F4BTMS430 PCB 2-layer 10mil Thick with ENIG Finish

This PCB adopts F4BTMS430 as its base material, features an Immersion Gold (ENIG) surface finish, and strictly complies with IPC-Class-2 quality standards. It is configured as a 2-layer rigid structure with a 0.254mm (10 mil) F4BTMS430 substrate core, specifically engineered to meet the high-reliability requirements of aerospace, military, and phase-sensitive electronic systems.

PCB Specifications

Stack-up Configuration

F4BTMS430 Material Introduction

The F4BTMS series represents an upgraded iteration of the F4BTM series, achieving technological breakthroughs in material formulation and manufacturing processes. By incorporating a high volume of ceramics and reinforcing with ultra-thin, ultra-fine glass fiber cloth, it delivers significantly enhanced performance and a wider range of dielectric constants. As a high-reliability material tailored for aerospace applications, it serves as a viable alternative to similar foreign products.

F4BTMS430 integrates a small quantity of ultra-thin ultra-fine glass fiber cloth, a high concentration of uniformly dispersed special nano-ceramics, and PTFE resin. This unique formulation minimizes the adverse effects of glass fiber on electromagnetic wave propagation, reducing dielectric loss, enhancing dimensional stability, and lowering X/Y/Z anisotropy. It also extends the usable frequency range, improves electrical strength, boosts thermal conductivity, and demonstrates excellent low thermal expansion coefficient and stable dielectric temperature characteristics. Standardly paired with RTF low-roughness copper foil, it reduces conductor loss and ensures superior peel strength, compatible with both copper and aluminum substrates.

F4BTMS430 Material Features

F4BTMS430 Material Benefits

-Superior Electrical Performance: Matched with RTF low-roughness copper foil to reduce conductor loss, minimize electromagnetic wave interference, and ensure excellent peel strength.

-Enhanced Dimensional Stability: The combination of ultra-thin ultra-fine glass fiber cloth and nano-ceramic formulation lowers anisotropy, optimizing signal propagation and structural reliability.

-Broad Environmental Adaptability: Integrates low moisture absorption, stable dielectric temperature characteristics, and a wide operating temperature range (-55°C to 288°C) to suit harsh environments.

-High Aerospace Reliability: Serves as a substitute for foreign equivalents, offering enhanced thermal conductivity, electrical strength, and consistent performance for critical applications.

Typical Applications

-Aerospace & Cabin Equipment

-Microwave/RF Systems

-Radar & Military Radar Equipment

-Feed Networks

-Phase-Sensitive & Phased Array Antennas

-Satellite Communication Systems

Quality & Availability

This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring reliable performance for aerospace, military, and commercial electronic systems. It is available for worldwide, providing robust support for global projects and facilitating timely international delivery.