Product Details:
|
Highlight: | Immersion Gold Composite PCB,Ceramic PTFE Composite PCB,10mil PCB Blog |
---|
We are pleased to present our latest product, the newly shipped Rogers RT/duroid 6010.2LM Ceramic-PTFE Composite PCB. Designed with advanced materials and exceptional manufacturing techniques, this PCB ensures high performance and reliability for a wide range of applications. Let's explore its impressive features and specifications:
1. PCB Material:
- The PCB is constructed using Rogers RT/duroid 6010.2LM ceramic-PTFE composites, known for their superior electrical properties and thermal stability.
- The process dielectric constant (DK) is 10.2 at 10 GHz and 23°C, ensuring precise signal transmission and minimal signal loss.
- With a low dissipation factor of 0.0023 at 10 GHz and 23°C, this PCB minimizes energy loss and maintains signal integrity.
- The PCB material has a high decomposition temperature (Td) of 500°C, ensuring excellent thermal resistance.
- The operating temperature range extends from -40℃ to +85℃, making it suitable for a wide range of environmental conditions.
2. Stackup: 2-Layer Rigid PCB
- The PCB features a 2-layer rigid construction, providing a compact and efficient design solution.
- Copper_layer_1 has a thickness of 35 μm.
- The substrate (RT/duroid 6010.2LM) has a thickness of 0.254 mm (10mil), offering stability and durability.
- Copper_layer_2 has a thickness of 35 μm, ensuring excellent conductivity.
3. Construction Details:
- The board dimensions are 156.76mm x 86.79mm, available in 4 types, with a tolerance of +/- 0.15mm, guaranteeing precise dimensions.
- The PCB supports a minimum trace/space of 4/4 mils, enabling intricate circuit designs.
- The minimum hole size is 0.4mm, facilitating precise component placement.
- There are no blind vias, simplifying the manufacturing process.
- The finished board thickness is 0.37mm, providing a compact and lightweight solution.
- The outer layers have a finished copper weight of 1oz (1.4 mils), ensuring optimal conductivity.
- Via plating thickness is 20 μm, promoting reliable connections.
- The surface finish is immersion gold, offering excellent corrosion resistance and solderability.
- Top and bottom silkscreen are not included, providing a clean and minimalist appearance.
- The top solder mask is green, providing protection and enhancing visibility.
- The bottom solder mask is also green, ensuring consistency and durability.
- All PCBs undergo a 100% electrical test prior to shipment, guaranteeing functionality and reliability.
4. PCB Statistics:
- The PCB supports a total of 97 components, providing ample space for various circuit configurations.
- There are 183 pads in total, including 108 thru-hole pads, 63 top SMT pads, and 12 bottom SMT pads.
- The PCB includes 115 vias, ensuring efficient signal routing.
- With 7 nets available, this PCB accommodates complex circuit connections.
5. Artwork and Standards:
- The PCB artwork is supplied in Gerber RS-274-X format, ensuring compatibility with industry-standard design tools.
- The PCB meets the IPC-Class-2 standard, ensuring high-quality manufacturing and reliability.
6. Availability:
- Our newly shipped PCBs are available worldwide, catering to customers globally.
7. Contact Information:
- For any technical questions or inquiries, please contact Ivy at sales10@bichengpcb.com. Our dedicated team is ready to assist you.
Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
Ultimate Strain | 25 | Z | % | ||
Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D3850 | ||
Density | 3.1 | g/cm3 | ASTM D792 | ||
Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Unleash the Potential of Ceramic-PTFE Composite PCBs: Introducing RT/duroid 6010LM
When it comes to high-performance PCBs, the choice of materials is crucial. We are thrilled to introduce our Ceramic-PTFE composite PCBs, featuring the renowned RT/duroid 6010LM designator. With exceptional dielectric properties and versatile options, these PCBs cater to diverse applications. Let's delve into the key features and specifications of these remarkable PCBs:
1. PCB Material: Ceramic-PTFE Composite
Our PCBs are constructed using a robust Ceramic-PTFE composite material, specifically the RT/duroid 6010LM designator. This composite offers excellent electrical characteristics and thermal stability, making it ideal for demanding circuitry.
2. Dielectric Constant:
The dielectric constant of our Ceramic-PTFE composite PCBs is 10.2 ± 0.25 in the manufacturing process. For design purposes, the dielectric constant stands at 10.7, ensuring precise signal transmission and minimizing signal loss.
3. Layer Count: 1 Layer, 2 Layer
Our PCBs are available in both 1-layer and 2-layer configurations, providing flexibility for various design requirements. Whether you need a simple single-layer design or a more complex double-layer circuitry, our Ceramic-PTFE composite PCBs have got you covered.
4. Copper Weight:
We offer multiple options for copper weight, allowing you to tailor the PCB to your specific needs. Choose from 0.5oz (17 μm), 1oz (35μm), or 2oz (70μm) copper weight, depending on your desired conductivity and power requirements.
PCB Material: | Ceramic-PTFE composite |
Designator: | RT/duroid 6010LM |
Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
5. Dielectric Thickness:
Our Ceramic-PTFE composite PCBs are available in various dielectric thicknesses, accommodating different circuit designs. Choose from 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), or 75mil (1.90mm) dielectric thicknesses, enabling you to optimize the PCB for your specific application.
6. PCB Size:
Our Ceramic-PTFE composite PCBs support a maximum size of ≤400mm X 500mm, offering ample space for your circuitry. Whether you need a compact PCB or a larger one, we have the size options to fulfill your requirements.
7. Solder Mask:
We provide a range of solder mask color options to suit your aesthetic and functional preferences. Choose from classic Green, sleek Black, vibrant Blue, vivid Yellow, or striking Red solder masks. These options allow for easy identification and ensure efficient assembly and soldering processes.
8. Surface Finish:
To meet diverse needs, we offer various surface finish options for our Ceramic-PTFE composite PCBs:
- Bare copper: Ideal for specialized applications requiring direct copper contact.
- HASL (Hot Air Solder Leveling): A cost-effective and widely used surface finish.
- ENIG (Electroless Nickel Immersion Gold): Ensures excellent solderability and corrosion resistance.
- Immersion tin: Provides a flat and even surface for soldering.
- Immersion silver: Offers superior conductivity and excellent surface planarity.
- OSP (Organic Solderability Preservative): Provides a protective layer for soldering and shelf life.
Our surface finish options cater to different assembly processes, environmental conditions, and budget considerations, ensuring the optimal solution for your PCB needs.
Experience the Power of Ceramic-PTFE Composite PCBs
With our Ceramic-PTFE composite PCBs featuring the RT/duroid 6010LM designator, you can unlock the full potential of your electronic designs. These PCBs offer exceptional dielectric properties, versatility in layer count and copper weight, and a wide range of size options. Customize your PCB with various solder mask colors and select the ideal surface finish for your application. Trust in the reliability and performance of our Ceramic-PTFE composite PCBs to take your projects to new heights.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848