5mil RO3010 Rigid Mini PCB Blog 2L Bare Copper Printed Circuit Board

Introducing our 2-layer rigid PCB, utilizing Rogers RO3010 ceramic-filled PTFE composites as the substrate. This PCB is designed to provide high-performance and reliability for a variety of applications. With a dielectric constant of 10.2+/- .30 at 10 GHz/23°C and a dissipation factor of 0.0022 at the same frequency and temperature, precise signal transmission is ensured. The PCB operates within a temperature range of -40℃ to +85℃, making it suitable for diverse environments.

The Rogers RO3010 substrate offers excellent thermal properties, with a low coefficient of thermal expansion (CTE) of 13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), and 16 ppm/°C (Z-axis) from -55 to 288°C. This material provides dimensional stability and is well-suited for multi-layer board designs. Additionally, it exhibits a high thermal conductivity of 0.95 W/mK, ensuring efficient heat dissipation. The substrate has a moisture absorption rate of 0.05% and can withstand temperatures exceeding 500°C (Td> 500°C).

This 2-layer PCB features a stackup consisting of copper layer 1 with a thickness of 35μm, a 5mil (0.127mm) Rogers RO3010 substrate, and copper layer 2 with a thickness of 35μm. The board dimensions are 8mm x 8mm, providing a compact form factor for various applications. It supports a minimum trace/space of 7/7 mils and a minimum hole size of 0.20mm. The finished board thickness is 0.2mm, and the outer layers have a copper weight of 1 oz (1.4 mils). Via plating thickness is 20μm.

To ensure high-quality production, this PCB adheres to IPC-Class-2 standards. Each PCB undergoes a meticulous 100% electrical test before shipment, guaranteeing reliability and performance. The artwork supplied is in Gerber RS-274-X format.

With one component and three pads, including two thru-hole pads and one top SMT pad, this PCB is suitable for various applications such as automotive radar, GPS antennas, cellular telecommunications systems, wireless communications, satellite systems, and more. Its economical laminate pricing makes it ideal for volume manufacturing processes.

Our PCB is available worldwide, and for any technical inquiries, please contact our sales team at sales10@bichengpcb.com.

Choose our Rogers RO3010-based 2-layer rigid PCB for your next project and experience the high performance and reliability it offers across a range of applications.

RO3010 is a high-frequency laminate material offered by Rogers Corporation that is widely used in the fabrication of printed circuit boards (PCBs). Here are some key details about the RO3010 material:

Composition: RO3010 is a ceramic-filled PTFE (Polytetrafluoroethylene) composite material. It consists of a PTFE matrix with ceramic fillers, which enhance its electrical and mechanical properties.

Thermal Conductivity: RO3010 has a thermal conductivity of 1.44 W/m/K at 50°C. This high thermal conductivity allows for efficient heat dissipation, reducing the operating temperatures of high-power applications and enhancing overall reliability.

Moisture Absorption: RO3010 has a low moisture absorption rate of approximately 0.04%. This moisture resistance helps maintain the material's electrical and mechanical stability, preventing performance degradation in humid environments.

Coefficient of Thermal Expansion (CTE): RO3010 exhibits a CTE of 24 ppm/°C in the X-axis and 24 ppm/°C in the Y-axis. These values represent how the material expands or contracts with temperature changes along different axes. The balanced CTE helps minimize the risk of mechanical stress and ensures dimensional stability in PCB designs.

Flame Resistance: RO3010 is UL 94V-0 flame-rated, indicating its excellent flame resistance. This feature enhances the safety and reliability of PCBs constructed with this material.

RO3010 is commonly used in high-frequency applications where stringent electrical performance, thermal management, and reliability are essential. It is suitable for various applications, including base station amplifiers, power amplifiers, filters, couplers, and other RF/microwave circuit designs.