Double-Sided WL-CT440 PCB 10mil Substrate Green Solder Mask

This PCB utilizes WL-CT440 as its base material, incorporates an Immersion Gold surface finish, and strictly adheres to IPC-Class-2 quality specifications. Configured as a 2-layer rigid structure with a 0.254mm (10 mil) WL-CT440 substrate core, it is tailored to meet the high-frequency, low-loss performance requirements of aerospace, radar, and satellite communication systems.

PCB Specifications

Stack-up Configuration

WL-CT440 Material Introduction

Wangling's WL-CT440 is a thermosetting resin-based high-frequency copper-clad laminate (CCL) with organic polymer ceramic fiberglass cloth reinforcement. Its dielectric layer comprises hydrocarbon resin, ceramic fillers, and fiberglass cloth, delivering low-loss performance that meets rigorous high-frequency design criteria. WL-CT440 is process-compatible with standard FR4 manufacturing techniques, offering simplified processing compared to PTFE-based materials while ensuring enhanced circuit stability and consistency. It serves as a high-performance alternative to equivalent foreign materials.

The synergistic combination of hydrocarbon resin and composite ceramics imparts WL-CT440 with exceptional low-loss characteristics, high-temperature resistance, and thermal stability. This material series features stable temperature coefficients of dielectric constant (TCDK) and dielectric loss, a low coefficient of thermal expansion (CTE), and a glass transition temperature (Tg) exceeding 280°C, rendering it well-suited for high-frequency applications in harsh operating environments.

WL-CT440 Material Features

WL-CT440 Material Benefits

-Superior Low-Loss Performance: The hydrocarbon resin and composite ceramic formulation delivers a low dissipation factor, critical for high-fidelity high-frequency signal transmission.

-FR4-Process Compatible: Compatible with standard FR4 manufacturing workflows, simplifying production compared to PTFE materials while ensuring consistent circuit performance.

-Exceptional Thermal Stability: A high Tg (280°C) and stable TCDK ensure reliable operation in extreme temperature environments.

-Copper-Matched CTE: Thermal expansion coefficient aligned with copper minimizes thermal stress, enhancing long-term structural and electrical reliability.

Typical Applications

-Aerospace Equipment

-Microwave & Antenna Systems

-beamforming networks

-Radar Systems

-Satellite & Navigation

-Power Amplifiers

Quality & Availability

This PCB adheres to IPC-Class-2 quality standards, ensuring consistent reliability for aerospace, military, and high-frequency electronic systems. It is available for worldwide, supporting global project needs and ensuring timely delivery.