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| Base Material: | RT/Duroid 6002 | Layer Count: | 2 Layer, Multilayer |
|---|---|---|---|
| PCB Thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm) | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, OSP Etc.. | ||
| High Light: | Duroid 6002 High Frequency Pcb,20mil High Frequency Pcb,Microwave High Frequency Pcb |
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Rogers RT/Duroid 6002 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Coating Immersion Gold and Immersion Silver.
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Today, we talk about the high frequency PCB made on RT/duroid 6002 material.
The RT/ duroid ® 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.
The dielectric constant of RT/duroid ®6002 has excellent resistance to temperature change between -55 ℃ and 150 ℃, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.
The main advantages are:
Firstly, low loss ensures excellent high Frequency performance
Secondly, excellent mechanical and electrical properties, reliable multi-layer board construction.
Thirdly, extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.
Fourthly, in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies.
Fifthly, low outgassing, ideal for space applications
Typical applications are:
1. Phased Array Antennas
2. Round Based and Airborne Radar Systems
3. Commercial Airline Collision Avoidance
4. GPS antennas
5. Power Backplanes
Our PCB Capability (RT/duroid 6002)
| PCB Capability | |
| PCB Material: | Ceramic-filled PTFE composite |
| Designation: | RT/duroid 6002 |
| Dielectric constant: | 2.94 ±0.04 (process) |
| 2.94 (design) | |
| Layer count: | 2 Layer, Multilayer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.
The basic colour of RT/duroid 6002 PCB is white.
RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.
If you have any questions, please feel free to contact us. Thank you for your reading.
Appendix: Data Sheet of RT/duroid 6002
| RT/duroid 6002 Typical Value | |||||
| Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.94±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.94 | 8GHz to 40 GHz | Differential Phase Length Method | ||
| Dissipation Factor,tanδ | 0.0012 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +12 | Z | ppm/℃ | 10 GHz 0℃-100℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
| Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23℃ | ASTM D 638 |
| Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) | ||
| Ultimate Strain | 7.3 | X,Y | % | ||
| Compressive Modulus | 2482(360) | Z | MPa(kpsi) | ASTM D 638 | |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 ASTM D 570 |
|
| Thermal Conductivity | 0.6 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
16 16 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D 792 | ||
| Specific Heat | 0.93(0.22) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 8.9(1.6) | Ibs/in.(N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
