TF600 PCB 2-layer 25mil High-Frequency Substrate with Copper-filled

This 2-layer rigid PCB is fabricated from TF600, a thermosetting high-frequency laminate composed of modified PTFE resin and micron-sized ceramic fillers. It features 0.7mm finished thickness, 1 oz (1.4 mils) outer copper cladding, ENIG surface finish, and copper-filled vias on specified IC pads, ensuring superior signal integrity, thermal stability, and long-term reliability for high-frequency systems.

PCB Specifications

PCB Stack-Up Configuration

This 2-layer rigid PCB features a symmetric stack-up structure, with detailed layer specifications outlined below (ordered from top to bottom):

Artwork Format and Quality Compliance

The Gerber RS-274-X format is formally designated as the artwork standard for this PCB, ensuring seamless compatibility with professional PCB design software and automated manufacturing equipment throughout the production process. This PCB strictly complies with the IPC-Class-2 quality standard, which establishes rigorous specifications for performance, reliability, and manufacturing consistency, thereby validating its applicability in high-reliability RF and microwave applications.

Global Availability

This high-performance PCB is available for global shipment. It is suitable for both prototyping and large-volume production orders, ensuring convenient accessibility and timely delivery to customers worldwide.

TF600 Substrate Introduction

TF600 is a thermosetting high-frequency laminate consisting of modified PTFE resin and micron-sized ceramic fillers, offering excellent microwave performance and temperature resistance. It strikes a balance between ultra-low dielectric loss, stable DK consistency, and FR4-compatible processing—including drilling, plating, and lamination—and supports 260℃ lead-free assembly. Boasting superior thermal stability and moisture resistance, TF600 contains no glass fiber cloth and is well-suited for high-reliability RF and microwave designs where low insertion loss and signal integrity are critical.

TF600 Key Features and Benefits

Typical Applications

• Microwave/RF Transceivers
• 5G/6G Massive MIMO Antennas
• Radar Systems (Automotive ADAS, Aerospace)
• Satellite Communication Payloads
• High-Power RF Amplifiers
• Test & Measurement Equipment (Vector Network Analyzers)

PTFE Ceramic Composite Dielectric Substrate TF-1/2 and TF600

This product is composed of PTFE resin material, which offers excellent microwave properties and temperature resistance, combined with ceramics. The material contains no glass fiber fabric. The dielectric constant is precisely adjusted by varying the ratio between ceramic and PTFE resin. The production process is unique, resulting in superior dielectric performance and high reliability. "TF" refers to the non-clad (uncoppered) smooth surface material, "TF-1" refers to single-sided copper-clad material, and "TF-2" refers to double-sided copper-clad material.

Product Features

• Stable dielectric constant ranging from 3 to 16, with commonly available values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16; low dielectric loss.
• Suitable for microwave and millimeter-wave printed circuit board fabrication.
• Long-term operating temperature is higher than that of TP materials, with a service temperature range from -80°C to +200°C.
• Available thickness options between 0.635 mm and 2.5 mm.
• Radiation-resistant and low outgassing.
• Easy to process for circuit boards — standard thermoplastic processing methods can be used.