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F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask

F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Wangling F4BTM350
Layer Count:
2-layer
PCB Thickness:
3.1mm
PCB Size:
328mm × 84.08mm
Silkscreen:
White
Solder Mask:
Black
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Highlight:

F4BTM350 PCB

,

Black Solder Mask PCB

,

120mil Substrate PCB

Product Description

This 2-layer rigid PCB is tailored for high-performance microwave, RF, and radar systems, utilizing Wangling F4BTM350 laminate as the base material. The F4BTM350 material integrates high-dielectric, low-loss nano-ceramics, endowing the PCB with superior electrical and thermal properties. This PCB reliably meets the stringent requirements of high-frequency signal transmission in precision RF applications such as satellite communications and base station antennas.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Wangling F4BTM350 (fiberglass cloth + nano-ceramic filling + polytetrafluoroethylene resin)
Board Dimensions 328mm × 84.08mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 7 mils (space)
Minimum Hole Size 0.4mm
Vias No blind vias; Total vias: 68; Via plating thickness: 20 μm
Finished Board Thickness 3.1mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion gold
Silkscreen White on top layer; No silkscreen on bottom layer
Solder Mask Black on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core F4BTM350 Core 3.048mm (120 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

F4BTM350 Material Introduction

Wangling's F4BTM350 laminates are manufactured through scientific formulation of fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. Based on the F4BM dielectric layer, this material incorporates high-dielectric, low-loss nano-ceramics, which significantly enhance its dielectric constant, heat resistance, insulation resistance, and thermal conductivity, while reducing the thermal expansion coefficient and retaining low-loss characteristics.

 

F4BTM350 and F4BTME350 share the same dielectric layer but differ in copper foil matching: F4BTM350 is paired with ED copper foil, suitable for applications without PIM requirements; F4BTME350 uses reverse-treated (RTF) copper foil, providing excellent PIM performance, more precise line control, and lower conductor loss.

 

F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 3.5 ± 0.07 at 10GHz
Dissipation Factor 0.0025 at 10GHz
Coefficient of Thermal Expansion (CTE) X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 51 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -60 ppm/°C (-55°C to 150°C)
Moisture Absorption ≤0.05%
Flammability Rating UL-94 V0
Comparative Tracking Index (CTI) >600V, Grade 0
Copper Foil Matching Paired with ED copper foil (suitable for non-PIM applications)
Surface Finish Advantage Immersion gold ensures excellent solderability and corrosion resistance

 

Core Benefits

Superior High-Frequency Performance: High Dk (3.5±0.07) and low dissipation factor (0.0025 at 10GHz) ensure stable and efficient high-frequency signal transmission.

 

Excellent Thermal Stability: Low CTE (X:10 ppm/°C, Y:12 ppm/°C) and excellent heat resistance guarantee dimensional stability under thermal cycling.

 

High Insulation Reliability: CTI >600V (Grade 0) and high insulation resistance enable safe operation in harsh electrical environments.

 

Low Environmental Sensitivity: Moisture absorption ≤0.05% minimizes performance degradation in humid conditions.

 

Safe & Compliant: UL-94 V0 flammability rating and IPC-Class-2 compliance meet strict industry safety and quality standards.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

Microwave, RF, and Radar Systems

Phase Shifters

Power Dividers, Couplers, Combiners

Feed Networks

Phase-Sensitive Antennas, Phased Array Antennas

Satellite Communications

Base Station Antennas

 

Summary

Wangling F4BTM350 PCB is a high-performance, reliable solution tailored for precision RF applications. By virtue of the material's excellent electrical-thermal properties, strict quality control, and global supply capability, it effectively meets the demanding requirements of high-frequency signal transmission in microwave, satellite communication, and base station fields, providing customers with a cost-effective and trustworthy PCB option.

 

F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask 1

products
PRODUCTS DETAILS
F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Wangling F4BTM350
Layer Count:
2-layer
PCB Thickness:
3.1mm
PCB Size:
328mm × 84.08mm
Silkscreen:
White
Solder Mask:
Black
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BTM350 PCB

,

Black Solder Mask PCB

,

120mil Substrate PCB

Product Description

This 2-layer rigid PCB is tailored for high-performance microwave, RF, and radar systems, utilizing Wangling F4BTM350 laminate as the base material. The F4BTM350 material integrates high-dielectric, low-loss nano-ceramics, endowing the PCB with superior electrical and thermal properties. This PCB reliably meets the stringent requirements of high-frequency signal transmission in precision RF applications such as satellite communications and base station antennas.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Wangling F4BTM350 (fiberglass cloth + nano-ceramic filling + polytetrafluoroethylene resin)
Board Dimensions 328mm × 84.08mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 7 mils (space)
Minimum Hole Size 0.4mm
Vias No blind vias; Total vias: 68; Via plating thickness: 20 μm
Finished Board Thickness 3.1mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion gold
Silkscreen White on top layer; No silkscreen on bottom layer
Solder Mask Black on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core F4BTM350 Core 3.048mm (120 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

F4BTM350 Material Introduction

Wangling's F4BTM350 laminates are manufactured through scientific formulation of fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. Based on the F4BM dielectric layer, this material incorporates high-dielectric, low-loss nano-ceramics, which significantly enhance its dielectric constant, heat resistance, insulation resistance, and thermal conductivity, while reducing the thermal expansion coefficient and retaining low-loss characteristics.

 

F4BTM350 and F4BTME350 share the same dielectric layer but differ in copper foil matching: F4BTM350 is paired with ED copper foil, suitable for applications without PIM requirements; F4BTME350 uses reverse-treated (RTF) copper foil, providing excellent PIM performance, more precise line control, and lower conductor loss.

 

F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 3.5 ± 0.07 at 10GHz
Dissipation Factor 0.0025 at 10GHz
Coefficient of Thermal Expansion (CTE) X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 51 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -60 ppm/°C (-55°C to 150°C)
Moisture Absorption ≤0.05%
Flammability Rating UL-94 V0
Comparative Tracking Index (CTI) >600V, Grade 0
Copper Foil Matching Paired with ED copper foil (suitable for non-PIM applications)
Surface Finish Advantage Immersion gold ensures excellent solderability and corrosion resistance

 

Core Benefits

Superior High-Frequency Performance: High Dk (3.5±0.07) and low dissipation factor (0.0025 at 10GHz) ensure stable and efficient high-frequency signal transmission.

 

Excellent Thermal Stability: Low CTE (X:10 ppm/°C, Y:12 ppm/°C) and excellent heat resistance guarantee dimensional stability under thermal cycling.

 

High Insulation Reliability: CTI >600V (Grade 0) and high insulation resistance enable safe operation in harsh electrical environments.

 

Low Environmental Sensitivity: Moisture absorption ≤0.05% minimizes performance degradation in humid conditions.

 

Safe & Compliant: UL-94 V0 flammability rating and IPC-Class-2 compliance meet strict industry safety and quality standards.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

Microwave, RF, and Radar Systems

Phase Shifters

Power Dividers, Couplers, Combiners

Feed Networks

Phase-Sensitive Antennas, Phased Array Antennas

Satellite Communications

Base Station Antennas

 

Summary

Wangling F4BTM350 PCB is a high-performance, reliable solution tailored for precision RF applications. By virtue of the material's excellent electrical-thermal properties, strict quality control, and global supply capability, it effectively meets the demanding requirements of high-frequency signal transmission in microwave, satellite communication, and base station fields, providing customers with a cost-effective and trustworthy PCB option.

 

F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask 1

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