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High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper
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High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper
  • name

High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
TP960
Layer Count:
2 Layers
PCB Thickness:
0.6mm
PCB Size:
108mm × 96mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Immersion Gold (ENIG)
Highlight:

High Frequency RF PCB Board

,

Dual-layer PCB 0.6mm thick

,

35um Copper RF PCB

Product Description

This PCB utilizes TP960 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly adheres to IPC-Class-2 quality specifications. Designed as a double-sided rigid structure with a 0.5mm (19.6 mil) TP960 substrate core, it is tailored to meet the high-reliability and high-frequency performance criteria of precision electronic systems, such as global satellite navigation equipment and missile-borne platforms.

 

PCB Specifications

Construction Parameter Specification
Base Material TP960 (ceramic-polyphenylene oxide (PPO) resin composite, non-fiberglass reinforced)
Layer Count Double-sided (2-layer) rigid structure
Board Dimensions 108mm × 96mm per unit, with a dimensional tolerance of ±0.15mm
Minimum Trace/Space 5 mils / 6 mils
Minimum Hole Size 0.3mm
Blind Vias Not incorporated
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold (ENIG)
Silkscreen No silkscreen applied to the top or bottom layer

Solder Mask

 

 No solder mask implemented on the top or bottom layer
Quality Control 100% electrical testing performed prior to shipment

 

Stack-up Configuration

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core TP960 0.5mm (19.6 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper 0

 

TP Series Material Introduction

TP material is an industry-unique high-frequency thermoplastic laminate, composed of ceramic fillers and polyphenylene oxide (PPO) resin without fiberglass reinforcement. Its dielectric constant (Dk) can be precisely tuned by adjusting the ceramic-to-PPO resin ratio, and it delivers exceptional dielectric performance and high reliability through a specialized manufacturing process. The TP product line is categorized by copper cladding: TP denotes copper-free smooth surface material, TP-1 refers to single-sided copper-clad material, and TP-2 indicates double-sided copper-clad material.

 

The dielectric constant of TP series materials is stably adjustable within the range of 3 to 25, customized to meet specific circuit design requirements. Common Dk values include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20, with corresponding part numbers (e.g., TP300, TP440, TP600, TP615). It exhibits low dielectric loss, which increases moderately with frequency but remains negligible within the 10 GHz range, making it well-suited for high-frequency applications.

 

TP960 Material Features

Category Feature Specification

Electrical Properties

 

 Dielectric Constant (Dk) 9.6 ± 0.19 at 10GHz
Dissipation Factor 0.0012 at 10GHz
Thermal Performance TCDK -40 ppm/°C (-55°C to 150°C)
CTE (XYZ Axes) 40/40/55 ppm/°C (-55°C to 150°C)
Thermal Conductivity 0.65 W/mK
Physical Properties Moisture Absorption 0.01%
Flammability Rating UL 94-V0

 

Typical Applications

-Global Satellite Navigation Systems (GNSS)

-Missile-Borne Equipment

-Fuze Technology

-Miniaturized Antennas

 

Quality & Availability

This PCB complies with IPC-Class-2 quality standards, guaranteeing consistent reliability for precision, military, and aerospace electronic systems. It is available for worldwide, supporting global projects and ensuring timely delivery.

 

High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper 1

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper
  • name
High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
TP960
Layer Count:
2 Layers
PCB Thickness:
0.6mm
PCB Size:
108mm × 96mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Immersion Gold (ENIG)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

High Frequency RF PCB Board

,

Dual-layer PCB 0.6mm thick

,

35um Copper RF PCB

Product Description

This PCB utilizes TP960 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly adheres to IPC-Class-2 quality specifications. Designed as a double-sided rigid structure with a 0.5mm (19.6 mil) TP960 substrate core, it is tailored to meet the high-reliability and high-frequency performance criteria of precision electronic systems, such as global satellite navigation equipment and missile-borne platforms.

 

PCB Specifications

Construction Parameter Specification
Base Material TP960 (ceramic-polyphenylene oxide (PPO) resin composite, non-fiberglass reinforced)
Layer Count Double-sided (2-layer) rigid structure
Board Dimensions 108mm × 96mm per unit, with a dimensional tolerance of ±0.15mm
Minimum Trace/Space 5 mils / 6 mils
Minimum Hole Size 0.3mm
Blind Vias Not incorporated
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold (ENIG)
Silkscreen No silkscreen applied to the top or bottom layer

Solder Mask

 

 No solder mask implemented on the top or bottom layer
Quality Control 100% electrical testing performed prior to shipment

 

Stack-up Configuration

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core TP960 0.5mm (19.6 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper 0

 

TP Series Material Introduction

TP material is an industry-unique high-frequency thermoplastic laminate, composed of ceramic fillers and polyphenylene oxide (PPO) resin without fiberglass reinforcement. Its dielectric constant (Dk) can be precisely tuned by adjusting the ceramic-to-PPO resin ratio, and it delivers exceptional dielectric performance and high reliability through a specialized manufacturing process. The TP product line is categorized by copper cladding: TP denotes copper-free smooth surface material, TP-1 refers to single-sided copper-clad material, and TP-2 indicates double-sided copper-clad material.

 

The dielectric constant of TP series materials is stably adjustable within the range of 3 to 25, customized to meet specific circuit design requirements. Common Dk values include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20, with corresponding part numbers (e.g., TP300, TP440, TP600, TP615). It exhibits low dielectric loss, which increases moderately with frequency but remains negligible within the 10 GHz range, making it well-suited for high-frequency applications.

 

TP960 Material Features

Category Feature Specification

Electrical Properties

 

 Dielectric Constant (Dk) 9.6 ± 0.19 at 10GHz
Dissipation Factor 0.0012 at 10GHz
Thermal Performance TCDK -40 ppm/°C (-55°C to 150°C)
CTE (XYZ Axes) 40/40/55 ppm/°C (-55°C to 150°C)
Thermal Conductivity 0.65 W/mK
Physical Properties Moisture Absorption 0.01%
Flammability Rating UL 94-V0

 

Typical Applications

-Global Satellite Navigation Systems (GNSS)

-Missile-Borne Equipment

-Fuze Technology

-Miniaturized Antennas

 

Quality & Availability

This PCB complies with IPC-Class-2 quality standards, guaranteeing consistent reliability for precision, military, and aerospace electronic systems. It is available for worldwide, supporting global projects and ensuring timely delivery.

 

High Frequency TP960 PCB Dual-layer 0.6mm Thick 35um Copper 1

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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