This PCB utilizes TP960 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly adheres to IPC-Class-2 quality specifications. Designed as a double-sided rigid structure with a 0.5mm (19.6 mil) TP960 substrate core, it is tailored to meet the high-reliability and high-frequency performance criteria of precision electronic systems, such as global satellite navigation equipment and missile-borne platforms.
PCB Specifications
| Construction Parameter |
Specification |
| Base Material |
TP960 (ceramic-polyphenylene oxide (PPO) resin composite, non-fiberglass reinforced) |
| Layer Count |
Double-sided (2-layer) rigid structure |
| Board Dimensions |
108mm × 96mm per unit, with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space |
5 mils / 6 mils |
| Minimum Hole Size |
0.3mm |
| Blind Vias |
Not incorporated |
| Finished Board Thickness |
0.6mm |
| Finished Copper Weight |
1oz (1.4 mils) on both outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Gold (ENIG) |
| Silkscreen |
No silkscreen applied to the top or bottom layer |
|
Solder Mask
|
No solder mask implemented on the top or bottom layer |
| Quality Control |
100% electrical testing performed prior to shipment |
Stack-up Configuration
| Layer Name |
Material |
Thickness |
| Top Copper Layer (Copper_layer_1) |
Copper |
35 μm |
| Substrate Core |
TP960 |
0.5mm (19.6 mil) |
| Bottom Copper Layer (Copper_layer_2) |
Copper |
35 μm |
TP Series Material Introduction
TP material is an industry-unique high-frequency thermoplastic laminate, composed of ceramic fillers and polyphenylene oxide (PPO) resin without fiberglass reinforcement. Its dielectric constant (Dk) can be precisely tuned by adjusting the ceramic-to-PPO resin ratio, and it delivers exceptional dielectric performance and high reliability through a specialized manufacturing process. The TP product line is categorized by copper cladding: TP denotes copper-free smooth surface material, TP-1 refers to single-sided copper-clad material, and TP-2 indicates double-sided copper-clad material.
The dielectric constant of TP series materials is stably adjustable within the range of 3 to 25, customized to meet specific circuit design requirements. Common Dk values include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20, with corresponding part numbers (e.g., TP300, TP440, TP600, TP615). It exhibits low dielectric loss, which increases moderately with frequency but remains negligible within the 10 GHz range, making it well-suited for high-frequency applications.
TP960 Material Features
| Category |
Feature |
Specification |
|
Electrical Properties
|
Dielectric Constant (Dk) |
9.6 ± 0.19 at 10GHz |
| Dissipation Factor |
0.0012 at 10GHz |
| Thermal Performance |
TCDK |
-40 ppm/°C (-55°C to 150°C) |
| CTE (XYZ Axes) |
40/40/55 ppm/°C (-55°C to 150°C) |
| Thermal Conductivity |
0.65 W/mK |
| Physical Properties |
Moisture Absorption |
0.01% |
| Flammability Rating |
UL 94-V0 |
Typical Applications
-Global Satellite Navigation Systems (GNSS)
-Missile-Borne Equipment
-Fuze Technology
-Miniaturized Antennas
Quality & Availability
This PCB complies with IPC-Class-2 quality standards, guaranteeing consistent reliability for precision, military, and aerospace electronic systems. It is available for worldwide, supporting global projects and ensuring timely delivery.
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