Double-Sided TMM13i PCB 150mil Rogers Laminate High Frequency Circuits

This PCB is a high-precision, double-sided rigid printed circuit board expertly fabricated using Rogers TMM13i, an advanced isotropic thermoset microwave material. Engineered for exceptional reliability in high-frequency applications, TMM13i combines the superior dielectric properties of ceramic with the processing flexibility of PTFE substrates, delivering consistent performance across extreme operational conditions. With a finished board thickness of 3.9mm, 1oz (35μm) copper cladding on both outer layers, and OSP (Organic Solderability Preservative) surface finish, this PCB ensures optimal electrical integrity, mechanical stability, and long-term durability for demanding microwave and radio frequency (RF) systems.

PCB Details

PCB Stack-up

This 2-layer rigid PCB utilizes a robust, symmetric stackup structure optimized for high-frequency performance (from top to bottom):

Artwork and Quality Standard

The Gerber RS-274‑X format, recognized worldwide as the industry standard for PCB artwork, is used throughout the fabrication process. This choice guarantees smooth integration with leading design software and production equipment, ensuring that digital circuit layouts are faithfully transformed into physical boards. Moreover, the PCB meets all requirements of the IPC‑Class‑2 quality standard, which sets demanding criteria for quality, reliability, and performance – confirming its readiness for commercial and industrial electronic systems.

Availability

This high‑performance PCB can be shipped to any destination around the world. Whether customers require quick‑turn prototypes or high‑volume production runs, the product is accessible globally and supported by timely delivery to all regions.

Substrate Material Introduction: Rogers TMM13i

Rogers TMM13i is an isotropic thermoset microwave material specifically formulated for high-reliability applications in plated thru-hole stripline and microstrip circuits. As a ceramic-filled thermoset polymer composite, it synergistically combines the superior dielectric performance of ceramic substrates with the processing convenience inherent to PTFE-based materials. Its isotropic dielectric constant ensures consistent electrical behavior across all axes, while its thermoset resin structure provides exceptional mechanical stability and resistance to creep and cold flow. The material is compatible with standard PTFE woven fiberglass fabrication processes, including shearing, drilling, and plating, and requires no pre-treatment with sodium napthanate for electroless plating, facilitating streamlined manufacturing workflows.

Core Benefits of TMM13i

The unique properties of TMM131 translate into decisive advantages for high-performance PCB applications:

• Superior Mechanical Stability: Resists creep and cold flow, maintaining precise circuit geometry over time and under extreme thermal conditions.
• Chemical Resistance: Withstands fabrication process chemicals, minimizing damage and ensuring consistent quality during manufacturing.
• Simplified Processing: Eliminates the need for sodium napthanate treatment prior to electroless plating, streamlining production workflows and reducing costs.
• Reliable Wire-Bonding: Its thermoset resin structure provides strong, stable bonds for wire-bonding applications, critical for high-reliability RF and microwave circuits.
• Broad Temperature Stability: Copper-matched CTE ensures minimal stress from thermal cycling, making it suitable for applications ranging from cryogenic temperatures to high-temperature soldering.

Typical Applications

Thanks to its high dielectric constant, low loss, and exceptional reliability, this TMM13i-based PCB is ideally suited for critical and high-performance applications in the following fields:

• High-Frequency RF & Microwave Circuits
• Chip Testers & Test Fixtures
• Dielectric Polarizers & Lenses
• RF Filters & Couplers
• Satellite Communication Systems & Terminals

TMM13i – High Frequency Materials

TMM thermoset microwave materials are ceramic, hydrocarbon, and thermoset polymer composites specifically engineered for stripline and microstrip applications that demand high plated through-hole (PTH) reliability. These laminates are offered in a wide variety of dielectric constants and cladding options.

By combining the electrical and mechanical advantages of both ceramic and conventional PTFE microwave circuit laminates, TMM materials eliminate the need for the specialized production techniques typically associated with such products. Notably, TMM laminates do not require sodium naphthanate treatment before electroless plating.

TMM laminates feature an exceptionally low thermal coefficient of dielectric constant, typically below 30 ppm/°C. Their isotropic coefficients of thermal expansion, closely matched to those of copper, enable the production of highly reliable plated through-holes and low etch shrinkage values. In addition, the thermal conductivity of TMM laminates is roughly twice that of traditional PTFE/ceramic laminates, promoting efficient heat dissipation.

As TMM laminates are based on thermoset resins, they do not soften upon heating. Consequently, wire bonding of component leads to circuit traces can be performed without concern for pad lifting or substrate deformation.

TMM laminates successfully merge the desirable characteristics of ceramic substrates with the processing ease of soft substrates. They are available clad with 0.5 oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses range from 0.015 inches to 0.500 inches. The base substrate resists etchants and solvents commonly used in printed circuit production, allowing all standard PWB processes to be employed in manufacturing TMM thermoset microwave materials.