Introducing our high-performance 6-layer RF PCB, expertly crafted from RO4350B and enhanced with RO4450F bondply. This PCB is designed for applications requiring superior electrical performance and reliability, making it an excellent choice for a variety of advanced electronic devices.
Material Composition
1. RO4350B Core:
- This proprietary material features woven glass reinforcement combined with hydrocarbon and ceramic composites. It offers excellent electrical performance while simplifying manufacturing processes compared to traditional PTFE materials. Key characteristics include:
- Dielectric Constant: DK 3.48 ±0.05 at 10GHz/23°C
- Dissipation Factor: 0.0037 at 10GHz/23°C
- Thermal Conductivity: 0.69 W/m/°K
- High Tg Value: >280 °C, making it suitable for high-temperature applications
- Low Water Absorption: 0.06%
2. RO4450F Bondply:
- This bondply is engineered for compatibility with multilayer constructions, enhancing the overall structural integrity of the PCB. Its features include:
- Dielectric Constant: DK 3.52 ±0.05 at 10GHz/23°C
- Dissipation Factor: 0.004 at 10GHz/23°C
- Thermal Conductivity: 0.65 W/m/°K
Detailed Specifications
- Layer Count: 6 layers
- Board Dimensions: 98.5 mm x 68 mm (± 0.15mm)
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- Blind Vias: L1-L2, L3-L6, L5-L6 (mechanical drill)
- Finished Board Thickness: 1.8mm
- Finished Copper Weight: 1oz (1.4 mils) for both inner and outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Silkscreen: White (Top and Bottom)
- Solder Mask: Green (Top and Bottom)
- Quality Assurance: 100% electrical testing before shipment
Artwork and Standards
- Type of Artwork Supplied: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide
| RO4350B Typical Value |
| Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
| Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
|
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Flexural Strength |
255
(37) |
|
MPa
(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
| Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
| Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
| Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
| Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
| Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
| Copper Peel Stength |
0.88
(5.0) |
|
N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
(3)V-0 |
|
|
|
UL 94 |
| Lead-free Process Compatible |
Yes |
|
|
|
|
Advantages
1. Exceptional Electrical Performance
The unique combination of RO4350B and RO4450F materials ensures minimal signal loss and superior signal integrity, making this PCB ideal for high-frequency applications. The precise control over dielectric constants allows for effective impedance matching, essential for RF designs.
2. Enhanced Thermal Management
The high Tg value and low coefficient of thermal expansion (CTE) of the materials enable the PCB to withstand thermal stresses associated with high-power operations. Efficient thermal conductivity aids in heat dissipation, promoting reliability in demanding conditions.
3. Streamlined Manufacturing Process
The RO4450F bondply is compatible with conventional FR-4 manufacturing processes, simplifying production and reducing costs. This PCB does not require specialized treatments, making it easier to produce while ensuring high quality.
4. Versatility in Design
The hybrid construction provides flexibility in material usage, allowing engineers to optimize performance for specific sections of the PCB while maintaining cost-effectiveness. This adaptability facilitates the design of intricate circuits without compromising performance.
Typical Applications
This PCB is ideally suited for a range of high-tech applications, including:
- Cellular Base Station Antennas and Power Amplifiers: Ensuring reliable communication for mobile networks.
- RF Identification Tags: Enabling efficient tracking and identification in various sectors.
- Automotive Radar and Sensors: Enhancing safety and navigation systems in vehicles.
- LNBs for Direct Broadcast Satellites: Providing high-quality signal reception for satellite communications.
Conclusion
This multilayer PCB is a premium choice for engineers and manufacturers in need of reliable, high-performance solutions for advanced electronic applications. With outstanding electrical performance, efficient thermal management, and streamlined manufacturing processes, this PCB is equipped to meet the rigorous demands of contemporary technology.
For further details or to discuss your specific needs, please reach out to our sales team. Discover the potential of our cutting-edge RF PCB solutions and take your electronic designs to the next level!
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