at 10 GHz
Temperature Coefficient of Dielectric Constant (TCDK) 52 ppm/°C
Thermal Conductivity 0.7 W/MK
Moisture Absorption 0.05%
Coefficient of Thermal Expansion (CTE) X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 34 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) >280 °C

 

Core Benefits

Low Loss Performance: Meets high-frequency design requirements, ensuring efficient signal transmission.

 

Excellent Process Compatibility: Processed with FR4-like techniques, simpler than PTFE materials.

 

Superior Circuit Stability: Ensures better stability and consistency in circuitry.

 

High-Temperature Resistance: Excellent high-temperature resistance and temperature stability.

 

Stable Electrical Properties: Stable temperature coefficient of dielectric constant and loss.

 

Low Thermal Expansion: CTE matched to copper, reducing thermal stress.

 

Cost-Effective Substitute: Alternative to similar foreign high-frequency materials.

 

Low Environmental Sensitivity: 0.05% moisture absorption minimizes performance degradation.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Base station antennas and satellite antennas

-Automotive radar, sensors, and navigation systems

-Power amplifiers

-Satellite high-frequency heads

-RF devices and filters

-WIMAX antennas and distributed antennas

 

Summary

This 2-layer rigid PCB based on WL-CT350 substrate is a high-performance, cost-effective solution tailored for high-frequency microwave and RF applications.As a reliable substitute for similar foreign products, with suitability for mature FR4-like processing and worldwide availability, this PCB serves as an optimal option for high-volume production of precision RF devices.

 

WL-CT350 PCB Wangling 40mil Material 2-layer 35um Copper 1

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