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Product Details:
Payment & Shipping Terms:
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| Material: | F4BM220 | Layer Count: | 2-layer |
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| PCB Size: | 45mm X 62 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 1 Mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Tin |
| Highlight: | Immersion Tin PCB,1mm PCB,Green Soldermask PCB |
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Wangling's F4BM220 laminates represent a cutting-edge advancement in PCB technology. Crafted with a meticulous blend of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film, the F4BM220 sets a new standard for electrical performance and stability. With enhanced insulation resistance and reduced dielectric loss, this PCB outshines its predecessor, the F4B220, and is a competitive alternative to foreign products in the market.
Key Features:
Dielectric Constant (Dk): 2.2 at 10GHz
Dissipation Factor: 0.001 at 10GHz
Coefficient of Thermal Expansion (CTE): x-axis 25 ppm/°C, y-axis 34 ppm/°C, z-axis 240 ppm/°C (-55°C to 288°C)
Low Thermal Coefficient of Dk: -142 ppm/°C (-55°C to 150°C)
Moisture Absorption: ≤0.08%
Flammability: UL-94 V0
| PCB Capability (F4BM) | |||
| PCB Material: | PTFE glass fiber cloth copper clad laminates | ||
| Designation (F4BM ) | F4BM | DK (10GHz) | DF (10 GHz) |
| F4BM217 | 2.17±0.04 | 0.0010 | |
| F4BM220 | 2.20±0.04 | 0.0010 | |
| F4BM233 | 2.33±0.04 | 0.0011 | |
| F4BM245 | 2.45±0.05 | 0.0012 | |
| F4BM255 | 2.55±0.05 | 0.0013 | |
| F4BM265 | 2.65±0.05 | 0.0013 | |
| F4BM275 | 2.75±0.05 | 0.0015 | |
| F4BM294 | 2.94±0.06 | 0.0016 | |
| F4BM300 | 3.00±0.06 | 0.0017 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
This PCB stackup comprises two copper layers with a thickness of 35 μm each, separated by a 1.00 mm F4BM220 core. The board dimensions are precisely set at 45mm x 62mm with a tolerance of ±0.15mm, suitable for various compact applications. The minimum trace/spacing requirements are 4/7 mils, with a minimum hole size of 0.3mm, facilitating intricate circuit designs.
A finished board thickness of 1.1mm, a copper weight of 1oz (1.4 mils) on outer layers, and a 20 μm via plating thickness contribute to this PCB's robust construction. The surface finish is achieved with immersion tin, while the top solder mask is green, and the top silkscreen is white. Prior to shipment, each PCB undergoes 100% electrical testing to ensure quality and reliability.
Supplied in Gerber RS-274-X format and adhering to IPC-Class-2 quality standards, the F4BM220 2-layer rigid PCB is available worldwide.
Typical Applications:
Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, combiners
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
Base station antennas
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
