logo
products
PRODUCTS DETAILS
Home > Products >
F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
F4BM217
Laminate Thickness:
0.1mm-12mm
Laminate Size:
460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm
Copper Weight:
0.5OZ(0.018mm)1OZ(0.035mm)
Highlight:

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Product Description

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

Recommended Products
products
PRODUCTS DETAILS
F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
F4BM217
Laminate Thickness:
0.1mm-12mm
Laminate Size:
460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm
Copper Weight:
0.5OZ(0.018mm)1OZ(0.035mm)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Product Description

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.