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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board
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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board
  • name

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Layer Count:
12 Layers
PCB Thickness:
2.12mm
PCB Size:
220mm X 60mm Per Unit (tolerance: ±0.15mm)
Silkscreen:
White
Solder Mask:
Blue
Copper Weight:
Outer Layers (L1, L12): 1oz (1.4 Mils / 35μm)Inner Layers: 0.5oz (0.7 Mils / 17μm) Or 1oz (35μm) (per Stack-up)
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Highlight:

12-layer M6 PCB with ENIG

,

impedance control multilayer circuit board

,

high speed PCB with warranty

Product Description
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775--an advanced high-speed, low-loss copper-clad laminate (CCL)--to deliver exceptional signal integrity and reliability for demanding high-frequency applications.

PCB Details
Parameter Specification
Layer Count 12-layer rigid PCB
Base Material Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions 220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness 2.12mm
Copper Weight Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)
Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness 25μm
Minimum Trace/Space 3 mils / 3 mils
Minimum Hole Size 0.2mm
Vias 459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen Top (L1): White; Bottom (L12): White
Solder Mask Top (L1): Blue; Bottom (L12): Blue
Quality Assurance 100% Electrical test prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-3
Precise PCB Stack-up
Layer Type Specification Thickness
Copper Layer (Outer Top - L1) Copper_layer_1 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Inner - L2) Copper_layer_2 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L3) Copper_layer_3 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.9μm
Copper Layer (Inner - L4) Copper_layer_4 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L5) Copper_layer_5 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 216.5μm
Copper Layer (Inner - L6) Copper_layer_6 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 400μm (thick core for stability)
Copper Layer (Inner - L7) Copper_layer_7 35μm (1oz)
Prepreg R-5670(G) 3313 (59%) × 2 215.6μm
Copper Layer (Inner - L8) Copper_layer_8 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L9) Copper_layer_9 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.8μm
Copper Layer (Inner - L10) Copper_layer_10 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L11) Copper_layer_11 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Outer Bottom - L12) Copper_layer_12 35μm (1oz)
Critical Impedance Control (50 Ohm Single-Ended)
Impedance ID Configuration Layer Trace Width Reference Layers Target Impedance
Impedance-1 Single-Ended L1 (Top Outer) 5.71 mils Down: L2 50 Ohms
Impedance-2 Single-Ended L3 (Inner) 4.31 mils Upper: L2; Down: L4 50 Ohms
Impedance-3 Single-Ended L5 (Inner) 4.71 mils Upper: L4; Down: L7 50 Ohms
Impedance-4 Single-Ended L8 (Inner) 4.51 mils Upper: L7; Down: L9 50 Ohms
Impedance-5 Single-Ended L10 (Inner) 4.31 mils Upper: L9; Down: L11 50 Ohms
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board 0
Megtron6 (M6) R-5775 Material Overview

Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability--enabling seamless transmission of high-speed signals with minimal attenuation.

As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4-30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.

Key Features of Megtron6 (M6) R-5775
Property Specification
Dielectric Constant (Dk) 3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df) 0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE) X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg) >185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td) 410°C (TGA method)
Layer Support 4-30 layer multilayer PCB designs
Environmental Compliance RoHS-compliant; Halogen-free
Manufacturing Compatibility Traditional FR-4 processing (no special equipment required)
Flammability Rating UL 94 V-0
Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

  • 5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
  • Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
  • Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
  • Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
  • Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board 1
Tags: 

1oz Medical Equipment PCB,  

1oz Immersion Gold PCB,  

Tg150 FR4 Medical Equipment PCB

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Products
PRODUCTS DETAILS
Products

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Rogers PCB Board

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High Speed PCB

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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board
  • name
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Layer Count:
12 Layers
PCB Thickness:
2.12mm
PCB Size:
220mm X 60mm Per Unit (tolerance: ±0.15mm)
Silkscreen:
White
Solder Mask:
Blue
Copper Weight:
Outer Layers (L1, L12): 1oz (1.4 Mils / 35μm)Inner Layers: 0.5oz (0.7 Mils / 17μm) Or 1oz (35μm) (per Stack-up)
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

12-layer M6 PCB with ENIG

,

impedance control multilayer circuit board

,

high speed PCB with warranty

Product Description
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775--an advanced high-speed, low-loss copper-clad laminate (CCL)--to deliver exceptional signal integrity and reliability for demanding high-frequency applications.

PCB Details
Parameter Specification
Layer Count 12-layer rigid PCB
Base Material Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions 220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness 2.12mm
Copper Weight Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)
Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness 25μm
Minimum Trace/Space 3 mils / 3 mils
Minimum Hole Size 0.2mm
Vias 459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen Top (L1): White; Bottom (L12): White
Solder Mask Top (L1): Blue; Bottom (L12): Blue
Quality Assurance 100% Electrical test prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-3
Precise PCB Stack-up
Layer Type Specification Thickness
Copper Layer (Outer Top - L1) Copper_layer_1 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Inner - L2) Copper_layer_2 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L3) Copper_layer_3 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.9μm
Copper Layer (Inner - L4) Copper_layer_4 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L5) Copper_layer_5 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 216.5μm
Copper Layer (Inner - L6) Copper_layer_6 35μm (1oz)
Megtron6 Core M6 Core R5775G(HVLP) 400μm (thick core for stability)
Copper Layer (Inner - L7) Copper_layer_7 35μm (1oz)
Prepreg R-5670(G) 3313 (59%) × 2 215.6μm
Copper Layer (Inner - L8) Copper_layer_8 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L9) Copper_layer_9 17μm (0.5oz)
Prepreg R-5670(G) 3313 (59%) × 2 219.8μm
Copper Layer (Inner - L10) Copper_layer_10 17μm (0.5oz)
Megtron6 Core M6 Core R5775G(HVLP) 75μm
Copper Layer (Inner - L11) Copper_layer_11 35μm (1oz)
Prepreg R-5670(G) 1080 (68%) × 1 81.4μm
Copper Layer (Outer Bottom - L12) Copper_layer_12 35μm (1oz)
Critical Impedance Control (50 Ohm Single-Ended)
Impedance ID Configuration Layer Trace Width Reference Layers Target Impedance
Impedance-1 Single-Ended L1 (Top Outer) 5.71 mils Down: L2 50 Ohms
Impedance-2 Single-Ended L3 (Inner) 4.31 mils Upper: L2; Down: L4 50 Ohms
Impedance-3 Single-Ended L5 (Inner) 4.71 mils Upper: L4; Down: L7 50 Ohms
Impedance-4 Single-Ended L8 (Inner) 4.51 mils Upper: L7; Down: L9 50 Ohms
Impedance-5 Single-Ended L10 (Inner) 4.31 mils Upper: L9; Down: L11 50 Ohms
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board 0
Megtron6 (M6) R-5775 Material Overview

Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability--enabling seamless transmission of high-speed signals with minimal attenuation.

As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4-30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.

Key Features of Megtron6 (M6) R-5775
Property Specification
Dielectric Constant (Dk) 3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df) 0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE) X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg) >185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td) 410°C (TGA method)
Layer Support 4-30 layer multilayer PCB designs
Environmental Compliance RoHS-compliant; Halogen-free
Manufacturing Compatibility Traditional FR-4 processing (no special equipment required)
Flammability Rating UL 94 V-0
Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

  • 5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
  • Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
  • Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
  • Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
  • Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.
12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board 1
Tags: 

1oz Medical Equipment PCB,

1oz Immersion Gold PCB,

Tg150 FR4 Medical Equipment PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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