| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency electronic systems.
PCB Details
| Item | Specification |
| Base material | RT/duroid 6002 |
| Layer count | 2 layers |
| Board dimensions | 156mm x 87.9mm (per piece) |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.3mm |
| Blind vias | None |
| Finished board thickness | 0.8mm |
| Finished Cu weight (outer layers) | 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Silver |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical test | 100% electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Layer Type | Specification |
| Copper_layer_1 | 35 μm |
| Rogers RT/duroid 6002 Substrate | 30mil (0.762mm) |
| Copper_layer_2 | 35 μm |
![]()
Artwork and Quality Standard
The artwork format provided for this PCB is Gerber RS-274-X, a globally accepted industry standard for PCB manufacturing. In addition, the PCB complies with the IPC-Class-2 standard, which sets strict guidelines for performance and reliability, ensuring the product meets the operational requirements of commercial and industrial applications.
Availability
This high-performance PCB can be shipped to any country around the world. It caters to both prototyping requirements and large-volume production orders, ensuring global accessibility for all customers.
Introduction of RT/duroid 6002
Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.
Benefits of RT/duroid 6002
Typical Applications
![]()
RT/duroid 6002 – High Frequency Laminates
RT/duroid 6002 microwave material was the first low-loss, low-dielectric-constant laminate to offer the superior electrical and mechanical properties essential for designing complex microwave structures that are both mechanically reliable and electrically stable.
The material features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required in today's demanding applications.
A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have been successfully temperature cycled from -55°C to 125°C (-67°F to 257°F) for over 5,000 cycles without a single via failure.
Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y axis coefficients of expansion to that of copper. This often eliminates the need for double etching to achieve tight positional tolerances.
The low tensile modulus in the X and Y axes greatly reduces stress applied to solder joints and allows the laminate's expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.
Dielectric thicknesses from 0.005 inches to 0.125 inches (0.13 to 3.18 mm) are available, with cladding options including 0.5 oz/ft² to 2 oz/ft² electrodeposited copper, 0.5 oz/ft² to 1 oz/ft² reverse-treated electrodeposited copper, or 0.5 oz/ft² to 2 oz/ft² rolled copper. RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates, as well as resistive foils.
Applications particularly well-suited to the unique properties of RT/duroid 6002 include flat and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs operating in harsh environments. RT/duroid 6002 laminates are UL recognized under classification 94V-0 (Vertical Flammability Test).
|
Dielectric Constant, εr Process |
2.94 ± 0.04 | Z | - | 10GHz/23°C | IPC-TM-650, 2.5.5.5 |
| [2]Dielectric Constant, εr Design | 2.94 | 8GHz-40GHz |
Differential Phase Length Method |
||
| Dissipation Factor, TAN δ | 0.0012 | Z | - | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | +12 | Z | ppm/°C |
10 GHz 0-100°C |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm cm | A | ASTM D257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D257 |
| Tensile Modulus | 828 (120) | X,Y | MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Stress | 6.9 (1.0) | X,Y | MPa (kpsi) | ||
| Ultimate Strain | 7.3 | X,Y | % | ||
| Compressive Modulus | 2482 (360) | Z | MPa (kpsi) | ASTM D638 | |
| Moisture Absorption | 0.02 | - | % | D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.60 | - | W/m/K | 80°C | ASTM C518 |
|
Coefficient of Thermal Expansion (-55 to 288 °C) |
16 16 24 |
X Y Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
| Td | 500 | °CTGA | ASTM D3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D792 | ||
| Specific Heat | 0.93 (0.22) | - | J/g/K (BTU/lb/°F) | - | Calculated |
| Copper Peel | 8.9 (1.6) | lbs/in (N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-O | UL94 | |||
| Lead-Free Process Compatible | YES |
| Standard Thicknesses Standard Panel Sizes Standard Claddings | ||
|
0.010” (0.252mm) +/- 0.0007” 0.020” (0.508mm) +/- 0.0010” 0.030” (0.762mm) +/- 0.0010” 0.060” (1.524mm) +/- 0.0020”
|
18”X 12”(457mm X 305mm) 18”X 24”(457mm X 610mm)
|
Electrodeposited Copper Foil ½ oz. (18µm) HH/HH 1 oz. (35µm) H1/H1 Rolled Copper Foil ½ oz. (18µm) AH/AH 1 oz. (35µm) A1/A1
|
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency electronic systems.
