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Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission
Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

Large Image :  Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-106.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO3003+Taconic FastRise-28 Prepreg Layer Count: 6 Layers
PCB Thickness: 1.18mm Solder Mask: Green
High Light:

1.18mm RF PCB Board

,

RO3003 RF PCB Board

,

1.18mm 6 Layer PCB Board

 

Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Global positioning satellite antennas

2) Patch antenna for wireless communications

3) Power amplifiers and antennas

4) Power backplanes

5) Remote meter readers

 

Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission 0

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25

 
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.

 

FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.

 

The main properties of this adhesive sheet material are shown in the table below.

FastRise-28 (FR-28) Typical Value
Property Value Direction Units Condition Test Method
Dielectric Constant,ε 2.78 - - 10 GHz IPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ 0.0015 - - 10 GHz IPC-TM-650 2.5.5.5.1
Water Absorption 0.08   %   IPC TM-650 2.6.2.1
Dielectric breakdown voltage 49   KV   IPC TM-650 2.5.6
Dielectric strength 1090   V/mil   ASTM D 149
Volume Resistivity 8.00 x 108   MΩ/cm   IPC-TM-650 2.5.17.1
Surface Resistivity 3.48 x 108     IPC-TM-650 2.5.17.1
Tg 188     ASTM E 1640
Tensil strength 1690 X psi   ASTM D 882
1480 Y psi
Tensil modulus 304 X psi   ASTM D 882
295 Y psi
Density 1.82   gm/cm³   ASTM D-792 Method A
Td 709   °F   IPC TM-650 2.4.24.6
Peel Strength 7   lbs/in   IPC-TM-650 2.4.8
Thermal Conductivity 0.25   W/mk   ASTM F433
Coefficient of Thermal Expansion 59
70
72
X
Y
Z
ppm/   IPC-TM-650 2.4.41
Hardness 68   Shore D   ASTM D 2240

 

More FastRise Prepregs

FastRise-28 (FR-28) Typical Value
Property Value Direction Units Condition Test Method
Dielectric Constant,ε 2.78 - - 10 GHz IPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ 0.0015 - - 10 GHz IPC-TM-650 2.5.5.5.1
Water Absorption 0.08   %   IPC TM-650 2.6.2.1
Dielectric breakdown voltage 49   KV   IPC TM-650 2.5.6
Dielectric strength 1090   V/mil   ASTM D 149
Volume Resistivity 8.00 x 108   MΩ/cm   IPC-TM-650 2.5.17.1
Surface Resistivity 3.48 x 108     IPC-TM-650 2.5.17.1
Tg 188     ASTM E 1640
Tensil strength 1690 X psi   ASTM D 882
1480 Y psi
Tensil modulus 304 X psi   ASTM D 882
295 Y psi
Density 1.82   gm/cm³   ASTM D-792 Method A
Td 709   °F   IPC TM-650 2.4.24.6
Peel Strength 7   lbs/in   IPC-TM-650 2.4.8
Thermal Conductivity 0.25   W/mk   ASTM F433
Coefficient of Thermal Expansion 59
70
72
X
Y
Z
ppm/   IPC-TM-650 2.4.41
Hardness 68   Shore D   ASTM D 2240

 

Refrigeration

FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4℃ as possible. FastRise will stiffen up and will separate from the release liners a lot easier.

 

Lamination

Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5℃ is within reach of most boards houses.

 

Here’s a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There’s 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.

 

Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission 1

 

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Tel: +8613481420915

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