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Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish

Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
F4BTM300
Layer Count:
2 Layers
PCB Thickness:
0.3mm
PCB Size:
112mm × 89mm
Solder Mask:
Black
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Highlight:

Double-Sided RF PCB Board

,

F4BTM300 PCB substrate

,

ENIG finish RF PCB

Product Description

This PCB utilizes F4BTM300 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. It adopts a 2-layer rigid structure, tailored to meet the high-performance demands of aerospace, military, and phase-sensitive electronic systems.

 

PCB Specifications

Construction Parameter Specification
Base Material F4BTM300 (composite of glass fiber cloth, nano-ceramic fillers, and PTFE resin)
Layer Count 2-layer rigid structure
Board Dimensions 112mm × 89mm per unit, with a dimensional tolerance of ±0.15mm
Minimum Trace/Space Minimum 4 mils / 5 mils
Minimum Hole Size 0.4mm
Blind Vias Not incorporated
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm, ensuring dependable interlayer conductivity
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen No silkscreen applied to either top or bottom layer
Solder Mask Black solder mask on the top layer; no solder mask on the bottom layer
Quality Control 100% electrical test before shipment

 

Stack-up Configuration

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core F4BTM300 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish 0

 

F4BTM300 Material Introduction

F4BTM series laminates are produced through a precision manufacturing process, blending glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin in a scientifically formulated mixture. Built on the F4BM dielectric layer, F4BTM300 incorporates high-Dk, low-loss nano-ceramics, yielding enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, elevated insulation resistance, and improved thermal conductivity—all while maintaining low-loss performance.

 

F4BTM300 laminates are specifically matched with reverse-treated RTF copper foil, delivering excellent PIM performance, precise line accuracy, and minimized conductor loss. These characteristics make it ideal for demanding applications that require stable performance across extreme temperature ranges and harsh operating environments.

 

F4BTM300 Material Features

Category Feature Specification
Electrical Properties Dielectric Constant (Dk) 3.0 ± 0.06 at 10GHz
Dissipation Factor 0.0018 at 10GHz; 0.0023 at 20GHz
Thermal Stability CTE (XYZ Axes) 15/16/72 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -75 ppm/°C (-55°C to 150°C)
Physical Properties Moisture Absorption 0.05%
Flammability Rating UL 94-V0

 

F4BTM300 Material Benefits

-Superior Electrical Performance: Paired with reverse-treated RTF copper foil to deliver excellent PIM performance, precise line control, and minimized conductor loss.

 

-Enhanced Environmental Adaptability: Combines low moisture absorption, high heat resistance, and stable performance from -55°C to 288°C, suitable for harsh environments.

 

-Balanced Dielectric & Thermal Traits: Integrates high Dk, low loss, and improved thermal conductivity to support high-power and high-frequency operations.

 

-Robust Insulation: Offers increased insulation resistance, ensuring reliable isolation in precision electronic assemblies.

 

Typical Applications

Aerospace & Cabin Equipment

Microwave/RF Systems

Radar & Military Radar Equipment

Feed Networks

Phase-Sensitive & Phased Array Antennas

Satellite Communication Systems

 

Quality & Availability

This PCB meets IPC-Class-2 quality standards, ensuring reliable performance for commercial, military, and aerospace electronic systems. Artwork is provided in the industry-standard Gerber RS-274-X format, compatible with global manufacturing processes. It is available worldwide, supporting global projects and timely international delivery.

 

Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish 1

 

products
PRODUCTS DETAILS
Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
F4BTM300
Layer Count:
2 Layers
PCB Thickness:
0.3mm
PCB Size:
112mm × 89mm
Solder Mask:
Black
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Double-Sided RF PCB Board

,

F4BTM300 PCB substrate

,

ENIG finish RF PCB

Product Description

This PCB utilizes F4BTM300 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. It adopts a 2-layer rigid structure, tailored to meet the high-performance demands of aerospace, military, and phase-sensitive electronic systems.

 

PCB Specifications

Construction Parameter Specification
Base Material F4BTM300 (composite of glass fiber cloth, nano-ceramic fillers, and PTFE resin)
Layer Count 2-layer rigid structure
Board Dimensions 112mm × 89mm per unit, with a dimensional tolerance of ±0.15mm
Minimum Trace/Space Minimum 4 mils / 5 mils
Minimum Hole Size 0.4mm
Blind Vias Not incorporated
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm, ensuring dependable interlayer conductivity
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen No silkscreen applied to either top or bottom layer
Solder Mask Black solder mask on the top layer; no solder mask on the bottom layer
Quality Control 100% electrical test before shipment

 

Stack-up Configuration

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core F4BTM300 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish 0

 

F4BTM300 Material Introduction

F4BTM series laminates are produced through a precision manufacturing process, blending glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin in a scientifically formulated mixture. Built on the F4BM dielectric layer, F4BTM300 incorporates high-Dk, low-loss nano-ceramics, yielding enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, elevated insulation resistance, and improved thermal conductivity—all while maintaining low-loss performance.

 

F4BTM300 laminates are specifically matched with reverse-treated RTF copper foil, delivering excellent PIM performance, precise line accuracy, and minimized conductor loss. These characteristics make it ideal for demanding applications that require stable performance across extreme temperature ranges and harsh operating environments.

 

F4BTM300 Material Features

Category Feature Specification
Electrical Properties Dielectric Constant (Dk) 3.0 ± 0.06 at 10GHz
Dissipation Factor 0.0018 at 10GHz; 0.0023 at 20GHz
Thermal Stability CTE (XYZ Axes) 15/16/72 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -75 ppm/°C (-55°C to 150°C)
Physical Properties Moisture Absorption 0.05%
Flammability Rating UL 94-V0

 

F4BTM300 Material Benefits

-Superior Electrical Performance: Paired with reverse-treated RTF copper foil to deliver excellent PIM performance, precise line control, and minimized conductor loss.

 

-Enhanced Environmental Adaptability: Combines low moisture absorption, high heat resistance, and stable performance from -55°C to 288°C, suitable for harsh environments.

 

-Balanced Dielectric & Thermal Traits: Integrates high Dk, low loss, and improved thermal conductivity to support high-power and high-frequency operations.

 

-Robust Insulation: Offers increased insulation resistance, ensuring reliable isolation in precision electronic assemblies.

 

Typical Applications

Aerospace & Cabin Equipment

Microwave/RF Systems

Radar & Military Radar Equipment

Feed Networks

Phase-Sensitive & Phased Array Antennas

Satellite Communication Systems

 

Quality & Availability

This PCB meets IPC-Class-2 quality standards, ensuring reliable performance for commercial, military, and aerospace electronic systems. Artwork is provided in the industry-standard Gerber RS-274-X format, compatible with global manufacturing processes. It is available worldwide, supporting global projects and timely international delivery.

 

Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish 1

 

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