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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

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Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

Large Image :  12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Contact Now

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

Description
Base Material: Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) Layer Count: 12 Layers
PCB Thickness: 2.12mm PCB Size: 220mm X 60mm Per Unit (tolerance: ±0.15mm)
Silkscreen: White Solder Mask: Blue
Copper Weight: Outer Layers (L1, L12): 1oz (1.4 Mils / 35μm)Inner Layers: 0.5oz (0.7 Mils / 17μm) Or 1oz (35μm) (per Stack-up) Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Highlight:

12-layer M6 PCB with ENIG

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impedance control multilayer circuit board

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high speed PCB with warranty

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775--an advanced high-speed, low-loss copper-clad laminate (CCL)--to deliver exceptional signal integrity and reliability for demanding high-frequency applications.

PCB Details
Parameter Specification
Layer Count 12-layer rigid PCB
Base Material Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions 220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness 2.12mm
Copper Weight Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)
Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness 25μm
Minimum Trace/Space 3 mils / 3 mils
Minimum Hole Size 0.2mm
Vias 459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen Top (L1): White; Bottom (L12): White
Solder Mask Top (L1): Blue; Bottom (L12): Blue
Quality Assurance 100% Electrical test prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-3
Precise PCB Stack-up
Layer Type Specification Thickness
Copper Layer (Outer Top - L1) Copper_layer_1 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Inner - L2) Copper_layer_2 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L3) Copper_layer_3 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.9μm
Copper Layer (Inner - L4) Copper_layer_4 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L5) Copper_layer_5 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 216.5μm
Copper Layer (Inner - L6) Copper_layer_6 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 400μm (thick core for stability)
Copper Layer (Inner - L7) Copper_layer_7 35μm (1oz)
Prepreg R-5670(G) 3313 (59%) × 2 215.6μm
Copper Layer (Inner - L8) Copper_layer_8 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L9) Copper_layer_9 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.8μm
Copper Layer (Inner - L10) Copper_layer_10 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L11) Copper_layer_11 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Outer Bottom - L12) Copper_layer_12 35μm (1oz)
Critical Impedance Control (50 Ohm Single-Ended)
Impedance ID Configuration Layer Trace Width Reference Layers Target Impedance
Impedance-1 Single-Ended L1 (Top Outer) 5.71 mils Down: L2 50 Ohms
Impedance-2 Single-Ended L3 (Inner) 4.31 mils Upper: L2; Down: L4 50 Ohms
Impedance-3 Single-Ended L5 (Inner) 4.71 mils Upper: L4; Down: L7 50 Ohms
Impedance-4 Single-Ended L8 (Inner) 4.51 mils Upper: L7; Down: L9 50 Ohms
Impedance-5 Single-Ended L10 (Inner) 4.31 mils Upper: L9; Down: L11 50 Ohms
12-layer M6 PCB board close-up showing blue solder mask and gold-plated contacts
Megtron6 (M6) R-5775 Material Overview

Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability--enabling seamless transmission of high-speed signals with minimal attenuation.

As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4-30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.

Key Features of Megtron6 (M6) R-5775
Property Specification
Dielectric Constant (Dk) 3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df) 0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE) X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg) >185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td) 410°C (TGA method)
Layer Support 4-30 layer multilayer PCB designs
Environmental Compliance RoHS-compliant; Halogen-free
Manufacturing Compatibility Traditional FR-4 processing (no special equipment required)
Flammability Rating UL 94 V-0
Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

  • 5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
  • Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
  • Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
  • Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
  • Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.
12-layer M6 PCB in application showing mounted components and connections

Tag:

1oz Medical Equipment PCB,

1oz Immersion Gold PCB,

Tg150 FR4 Medical Equipment PCB

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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