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25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold

25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold
25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold 25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold

Large Image :  25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

RF PCB Substrates


25mil RF PCB Blog


2 Layer Rigid PCB Blog

Introducing our newly shipped PCB, designed to meet the highest standards in performance and reliability. With advanced features and exceptional substrate materials, this PCB offers unmatched circuit performance for a wide range of applications.


1. PCB Substrates:
Crafted with Rogers RT/duroid 6006 ceramic-PTFE composites, this PCB substrate offers superior characteristics:
- DK of 6.15 +/- 0.15 at 10 GHz/23°C, enabling circuit size reduction.
- Dissipation factor of 0.0027 at 10 GHz/23°C, ensuring low loss and optimal performance at X-band or below.
- Td > 500 °C TGA, providing high thermal stability.
- Moisture absorption of only 0.05%, enhancing durability.
- Controlled thermal expansion coefficients (CTE) of 47 ppm/°C (X-axis), 34 ppm/°C (Y-axis), and 117 ppm/°C (Z-axis), maintaining stability under varying conditions.


2. Features:
Our PCB comes packed with features that guarantee consistent and reliable circuit performance:
- Tight εr and thickness control for repeatable results.
- Clad with standard and reverse treated electrodeposited copper foil for optimal signal transmission.
- Reliable plated through-holes in multi-layer boards, ensuring secure connections.


3. Stackup:
This PCB follows a 2-layer rigid construction:
- Copper layer 1: 35 μm
- RT/duroid 6006: 0.635 mm (25 mil)
- Copper layer 2: 35 μm


4. Construction details:
- Board dimensions: 114mm x 60mm (14PCS), with a tolerance of +/- 0.15mm.
- Minimum Trace/Space: 5/7 mils, allowing for intricate circuit designs.
- Minimum Hole Size: 0.25mm, facilitating versatile component integration.
- Finished board thickness: 0.8mm, balancing durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity.
- Via plating thickness: 20 μm, promoting robust connections.
- Surface finish: Immersion Gold, providing excellent corrosion resistance.
- Top Silkscreen: White, enabling clear component identification.
- Bottom Silkscreen: No.
- Top Solder Mask: Green, safeguarding against solder bridging.
- Bottom Solder Mask: No.
- 100% Electrical test used prior to shipment, ensuring quality and reliability.


5. PCB Statistics:
- Components: 6
- Total Pads: 38
- Thru Hole Pads: 15
- Top SMT Pads: 23
- Bottom SMT Pads: 0
- Vias: 27
- Nets: 3


6. Artwork and Standards:
The PCB artwork is supplied in Gerber RS-274-X format. It complies with the IPC-Class-2 standard, guaranteeing high-quality manufacturing.


7. Availability:
Our PCB is readily available worldwide, making it accessible for your project's needs.


8. Typical Applications:
This versatile PCB finds applications in various industries, including:
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems


Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23 IPC-TM-650 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650
Thermal Coefficient of ε -410 Z ppm/ -50-170 IPC-TM-650
Volume Resistivity 7 x 107 A IPC
Surface Resistivity 2 x 107   Mohm A IPC
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50/7MPa 24hr/150/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50 0.050"(1.27mm) thick IPC-TM-650
Thermal Conductivity 0.49   W/m/k 80 ASTM C518
Coefficient of Thermal Expansion 47
ppm/ 23/50% RH IPC-TM-650 2.4.41
Td 500   TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


RT duroid 6006: Unleashing the Power of Advanced Circuit Substrates


In the world of high-performance PCBs, the RT duroid 6006 stands out as a cutting-edge substrate solution. With its exceptional dielectric properties and robust construction, this substrate opens up a realm of possibilities for engineers and designers alike. Let's delve into the remarkable features and characteristics that make the RT duroid 6006 a game-changer in the industry.


One of the standout features of the RT duroid 6006 is its impressive dielectric constant (ε). With a process-controlled value of 6.15 ± 0.15 at 10 GHz/23°C, this substrate enables circuit size reduction without compromising performance. For more demanding applications in the 8 GHz to 40 GHz range, the ε design value of 6.45 ensures consistent performance using the Differential Phase Length Method.


In addition to its exceptional dielectric properties, the RT duroid 6006 boasts an incredibly low dissipation factor (tanδ) of 0.0027 at 10 GHz/A, ensuring minimal signal loss and high signal integrity. This characteristic makes it an ideal choice for operating at X-band frequencies or below. The substrate's thermal coefficient of ε, with a value of -410 ppm/°C from -50°C to 170°C, guarantees stability and reliable performance across a wide temperature range.


When it comes to mechanical properties, the RT duroid 6006 demonstrates exceptional performance. With a Young's modulus of 627 MPa (91 kpsi) in the X-axis and 517 MPa (75 kpsi) in the Y-axis, this substrate delivers outstanding stiffness and rigidity. Its ultimate stress values of 20 MPa (2.8 kpsi) in the X-axis and 17 MPa (2.5 kpsi) in the Y-axis ensure the substrate can withstand demanding conditions. Furthermore, the substrate exhibits ultimate strain values of 12% to 13% in the X-axis and 4% to 6% in the Y-axis, making it resistant to deformation under load.


The RT duroid 6006 also excels in compressive properties, with a Young's modulus of 1069 MPa (115 kpsi) in the Z-axis and an ultimate stress of 54 MPa (7.9 kpsi). This exceptional compressive strength guarantees the substrate's reliability under heavy loads. Additionally, its flexural modulus values of 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis, coupled with an ultimate stress of 38 MPa (5.5 kpsi), make it ideal for applications with demanding bending requirements.


With a moisture absorption rate of only 0.05%, the RT duroid 6006 maintains its electrical and mechanical properties even in humid environments. Its thermal conductivity of 0.49 W/m/k at 80°C ensures efficient heat dissipation, making it suitable for applications with high thermal loads. The substrate's coefficient of thermal expansion values of 47 ppm/°C (X-axis), 34 ppm/°C (Y-axis), and 117 ppm/°C (Z-axis) guarantees dimensional stability and compatibility with other components.


PCB Material: Ceramic-PTFE Composites
Designation: RT/duroid 6006
Dielectric constant: 6.15
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Furthermore, the RT duroid 6006 exhibits excellent flame resistance with a V-0 rating according to UL 94 standards. It is also compatible with lead-free processes, ensuring compliance with environmental regulations.


25mil RT Duroid 6006 RF PCB Blog With Green Solder Mask And Immersion Gold 0


Available worldwide, the RT duroid 6006 opens up a world of possibilities across various industries and applications. Whether it's patch antennas, satellite communication systems, power amplifiers, or aircraft collision avoidance systems, this substrate empowers engineers to push the boundaries of technological innovation.


For technical inquiries or to explore the potential of the RT duroid 6006 in your project, please contact our dedicated sales team at Unleash the power of advanced circuit substrates with the RT duroid 6006 and elevate your designs to new heights of performance and reliability.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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