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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-470.V1.0

Base Material:

Layer Count:

2 Layers

PCB Thickness:

1.0mm ±0.1

PCB Size:

120 X 79mm=4PCS

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

Surface Finish:

Immersion Silver

Highlight:

1.0mm 2 Layer Circuit Board

ITEQ FR4 2 Layer Circuit Board

ITEQ FR4 Immersion Silver PCB

Product Description

Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit Board for USB Charger

1.1 General description

This is a type of 2 layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of USB charger. It's 1.0 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 4 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 panels are packed for shipment.

1.2 Features and benifits

Outstanding thermal resistance and suitable for lead-free process

Can be horizontal operation and has high efficiency

AOI inspection

Meeting your PCB needs from prototype to mass production.

12 hours quotation

Prototype PCB capability

1.3 Application

Router Wireless

Bluetooth Adapter For PC

Motor Controller

GSM Tracking

Modem HSDPA

1.4 Parameter and data sheet

PCB SIZE	120 x 79mm=4PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layes
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17.8um(0.5oz)+PLATE
	FR-4 0.8mm
	copper ------- 17.8um(0.5oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minimum / Maximum Holes:	0.5/3.8mm
Number of Different Holes:	4
Number of Drill Holes:	135
Number of Milled Slots:	1
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180A TG>170
Final foil external:	1oz
Final foil internal:	0oz
Final height of PCB:	1.0mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Silver, Ag>0.15µm
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

Property	Thickness<0.50 mm		Thickness≧0.50 mm		Units	Test Method
	[0.0197 in]		[0.0197 in]		Units	Test Method
	Typical Value	Spec	Typical Value	Spec	Metric	IPC-TM-650
	Typical Value	Spec	Typical Value	Spec	(English)	(or as noted)
Peel Strength, minimum					N/mm	2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]					(lb/inch)	2.4.8.2
B. Standard profile copper foil	0.88 (5.0)	0.70 (4.00)	0.88 (5.0)	0.70 (4.00)		2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions	1.23 (7.0)	0.80 (4.57)	1.40 (8.0)	1.05 (6.00)
	1.05 (6.0)	0.70 (4.00)	1.23 (7.0)	0.70 (4.00)
	1.05 (6.0)	0.55 (3.14)	1.23 (7.0)	0.80 (4.57)
Volume Resistivity, minimum					MW-cm	2.5.17.1
A. C-96/35/90	3.0x10¹⁰	106	--	--
B. After moisture resistance	--	--	3.0x10¹⁰	104
C. At elevated temperature E-24/125	5.0x10¹⁰	103	1.0x10¹⁰	103
Surface Resistivity, minimum					MW	2.5.17.1
A. C-96/35/90	3.0x10¹⁰	104	--	--
B. After moisture resistance	--	--	3.0x10¹⁰	104
C. At elevated temperature E-24/125	4.0x10¹⁰	103	4.0x10¹⁰	103
Moisture Absorption, maximum	--	--	0.12	0.8	%	2.6.2.1
Dielectric Breakdown, minimum	--	--	60	40	kV	2.5.6
Permittivity (Dk, 50% resin content)		5.4		5.4	--
(Laminate & Laminated Prepreg)
A. 1MHz	4.4		4.4			2.5.5.9
B. 1GHz	4.4		4.4
C. 2GHz	4.2		4.3			2.5.5.13
D. 5GHz	4.1		4.1
E. 10GHz	4		4.1
Loss Tangent (Df, 50% resin content)		0.035		0.035	--
(Laminate & Laminated Prepreg)
A. 1MHz	0.015		0.014			2.5.5.9
B. 1GHz	0.015		0.015
C. 2GHz	0.015		0.015			2.5.5.13
D. 5GHz	0.016		0.016
E. 10GHz	0.017		0.016
Flexural Strength, minimum					N/mm²	2.4.4
A. Length direction	--	--	500-530	415	(lb/in²)
	--	--	(72,500-76,850)	-60,190
B. Cross direction	--	--	410-440	345
	--	--	(59,450-63,800)	-50,140
Arc Resistance, minimum	125	60	125	60	s	2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum					Rating	2.4.13.1
A. Unetched	Pass	Pass Visual	Pass	Pass Visual
B. Etched	Pass	Pass Visual	Pass	Pass Visual
Electric Strength, minimum	45	30	--	--	kV/mm	2.5.6.2
(Laminate & Laminated Prepreg)	45	30	--	--	kV/mm	2.5.6.2
Flammability,	V-0	V-0	V-0	V-0	Rating	UL94
(Laminate & Laminated Prepreg)	V-0	V-0	V-0	V-0	Rating	UL94
Glass Transition Temperature(DSC)	175	170 minimum	175	170 minimum	˚C	2.4.25
Decomposition Temperature	--	--	345	340 minimum	˚C	2.4.24.6
Decomposition Temperature	--	--	345	340 minimum	˚C	(5% wt loss)
X/Y Axis CTE (40℃ to 125℃)	--	--	10--13	--	PPM/˚C	2.4.24
Z-Axis CTE						2.4.24
A. Alpha 1	--	--	45	60 maximum	PPM/˚C
B. Alpha 2	--	--	210	300 maximum	PPM/˚C
C. 50 to 260 Degrees C	--	--	2.7	3.0 maximum	%
Thermal Resistance						2.4.24.1
A. T260	--	--	>60	30 minimum	Minutes
B. T288	--	--	>30	15 minimum	Minutes
CAF Resistance	--	--	Pass	AABUS	Pass/Fail	2.6.25

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-470.V1.0

Base Material:

FR-4

Layer Count:

2 Layers

PCB Thickness:

1.0mm ±0.1

PCB Size:

120 X 79mm=4PCS

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

1oz

Surface Finish:

Immersion Silver

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

1.0mm 2 Layer Circuit Board

ITEQ FR4 2 Layer Circuit Board

ITEQ FR4 Immersion Silver PCB

Product Description

Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit Board for USB Charger

1.1 General description

1.2 Features and benifits

Outstanding thermal resistance and suitable for lead-free process

Can be horizontal operation and has high efficiency

AOI inspection

Meeting your PCB needs from prototype to mass production.

