Product Details:
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Base Material: | FR-4 | Layer Count: | 2 Layers |
---|---|---|---|
PCB Thickness: | 1.0mm ±0.1 | PCB Size: | 120 X 79mm=4PCS |
Solder Mask: | Green | Silkscreen: | White |
Copper Weight: | 1oz | Surface Finish: | Immersion Silver |
High Light: | 1.0mm 2 Layer Circuit Board,ITEQ FR4 2 Layer Circuit Board,ITEQ FR4 Immersion Silver PCB |
PCB SIZE | 120 x 79mm=4PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layes |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 17.8um(0.5oz)+PLATE |
FR-4 0.8mm | |
copper ------- 17.8um(0.5oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minimum / Maximum Holes: | 0.5/3.8mm |
Number of Different Holes: | 4 |
Number of Drill Holes: | 135 |
Number of Milled Slots: | 1 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-180A TG>170 |
Final foil external: | 1oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.0mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Silver, Ag>0.15µm |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
1. After Thermal Stress | ||||||
2. At 125°C [257 F] | ||||||
3. After Process Solutions | 1.23 (7.0) | 0.80 (4.57) | 1.40 (8.0) | 1.05 (6.00) | ||
1.05 (6.0) | 0.70 (4.00) | 1.23 (7.0) | 0.70 (4.00) | |||
1.05 (6.0) | 0.55 (3.14) | 1.23 (7.0) | 0.80 (4.57) | |||
Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
A. C-96/35/90 | 3.0x1010 | 106 | -- | -- | ||
B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
C. At elevated temperature E-24/125 | 5.0x1010 | 103 | 1.0x1010 | 103 | ||
Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
A. C-96/35/90 | 3.0x1010 | 104 | -- | -- | ||
B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
C. At elevated temperature E-24/125 | 4.0x1010 | 103 | 4.0x1010 | 103 | ||
Moisture Absorption, maximum | -- | -- | 0.12 | 0.8 | % | 2.6.2.1 |
Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
Permittivity (Dk, 50% resin content) | 5.4 | 5.4 | -- | |||
(Laminate & Laminated Prepreg) | ||||||
A. 1MHz | 4.4 | 4.4 | 2.5.5.9 | |||
B. 1GHz | 4.4 | 4.4 | ||||
C. 2GHz | 4.2 | 4.3 | 2.5.5.13 | |||
D. 5GHz | 4.1 | 4.1 | ||||
E. 10GHz | 4 | 4.1 | ||||
Loss Tangent (Df, 50% resin content) | 0.035 | 0.035 | -- | |||
(Laminate & Laminated Prepreg) | ||||||
A. 1MHz | 0.015 | 0.014 | 2.5.5.9 | |||
B. 1GHz | 0.015 | 0.015 | ||||
C. 2GHz | 0.015 | 0.015 | 2.5.5.13 | |||
D. 5GHz | 0.016 | 0.016 | ||||
E. 10GHz | 0.017 | 0.016 | ||||
Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
-- | -- | (72,500-76,850) | -60,190 | |||
B. Cross direction | -- | -- | 410-440 | 345 | ||
-- | -- | (59,450-63,800) | -50,140 | |||
Arc Resistance, minimum | 125 | 60 | 125 | 60 | s | 2.5.1 |
Thermal Stress 10 s at 288°C [550.4F],minimum | Rating | 2.4.13.1 | ||||
A. Unetched | Pass | Pass Visual | Pass | Pass Visual | ||
B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
(Laminate & Laminated Prepreg) | ||||||
Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
(Laminate & Laminated Prepreg) | ||||||
Glass Transition Temperature(DSC) | 175 | 170 minimum | 175 | 170 minimum | ˚C | 2.4.25 |
Decomposition Temperature | -- | -- | 345 | 340 minimum | ˚C | 2.4.24.6 |
(5% wt loss) | ||||||
X/Y Axis CTE (40℃ to 125℃) | -- | -- | 10--13 | -- | PPM/˚C | 2.4.24 |
Z-Axis CTE | 2.4.24 | |||||
A. Alpha 1 | -- | -- | 45 | 60 maximum | PPM/˚C | |
B. Alpha 2 | -- | -- | 210 | 300 maximum | PPM/˚C | |
C. 50 to 260 Degrees C | -- | -- | 2.7 | 3.0 maximum | % | |
Thermal Resistance | 2.4.24.1 | |||||
A. T260 | -- | -- | >60 | 30 minimum | Minutes | |
B. T288 | -- | -- | >30 | 15 minimum | Minutes | |
CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848