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Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE

Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE
Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE

Large Image :  Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-202.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RT/Duroid 5880&RT/Duroid 5870 Layer Count: Single Side, Double Layer, Multilayer
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: HASL, ENIG, OSP, Immersion Tin Etc..
High Light:

Multilayer Rogers PCB Board

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UL Rogers PCB Board

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UL PTFE PCB Board

 

What is Stripline and microstrip line in PCB?

Tag# RT/duroid 5880 Tag# Rogers 5870

 

Rogers RT/duroid 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications.

Today we’re learning what stripline and microstrip line are.

 

Stripline: a banded line that walks in the inner layer and is buried inside the PCB, as shown below.

Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE 0

The brown part is the conductor, the green part is the PCB insulating dielectric, stripline is the ribbon wire embedded between the two layers of conductors.

 

Because stripline is embedded between two layers of conductors, its electric field distribution is between two conductors (planes) that wrap it, and does not radiate energy or be disturbed by external radiation. but because it is all surrounded by dielectric (dielectric constant is larger than 1), the signal is transmitted slower in stripline than in microstrip line!

 

Microstrip line: a strip line attached to the surface of a PCB layer, as shown below

Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE 1

 

The brown part is the conductor, the green part is the PCB insulating dielectric, and the brown block above is the microstrip line.

Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE 2

 

The light green part is epoxy organic material.

 

Since one side of the microstrip line is exposed to the air (which can form radiation around or be disturbed by radiation around it), and the other side is attached to the PCB insulating dielectric, the electric field formed by it is distributed in the air. The other part is distributed in PCB insulating medium. Its outstanding advantage is that the signal transmission speed in the microstrip line is faster than that in the stripline.

 

Conclusion

1. Microstrip line is a banded wire (signal line) separated from the ground plane with a dielectric. If the thickness, width, and distance between the line and the ground plane are controllable, its characteristic impedance is also controllable.

 

2. Stripline is a copper strip line placed in the middle of the dielectric between two layers of conductive plane. If the thickness and width of the line, the dielectric constant of the medium and the distance between the two conductive planes are controllable, then the characteristic impedance of the line is also controllable.

 

Impedance calculation of microstrip and Striplines:

a. microstrip line Z ={87/[ sqrt (Er+ 1.41)]} ln [5.98 H/(0.8 W+T)]

Among them, the W is the line width, the T is the copper thickness of the line, the H is the distance from the line to the reference plane, and the Er is the dielectric constant of the PCB plate material. This formula must be applied at 0.1<(W/H)<2.0 and 1<(Er) to 15.

 

b. stripline Z =[60/ sqrt (Er)] ln {4H/[0.67π(T +0.8W)]}

Among them, the H is the distance between the two reference planes, and the line is located in the middle of the two reference planes. This formula must be applied in W/H<0.35 and T/H<0.25.

 

Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE 3

 

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

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Tel: +8613481420915

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