2-layer F4BM217 PCB 3.9mil Substrate with Immersion Gold

This PCB employs Wangling's F4BM217 laminate as the base material and strictly complies with IPC-Class-2 quality criteria, a double-sided rigid configuration specifically engineered to satisfy the rigorous performance requirements of microwave, radio frequency (RF), and other high-frequency electronic systems.

PCB Specifications

The PCB features a double-sided construction with precise specifications to ensure optimal functionality. Key construction parameters are as follows:

Stack-up Configuration

F4BM217 Material Introduction

Wangling's F4BM217 laminates are advanced dielectric materials crafted through scientific formulation and strict pressing processes. They consist of a combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film, delivering enhanced electrical performance compared to F4B220 laminates—primarily characterized by lower dielectric loss, higher insulation resistance, and improved stability. This material is a viable alternative to similar foreign products, offering cost-effectiveness without compromising quality.

F4BM217 and F4BME217 share the same dielectric layer but differ in copper foil combinations:

- F4BM217 is paired with ED copper foil, making it ideal for applications without PIM (Passive Intermodulation) requirements.

- F4BME217 uses reverse-treated foil (RTF) copper foil, providing excellent PIM performance, more precise line width control, and lower conductor loss.

By adjusting the ratio of PTFE to fiberglass cloth, both F4BM217 and F4BME217 achieve precise control of the dielectric constant. A higher fiberglass proportion results in a higher dielectric constant, accompanied by better dimensional stability, a lower coefficient of thermal expansion (CTE), improved temperature drift performance, and a slight increase in dielectric loss—allowing customization based on application needs.

F4BM217 Material Features

F4BM217 laminates exhibit outstanding electrical and mechanical properties, including:

Typical Applications

Leveraging its exceptional high-frequency performance and stability, this PCB is well-suited for the following applications:

-Microwave, RF, and radar systems

-Phase shifters

-Passive components

-Power dividers, couplers, and combiners

-Feed networks

-Phased array antennas

-Satellite communications systems

-Base station antennas

Quality & Supply Information

Quality Standard: Complies with IPC-Class-2, ensuring reliable performance for commercial electronic products.

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with most production processes.

Availability: Supplied worldwide, supporting global project requirements.