PCB Details
| Item | Specification |
| Base material | RT/duroid 6002 |
| Layer count | 2 layers |
| Board dimensions | 156mm x 87.9mm (per piece) |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.3mm |
| Blind vias | None |
| Finished board thickness | 0.8mm |
| Finished Cu weight (outer layers) | 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Silver |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical test | 100% electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Layer Type | Specification |
| Copper_layer_1 | 35 μm |
| Rogers RT/duroid 6002 Substrate | 30mil (0.762mm) |
| Copper_layer_2 | 35 μm |
![]()
Artwork and Quality Standard
The artwork format provided for this PCB is Gerber RS-274-X, a globally accepted industry standard for PCB manufacturing. In addition, the PCB complies with the IPC-Class-2 standard, which sets strict guidelines for performance and reliability, ensuring the product meets the operational requirements of commercial and industrial applications.
Availability
This high-performance PCB can be shipped to any country around the world. It caters to both prototyping requirements and large-volume production orders, ensuring global accessibility for all customers.
Introduction of RT/duroid 6002
Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.
Benefits of RT/duroid 6002
Typical Applications
![]()
RT/duroid 6002 – High Frequency Laminates
RT/duroid 6002 microwave material was the first low-loss, low-dielectric-constant laminate to offer the superior electrical and mechanical properties essential for designing complex microwave structures that are both mechanically reliable and electrically stable.
The material features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required in today's demanding applications.
A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have been successfully temperature cycled from -55°C to 125°C (-67°F to 257°F) for over 5,000 cycles without a single via failure.
Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y axis coefficients of expansion to that of copper. This often eliminates the need for double etching to achieve tight positional tolerances.
The low tensile modulus in the X and Y axes greatly reduces stress applied to solder joints and allows the laminate's expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.
Dielectric thicknesses from 0.005 inches to 0.125 inches (0.13 to 3.18 mm) are available, with cladding options including 0.5 oz/ft² to 2 oz/ft² electrodeposited copper, 0.5 oz/ft² to 1 oz/ft² reverse-treated electrodeposited copper, or 0.5 oz/ft² to 2 oz/ft² rolled copper. RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates, as well as resistive foils.
Applications particularly well-suited to the unique properties of RT/duroid 6002 include flat and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs operating in harsh environments. RT/duroid 6002 laminates are UL recognized under classification 94V-0 (Vertical Flammability Test).
|
Dielectric Constant, εr Process |
2.94 ± 0.04 | Z | - | 10GHz/23°C | IPC-TM-650, 2.5.5.5 |
| [2]Dielectric Constant, εr Design | 2.94 | 8GHz-40GHz |
Differential Phase Length Method |
||
| Dissipation Factor, TAN δ | 0.0012 | Z | - | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | +12 | Z | ppm/°C |
10 GHz 0-100°C |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm cm | A | ASTM D257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D257 |
| Tensile Modulus | 828 (120) | X,Y | MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Stress | 6.9 (1.0) | X,Y | MPa (kpsi) | ||
| Ultimate Strain | 7.3 | X,Y | % | ||
| Compressive Modulus | 2482 (360) | Z | MPa (kpsi) | ASTM D638 | |
| Moisture Absorption | 0.02 | - | % | D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.60 | - | W/m/K | 80°C | ASTM C518 |
|
Coefficient of Thermal Expansion (-55 to 288 °C) |
16 16 24 |
X Y Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
| Td | 500 | °CTGA | ASTM D3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D792 | ||
| Specific Heat | 0.93 (0.22) | - | J/g/K (BTU/lb/°F) | - | Calculated |
| Copper Peel | 8.9 (1.6) | lbs/in (N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-O | UL94 | |||
| Lead-Free Process Compatible | YES |
| Standard Thicknesses Standard Panel Sizes Standard Claddings | ||
|
0.010” (0.252mm) +/- 0.0007” 0.020” (0.508mm) +/- 0.0010” 0.030” (0.762mm) +/- 0.0010” 0.060” (1.524mm) +/- 0.0020”
|
18”X 12”(457mm X 305mm) 18”X 24”(457mm X 610mm)
|
Electrodeposited Copper Foil ½ oz. (18µm) HH/HH 1 oz. (35µm) H1/H1 Rolled Copper Foil ½ oz. (18µm) AH/AH 1 oz. (35µm) A1/A1
|