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RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RT/duroid 6002
Layer Count:
2-layer
PCB Thickness:
0.8mm
PCB Size:
156mm X 87.9mm (per Piece)
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Highlight:

F4BM255 high frequency PCB laminate

,

copper clad sheet for PCBs

,

high frequency copper clad laminate

Product Description

This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency electronic systems.

 

PCB Details

Item Specification
Base material RT/duroid 6002
Layer count 2 layers
Board dimensions 156mm x 87.9mm (per piece)
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.3mm
Blind vias None
Finished board thickness 0.8mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish Immersion Silver
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
Rogers RT/duroid 6002 Substrate 30mil (0.762mm)
Copper_layer_2 35 μm

 

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 0

 

Artwork and Quality Standard

The artwork format provided for this PCB is Gerber RS-274-X, a globally accepted industry standard for PCB manufacturing. In addition, the PCB complies with the IPC-Class-2 standard, which sets strict guidelines for performance and reliability, ensuring the product meets the operational requirements of commercial and industrial applications.

 

Availability

This high-performance PCB can be shipped to any country around the world. It caters to both prototyping requirements and large-volume production orders, ensuring global accessibility for all customers.

 

Introduction of RT/duroid 6002

Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.

 

Benefits of RT/duroid 6002

  • Low loss for excellent high frequency performance
  • Tight thickness control
  • In-plane expansion coefficient matched to copper; Ideal for applications sensitive to temperature change
  • Low out-gassing; Ideal for space applications
  • Excellent dimensional stability
  • Excellent mechanical and electrical properties; Reliable multi-layer board constructions

 

Typical Applications

  • Phased Array Antennas
  • Ground Based and Airborne Radar Systems
  • Global Positioning System Antennas
  • Power Backplanes
  • Commercial Airline Collision Avoidance
  • Beam Forming Networks

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 1

 

RT/duroid 6002 – High Frequency Laminates

RT/duroid 6002 microwave material was the first low-loss, low-dielectric-constant laminate to offer the superior electrical and mechanical properties essential for designing complex microwave structures that are both mechanically reliable and electrically stable.

 

The material features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required in today's demanding applications.

 

A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have been successfully temperature cycled from -55°C to 125°C (-67°F to 257°F) for over 5,000 cycles without a single via failure.

 

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y axis coefficients of expansion to that of copper. This often eliminates the need for double etching to achieve tight positional tolerances.

 

The low tensile modulus in the X and Y axes greatly reduces stress applied to solder joints and allows the laminate's expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.

 

Dielectric thicknesses from 0.005 inches to 0.125 inches (0.13 to 3.18 mm) are available, with cladding options including 0.5 oz/ft² to 2 oz/ft² electrodeposited copper, 0.5 oz/ft² to 1 oz/ft² reverse-treated electrodeposited copper, or 0.5 oz/ft² to 2 oz/ft² rolled copper. RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates, as well as resistive foils.

 

Applications particularly well-suited to the unique properties of RT/duroid 6002 include flat and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs operating in harsh environments. RT/duroid 6002 laminates are UL recognized under classification 94V-0 (Vertical Flammability Test).

 

Dielectric Constant, εr

Process

2.94 ± 0.04 Z - 10GHz/23°C IPC-TM-650, 2.5.5.5
[2]Dielectric Constant, εr Design 2.94     8GHz-40GHz

Differential Phase Length

Method

Dissipation Factor, TAN δ 0.0012 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +12 Z ppm/°C

10 GHz

0-100°C

IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 107 Z Mohm A ASTM D257
Tensile Modulus 828 (120) X,Y MPa (kpsi)

 

23°C

 

ASTM D638

Ultimate Stress 6.9 (1.0) X,Y MPa (kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482 (360) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.02 - % D48/50

IPC-TM-650, 2.6.2.1

ASTM D570

Thermal Conductivity 0.60 - W/m/K 80°C ASTM C518

Coefficient of

Thermal Expansion (-55 to 288 °C)

16

16

24

X

Y

Z

 

ppm/°C

 

23°C/50% RH

IPC-TM-650 2.4.41
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 8.9 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL94
Lead-Free Process Compatible YES        
 
Standard Thicknesses Standard Panel Sizes Standard Claddings

0.010” (0.252mm) +/- 0.0007”

0.020” (0.508mm) +/- 0.0010”

0.030” (0.762mm) +/- 0.0010”

0.060” (1.524mm) +/- 0.0020”

 

 

 

18”X 12”(457mm X 305mm)

18”X 24”(457mm X 610mm)

 

 

 

 

Electrodeposited Copper Foil ½ oz. (18µm) HH/HH

1 oz. (35µm) H1/H1

Rolled Copper Foil

½ oz. (18µm) AH/AH

1 oz. (35µm) A1/A1

 

 

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 2 

Products
PRODUCTS DETAILS
RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RT/duroid 6002
Layer Count:
2-layer
PCB Thickness:
0.8mm
PCB Size:
156mm X 87.9mm (per Piece)
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BM255 high frequency PCB laminate

,

copper clad sheet for PCBs

,

high frequency copper clad laminate

Product Description

This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency electronic systems.

