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RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates

RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates
RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates

Large Image :  RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Woven Glass Reinforced Hydrocarbon PCB Blog


2 Layer High Frequency PCB Blog


PCB Substrates 32mil

Introducing our high-performance PCB built with Rogers RO4003C woven glass reinforced hydrocarbon/ceramics substrate. This 2-layer rigid PCB offers exceptional electrical performance and is designed for applications requiring higher operating frequencies. With its outstanding features and benefits, it is an ideal choice for a wide range of applications.


The Rogers RO4003C substrate used in this PCB provides low dielectric tolerance and low loss, ensuring stable electrical properties across a range of frequencies. This enables the creation of controlled impedance transmission lines and repeatable designs of filters, ensuring reliable and precise signal transmission.


Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


The PCB's dielectric constant of DK 3.38 +/-0.05 at 10GHz and a dissipation factor of 0.0027 at 10GHz further contribute to its excellent electrical performance. These properties allow for applications with higher operating frequencies and make it suitable for broadband applications.

In terms of thermal properties, the PCB exhibits a low thermal coefficient of dielectric constant and low Z-axis expansion. This ensures excellent dimensional stability and reliable plated through holes. Additionally, the low in-plane expansion coefficient allows the PCB to remain stable throughout various circuit processing temperatures.


The stackup of this PCB consists of two layers with a copper layer thickness of 35 μm on each side. The Rogers 4003C Core has a thickness of 0.813 mm (32mil). It maintains a finished board thickness of 0.9mm and a finished Cu weight of 1oz (1.4 mils) on the outer layers. With a minimum trace/space of 4/5 mils and a minimum hole size of 0.5mm, this PCB offers precise and reliable connectivity.


The PCB is finished with immersion gold surface finish, which provides excellent solderability and corrosion resistance. It features a top silkscreen in white and top solder mask in green. The 0.5mm vias are filled and capped, enhancing the overall reliability of the PCB.


With 47 components and a total of 173 pads, including 92 through-hole pads and 81 top SMT pads, this PCB offers flexibility in component placement. It also includes 151 vias and 5 nets, ensuring efficient signal routing.


The supplied artwork is in Gerber RS-274-X format, and the PCB adheres to the IPC-Class-2 quality standard, ensuring high reliability and performance.


This PCB finds application in various industries, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites.

We are proud to offer this high-quality and competitively priced PCB, available for shipping worldwide. For any technical inquiries or to place an order, please contact


RO4003C 2 Layer High Frequency PCB Blog Built On 32mil Substrates 0

RO4003C: Unleashing High Performance with Advanced PCB Substrate


In the world of printed circuit boards (PCBs), innovation is constantly driving the evolution of electronic devices. One such advancement is the RO4003C, a woven glass reinforced hydrocarbon/ceramics substrate by Rogers Corporation. This cutting-edge PCB material offers exceptional electrical performance, stability, and reliability, making it an ideal choice for applications demanding high operating frequencies. In this article, we will delve into the data sheet of RO4003C and explore its key features and benefits.

PCB Substrates:

The RO4003C substrate boasts remarkable properties that set it apart from conventional materials. With a Dielectric Constant of DK 3.38 +/-0.05 at 10GHz and a Dissipation Factor of 0.0027 at 10GHz, it ensures low dielectric tolerance and low loss, enabling stable electrical properties across a wide frequency range. This characteristic makes the RO4003C suitable for applications that require precise signal transmission and controlled impedance transmission lines.


The thermal conductivity of 0.71 W/m/°K ensures efficient heat dissipation, maintaining optimal operating temperatures for components. The substrate exhibits a Tg (glass transition temperature) higher than 280 °C, ensuring excellent dimensional stability and performance under elevated temperatures.


Furthermore, the RO4003C substrate demonstrates a low Z-axis expansion, resulting in reliable plated through holes and improved overall reliability of the PCB. The material's X, Y, and Z axis CTE (Coefficient of Thermal Expansion) values of 11ppm/°C, 14ppm/°C, and 46ppm/°C, respectively, contribute to its stability over a wide range of circuit processing temperatures.


Features and Benefits:

1. Low dielectric tolerance and low loss:
- Enables applications with higher operating frequencies.
- Ideal for broadband applications.
- Allows for the design of controlled impedance transmission lines and repeatable filters.


2. Stable electrical properties vs. frequency:
- Ensures consistent signal transmission.
- Facilitates the creation of reliable designs.


3. Low thermal coefficient of dielectric constant:
- Provides excellent dimensional stability.
- Ensures reliable performance under varying thermal conditions.


4. Low Z-axis expansion:
- Enhances the reliability of plated through holes.
- Minimizes the risk of failure due to thermal stress.


5. Low in-plane expansion coefficient:
- Maintains stability across different circuit processing temperatures.
- Reduces the risk of warping or distortion.


6. Volume manufacturing process:
- Can be fabricated using standard glass epoxy processes.
- Offers a cost-effective solution for large-scale production.

The RO4003C substrate finds its application in various industries, including:


1. Cellular Base Station Antennas and Power Amplifiers:
- Enables high-frequency signal transmission and reception.
- Ensures stable and reliable performance in demanding wireless communication environments.


2. RF Identification Tags:
- Facilitates efficient and accurate data transmission.
- Supports high-frequency RFID applications.


3. Automotive Radar and Sensors:
- Enables precise detection and measurement in automotive safety systems.
- Ensures reliable performance in harsh environments.


4. LNB's for Direct Broadcast Satellites:
- Enables efficient signal reception and processing in satellite communication systems.
- Supports high-frequency data transmission.


The RO4003C PCB substrate from Rogers Corporation is a game-changer for high-performance electronic applications. Its advanced dielectric properties, stability, and reliability unlock new possibilities for designers and engineers. With exceptional electrical performance, controlled impedance transmission lines, and stable electrical properties across different frequencies, RO4003C empowers the development of cutting-edge electronic devices. Whether it's cellular base stations, RF identification tags, automotive radar, or satellite communication systems, RO4003C is the substrate of choice for those seeking unparalleled performance and reliability in their PCB designs.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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