12 hours quotation

Prototype PCB capability

1.3 Application

Router Wireless

Bluetooth Adapter For PC

Motor Controller

GSM Tracking

Modem HSDPA

1.4 Parameter and data sheet

PCB SIZE	120 x 79mm=4PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layes
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17.8um(0.5oz)+PLATE
	FR-4 0.8mm
	copper ------- 17.8um(0.5oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minimum / Maximum Holes:	0.5/3.8mm
Number of Different Holes:	4
Number of Drill Holes:	135
Number of Milled Slots:	1
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180A TG>170
Final foil external:	1oz
Final foil internal:	0oz
Final height of PCB:	1.0mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Silver, Ag>0.15µm
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

Property	Thickness<0.50 mm		Thickness≧0.50 mm		Units	Test Method
	[0.0197 in]		[0.0197 in]		Units	Test Method
	Typical Value	Spec	Typical Value	Spec	Metric	IPC-TM-650
	Typical Value	Spec	Typical Value	Spec	(English)	(or as noted)
Peel Strength, minimum					N/mm	2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]					(lb/inch)	2.4.8.2
B. Standard profile copper foil	0.88 (5.0)	0.70 (4.00)	0.88 (5.0)	0.70 (4.00)		2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions	1.23 (7.0)	0.80 (4.57)	1.40 (8.0)	1.05 (6.00)
	1.05 (6.0)	0.70 (4.00)	1.23 (7.0)	0.70 (4.00)
	1.05 (6.0)	0.55 (3.14)	1.23 (7.0)	0.80 (4.57)
Volume Resistivity, minimum					MW-cm	2.5.17.1
A. C-96/35/90	3.0x10¹⁰	106	--	--
B. After moisture resistance	--	--	3.0x10¹⁰	104
C. At elevated temperature E-24/125	5.0x10¹⁰	103	1.0x10¹⁰	103
Surface Resistivity, minimum					MW	2.5.17.1
A. C-96/35/90	3.0x10¹⁰	104	--	--
B. After moisture resistance	--	--	3.0x10¹⁰	104
C. At elevated temperature E-24/125	4.0x10¹⁰	103	4.0x10¹⁰	103
Moisture Absorption, maximum	--	--	0.12	0.8	%	2.6.2.1
Dielectric Breakdown, minimum	--	--	60	40	kV	2.5.6
Permittivity (Dk, 50% resin content)		5.4		5.4	--
(Laminate & Laminated Prepreg)
A. 1MHz	4.4		4.4			2.5.5.9
B. 1GHz	4.4		4.4
C. 2GHz	4.2		4.3			2.5.5.13
D. 5GHz	4.1		4.1
E. 10GHz	4		4.1
Loss Tangent (Df, 50% resin content)		0.035		0.035	--
(Laminate & Laminated Prepreg)
A. 1MHz	0.015		0.014			2.5.5.9
B. 1GHz	0.015		0.015
C. 2GHz	0.015		0.015			2.5.5.13
D. 5GHz	0.016		0.016
E. 10GHz	0.017		0.016
Flexural Strength, minimum					N/mm²	2.4.4
A. Length direction	--	--	500-530	415	(lb/in²)
	--	--	(72,500-76,850)	-60,190
B. Cross direction	--	--	410-440	345
	--	--	(59,450-63,800)	-50,140
Arc Resistance, minimum	125	60	125	60	s	2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum					Rating	2.4.13.1
A. Unetched	Pass	Pass Visual	Pass	Pass Visual
B. Etched	Pass	Pass Visual	Pass	Pass Visual
Electric Strength, minimum	45	30	--	--	kV/mm	2.5.6.2
(Laminate & Laminated Prepreg)	45	30	--	--	kV/mm	2.5.6.2
Flammability,	V-0	V-0	V-0	V-0	Rating	UL94
(Laminate & Laminated Prepreg)	V-0	V-0	V-0	V-0	Rating	UL94
Glass Transition Temperature(DSC)	175	170 minimum	175	170 minimum	˚C	2.4.25
Decomposition Temperature	--	--	345	340 minimum	˚C	2.4.24.6
Decomposition Temperature	--	--	345	340 minimum	˚C	(5% wt loss)
X/Y Axis CTE (40℃ to 125℃)	--	--	10--13	--	PPM/˚C	2.4.24
Z-Axis CTE						2.4.24
A. Alpha 1	--	--	45	60 maximum	PPM/˚C
B. Alpha 2	--	--	210	300 maximum	PPM/˚C
C. 50 to 260 Degrees C	--	--	2.7	3.0 maximum	%
Thermal Resistance						2.4.24.1
A. T260	--	--	>60	30 minimum	Minutes
B. T288	--	--	>30	15 minimum	Minutes
CAF Resistance	--	--	Pass	AABUS	Pass/Fail	2.6.25

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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

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Taconic PCB

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FR4 PCB Board

PCB Stencil

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1.0mm 2 Layer Circuit Board

ITEQ FR4 2 Layer Circuit Board

ITEQ FR4 Immersion Silver PCB

1oz Medical Equipment PCB,

1oz Immersion Gold PCB,