 

PCB Details

Item Specification
Base material RT/duroid 6002
Layer count 2 layers
Board dimensions 156mm x 87.9mm (per piece)
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.3mm
Blind vias None
Finished board thickness 0.8mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish Immersion Silver
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
Rogers RT/duroid 6002 Substrate 30mil (0.762mm)
Copper_layer_2 35 μm

 

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 0

 

Artwork and Quality Standard

The artwork format provided for this PCB is Gerber RS-274-X, a globally accepted industry standard for PCB manufacturing. In addition, the PCB complies with the IPC-Class-2 standard, which sets strict guidelines for performance and reliability, ensuring the product meets the operational requirements of commercial and industrial applications.

 

Availability

This high-performance PCB can be shipped to any country around the world. It caters to both prototyping requirements and large-volume production orders, ensuring global accessibility for all customers.

 

Introduction of RT/duroid 6002

Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.

 

Benefits of RT/duroid 6002

  • Low loss for excellent high frequency performance
  • Tight thickness control
  • In-plane expansion coefficient matched to copper; Ideal for applications sensitive to temperature change
  • Low out-gassing; Ideal for space applications
  • Excellent dimensional stability
  • Excellent mechanical and electrical properties; Reliable multi-layer board constructions

 

Typical Applications

  • Phased Array Antennas
  • Ground Based and Airborne Radar Systems
  • Global Positioning System Antennas
  • Power Backplanes
  • Commercial Airline Collision Avoidance
  • Beam Forming Networks

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 1

 

RT/duroid 6002 – High Frequency Laminates

RT/duroid 6002 microwave material was the first low-loss, low-dielectric-constant laminate to offer the superior electrical and mechanical properties essential for designing complex microwave structures that are both mechanically reliable and electrically stable.

 

The material features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required in today's demanding applications.

 

A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have been successfully temperature cycled from -55°C to 125°C (-67°F to 257°F) for over 5,000 cycles without a single via failure.

 

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y axis coefficients of expansion to that of copper. This often eliminates the need for double etching to achieve tight positional tolerances.

 

The low tensile modulus in the X and Y axes greatly reduces stress applied to solder joints and allows the laminate's expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.

 

Dielectric thicknesses from 0.005 inches to 0.125 inches (0.13 to 3.18 mm) are available, with cladding options including 0.5 oz/ft² to 2 oz/ft² electrodeposited copper, 0.5 oz/ft² to 1 oz/ft² reverse-treated electrodeposited copper, or 0.5 oz/ft² to 2 oz/ft² rolled copper. RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates, as well as resistive foils.

 

Applications particularly well-suited to the unique properties of RT/duroid 6002 include flat and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs operating in harsh environments. RT/duroid 6002 laminates are UL recognized under classification 94V-0 (Vertical Flammability Test).

 

Dielectric Constant, εr

Process

2.94 ± 0.04 Z - 10GHz/23°C IPC-TM-650, 2.5.5.5
[2]Dielectric Constant, εr Design 2.94     8GHz-40GHz

Differential Phase Length

Method

Dissipation Factor, TAN δ 0.0012 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +12 Z ppm/°C

10 GHz

0-100°C

IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 107 Z Mohm A ASTM D257
Tensile Modulus 828 (120) X,Y MPa (kpsi)

 

23°C

 

ASTM D638

Ultimate Stress 6.9 (1.0) X,Y MPa (kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482 (360) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.02 - % D48/50

IPC-TM-650, 2.6.2.1

ASTM D570

Thermal Conductivity 0.60 - W/m/K 80°C ASTM C518

Coefficient of

Thermal Expansion (-55 to 288 °C)

16

16

24

X

Y

Z

 

ppm/°C

 

23°C/50% RH

IPC-TM-650 2.4.41
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 8.9 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL94
Lead-Free Process Compatible YES        
 
Standard Thicknesses Standard Panel Sizes Standard Claddings

0.010” (0.252mm) +/- 0.0007”

0.020” (0.508mm) +/- 0.0010”

0.030” (0.762mm) +/- 0.0010”

0.060” (1.524mm) +/- 0.0020”

 

 

 

18”X 12”(457mm X 305mm)

18”X 24”(457mm X 610mm)

 

 

 

 

Electrodeposited Copper Foil ½ oz. (18µm) HH/HH

1 oz. (35µm) H1/H1

Rolled Copper Foil

½ oz. (18µm) AH/AH

1 oz. (35µm) A1/A1

 

 

RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver 2 

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