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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

Large Image :  1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-470.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 2 Layers
PCB Thickness: 1.0mm ±0.1 PCB Size: 120 X 79mm=4PCS
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Silver
High Light:

1.0mm 2 Layer Circuit Board

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ITEQ FR4 2 Layer Circuit Board

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ITEQ FR4 Immersion Silver PCB

 
Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit Board for USB Charger
 
1.1 General description
This is a type of 2 layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of USB charger. It's 1.0 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 4 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 panels are packed for shipment.
 
1.2 Features and benifits
Outstanding thermal resistance and suitable for lead-free process
Can be horizontal operation and has high efficiency
AOI inspection
Meeting your PCB needs from prototype to mass production.
12 hours quotation
Prototype PCB capability
 
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB 0
 
1.3 Application
Router Wireless
Bluetooth Adapter For PC
Motor Controller
GSM Tracking
Modem HSDPA
 
1.4 Parameter and data sheet
PCB SIZE 120 x 79mm=4PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layes
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+PLATE
FR-4 0.8mm
copper ------- 17.8um(0.5oz)+PLATE
TECHNOLOGY  
Minimum Trace and Space: 4mil/4mil
Minimum / Maximum Holes: 0.5/3.8mm
Number of Different Holes: 4
Number of Drill Holes: 135
Number of Milled Slots: 1
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-180A TG>170
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 1.0mm ±0.1
PLATING AND COATING  
Surface Finish Immersion Silver, Ag>0.15µm
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB 1
 
1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
Property Thickness<0.50 mm Thickness≧0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum         N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]         (lb/inch) 2.4.8.2
B. Standard profile copper foil 0.88 (5.0) 0.70 (4.00) 0.88 (5.0) 0.70 (4.00)   2.4.8.3
1. After Thermal Stress            
2. At 125°C [257 F]            
3. After Process Solutions 1.23 (7.0) 0.80 (4.57) 1.40 (8.0) 1.05 (6.00)    
  1.05 (6.0) 0.70 (4.00) 1.23 (7.0) 0.70 (4.00)    
  1.05 (6.0) 0.55 (3.14) 1.23 (7.0) 0.80 (4.57)    
Volume Resistivity, minimum         MW-cm 2.5.17.1
A. C-96/35/90 3.0x1010 106 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 5.0x1010 103 1.0x1010 103
Surface Resistivity, minimum         MW 2.5.17.1
A. C-96/35/90 3.0x1010 104 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 4.0x1010 103 4.0x1010 103
Moisture Absorption, maximum -- -- 0.12 0.8 % 2.6.2.1
Dielectric Breakdown, minimum -- -- 60 40 kV 2.5.6
Permittivity (Dk, 50% resin content)   5.4   5.4 --  
(Laminate & Laminated Prepreg)      
A. 1MHz 4.4 4.4 2.5.5.9
B. 1GHz 4.4 4.4  
C. 2GHz 4.2 4.3 2.5.5.13
D. 5GHz 4.1 4.1  
E. 10GHz 4 4.1  
Loss Tangent (Df, 50% resin content)   0.035   0.035 --  
(Laminate & Laminated Prepreg)      
A. 1MHz 0.015 0.014 2.5.5.9
B. 1GHz 0.015 0.015  
C. 2GHz 0.015 0.015 2.5.5.13
D. 5GHz 0.016 0.016  
E. 10GHz 0.017 0.016  
Flexural Strength, minimum         N/mm2 2.4.4
A. Length direction -- -- 500-530 415 (lb/in2)
  -- -- (72,500-76,850) -60,190  
B. Cross direction -- -- 410-440 345  
  -- -- (59,450-63,800) -50,140  
Arc Resistance, minimum 125 60 125 60 s 2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum         Rating 2.4.13.1
A. Unetched Pass Pass Visual Pass Pass Visual
B. Etched Pass Pass Visual Pass Pass Visual
Electric Strength, minimum 45 30 -- -- kV/mm 2.5.6.2
(Laminate & Laminated Prepreg)
Flammability, V-0 V-0 V-0 V-0 Rating UL94
(Laminate & Laminated Prepreg)
Glass Transition Temperature(DSC) 175 170 minimum 175 170 minimum ˚C 2.4.25
Decomposition Temperature -- -- 345 340 minimum ˚C 2.4.24.6
(5% wt loss)
X/Y Axis CTE (40℃ to 125℃) -- -- 10--13 -- PPM/˚C 2.4.24
Z-Axis CTE           2.4.24
A. Alpha 1 -- -- 45 60 maximum PPM/˚C
B. Alpha 2 -- -- 210 300 maximum PPM/˚C
C. 50 to 260 Degrees C -- -- 2.7 3.0 maximum %
Thermal Resistance           2.4.24.1
A. T260 -- -- >60 30 minimum Minutes
B. T288 -- -- >30 15 minimum Minutes
CAF Resistance -- -- Pass AABUS Pass/Fail 2.6.25

 

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