This 2-layer rigid PCB adopts Rogers RO4835, a high-temperature stable, oxidation-resistant hydrocarbon laminate. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and sensor systems.
PCB Specifications
| Parameter |
Details |
| Layer Count |
2-Layer (rigid structure) |
| Base Material |
Rogers RO4835 |
| Board Dimensions |
32.9mm × 60.35mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space |
6 mils (trace) / 6 mils (space) |
| Minimum Hole Size |
0.2mm |
| Vias |
No blind or buried vias; Total vias: 12; Via plating thickness: 20 μm |
| Finished Board Thickness |
0.24mm |
| Finished Copper Weight |
1oz (1.4 mils) for all layers |
| Surface Finish |
Immersion Gold |
| Silkscreen |
No silkscreen on top layer; No silkscreen on bottom layer; No silkscreen on solder pads |
| Solder Mask |
No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance |
100% electrical test conducted |
PCB Stack-up
| Layer Name |
Material |
Thickness |
| Top Copper Layer |
Finished Copper |
35 μm |
| Substrate Core |
Rogers RO4835 Dielectric |
0.168mm (6.6 mil) |
| Bottom Copper Layer |
Finished Copper |
35 μm |
Rogers RO4835 Material Introduction
Rogers' RO4835 laminate offers enhanced stability at high temperatures and is more resistant to oxidation than other hydrocarbon materials. RO4835 laminates share similar electrical and mechanical properties with RO4350B laminates and are designed for high frequency performance and cost-effective circuit fabrication. It uses standard epoxy/glass (FR-4) processes and is competitively priced.
RO4835 laminates are a low loss material that offer low cost circuit fabrication. These laminates are available with Rogers proprietary LoPro Reverse treated copper foil, ideal for applications requiring low insertion loss.
Key Material Features
| Feature |
Specification/Description |
| Material Composition |
Rogers RO4835 high-temperature stable hydrocarbon laminate |
| Compliance |
RoHS compliant for applications requiring UL 94 V-0; IPC-4103 compliant |
| Dielectric Constant (Dk) |
3.48 ± 0.05 |
| Dissipation Factor |
0.0037 at 10 GHz |
| Glass Transition Temperature (Tg) |
>280 °C (TMA) |
| Coefficient of Thermal Expansion (CTE) |
X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 31 ppm/°C |
| Surface Finish Advantage |
Immersion Gold ensures excellent solderability, corrosion resistance and reliable bonding performance |
Core Benefits
Enhanced Oxidation Resistance: Superior to typical thermoset microwave materials.
High-Volume Suitability: For performance-sensitive, high-volume applications.
Low-Loss Performance: Excellent electrical performance for high frequencies, ideal for automotive use.
Tight Dk Tolerance: Enables controlled impedance transmission lines.
Lead-Free Compatible: No blistering/delamination in lead-free processing.
Reliable Plated Through-Holes: Low Z-axis expansion ensures reliability.
Stable Processing: Low in-plane expansion for stable processing temperatures.
Cost-Effective: Standard FR-4 compatible, competitively priced.
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification.
Service Area: Worldwide service coverage, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
Automotive Radar and Sensors
Point-to-point Microwave
Power Amplifiers
Phased-Array Radar
RF Components
Summary
By leveraging RO4835's superior properties (enhanced high-temperature stability, excellent oxidation resistance, low loss, tight Dk tolerance), standard FR-4 process compatibility, and strict compliance with IPC-Class-2 standards, it effectively meets the high-frequency signal transmission requirements of various precision RF systems. With its competitive pricing and worldwide service coverage, this PCB serves as a trustworthy option for high-volume production of precision RF devices.
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