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Highlight: | Precision RF PCB Blog,Glass Reinforced Hydrocarbon PCB Blog,2 Layer RF PCB Substrates |
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Introducing our newly shipped PCB, designed with precision and advanced technology to meet your specific needs. This 2-layer rigid PCB features high-performance materials and exceptional construction details, making it suitable for a wide range of applications.
This PCB substrates are made of Rogers RO4534 Ceramic-filled, Glass-reinforced Hydrocarbon Laminates, known for their outstanding characteristics. With a dielectric constant (DK) of 3.4 at 10GHz and a dissipation factor of 0.0027 at 10GHz, this PCB ensures low loss and low PIM response. It boasts a remarkable PIM (typical) value of -157 dBC, guaranteeing superior performance.
PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: | RO4534 |
Dielectric constant: | 3.4 |
Dissipation Factor | 0.0027 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
This PCB's excellent dimensional stability and thermoset resin system make it compatible with standard PCB fabrication processes. It offers uniform mechanical properties, ensuring the maintenance of its mechanical form during handling. Moreover, its high thermal conductivity enhances power handling capabilities.
The stackup consists of a copper layer of 35 μm, a Rogers 4534 core of 0.508 mm, and another 35 μm copper layer. The finished board dimensions are 169.1mm x 156.85 mm, with a thickness of 0.6mm. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.5mm. The PCB undergoes a meticulous 100% electrical test before shipment to ensure its quality and reliability.
With 115 components and 223 total pads, including 121 thru-hole pads and 102 top surface mount technology (SMT) pads, this PCB offers versatility in component integration. It features 267 vias and 6 nets, providing flexibility for various circuit connections.
The artwork supplied in Gerber RS-274-X format ensures accuracy and compatibility with standard manufacturing processes. This PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality performance and reliability.
The PCB is globally available, making it accessible for customers worldwide. Its applications are diverse, including cellular infrastructure base station antennas and WiMAX antenna networks.
For any technical inquiries or further information, please reach out to our dedicated team at sales10@bichengpcb.com. We are committed to providing exceptional support and ensuring your satisfaction with our products.
Property | RO4534 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.4 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.0022 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0027 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.3 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 11 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
14 | Y | ||||
46 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 6.3 (1.1) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | NON FR | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |
More About RO4534 Material
RO4534 is another high-performance material offered by Rogers Corporation for the fabrication of printed circuit boards (PCBs). Here are some key details about the RO4534 material:
Composition: RO4534 is a thermoset composite material. It consists of woven fiberglass reinforcement combined with a high-temperature resin system. This composition provides excellent mechanical strength, stability, and electrical performance.
Dielectric Constant (DK): The DK of RO4534 varies depending on the thickness of the laminate. Typically, it ranges from 3.48 to 3.52 at 10 GHz/23°C. The consistent and tightly controlled DK ensures predictable electrical performance in high-frequency applications.
Dissipation Factor: The dissipation factor of RO4534 is typically around 0.003 at 10 GHz/23°C. This low dissipation factor indicates minimal energy loss in the material, enabling superior signal integrity and reduced power loss in high-frequency circuits.
Thermal Conductivity: RO4534 has a thermal conductivity of 0.66 W/m/K at 50°C. While not as high as some other materials, it still provides effective heat dissipation for moderate power applications.
Moisture Absorption: RO4534 has a relatively low moisture absorption rate of approximately 0.03%. This moisture resistance helps maintain the material's electrical and mechanical stability, minimizing the impact of humidity on the PCB's performance.
Coefficient of Thermal Expansion (CTE): RO4534 exhibits a CTE of 17 ppm/°C in the X-axis and 17 ppm/°C in the Y-axis. These values represent how the material expands or contracts with temperature changes along different axes. The balanced CTE minimizes the risk of mechanical stress and ensures dimensional stability in PCB designs.
Flame Resistance: RO4534 is UL 94V-0 flame-rated, indicating its excellent flame resistance. This feature enhances the safety and reliability of PCBs constructed with this material.
RO4534 is commonly used in applications that require high-frequency performance and reliability, such as telecommunications, aerospace, and automotive industries. It is suitable for applications such as base station amplifiers, power amplifiers, filters, couplers, and other RF/microwave circuit designs where excellent electrical properties, mechanical strength, and thermal stability are vital.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848