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M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
M6 Core R5775G(HVLP) 500 μm;
Layer Count:
6-layer
PCB Thickness:
1.4mm
PCB Size:
81.9 Mm X 53.7 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers, 0.5oz Inner Layers
Surface Finish:
Electroless Nickle Electroless Palladium Immersion Gold (ENEPIG)
Highlight:

Low Loss PCB 6-layer

,

M6 PCB 6-layer

,

ENEPIG Finish 6 layer pcb

Product Description

This 6-layer PCB crafted from high-performance Megtron6 (M6) R-5775G. Engineered for high-speed, low-loss applications, it is ideal for cutting-edge technologies such as 5G communication, automotive electronics, and high-performance computing.

 

Construction Details

This 6-layer PCB is meticulously engineered to meet the rigorous demands of today’s electronic devices. Here are the key construction details:

 

- Base Material: Megtron6 (M6) - R5775G (HVLP)
- Layer Count: 6 layers, allowing for complex circuit designs.
- Board Dimensions: 81.9 mm x 53.7 mm, with a tolerance of ±0.15 mm, ensuring precise fit in device enclosures.
- Minimum Trace/Space: 4/5 mils, facilitating high-density layouts.
- Minimum Hole Size: 0.3 mm, accommodating various component types.
- Finished Board Thickness: 1.4 mm, optimized for durability.
- Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), providing excellent solderability and corrosion resistance.

 

Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
  DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0

 

Stackup Configuration

The stackup of our PCB is designed for optimal performance in high-frequency applications:

 

Copper Layers: Multiple layers of copper ranging from 17 μm to 35 μm, strategically placed for effective signal transmission.


Prepreg Materials: R-5670(G) prepregs provide stability and insulation between copper layers.


Core Material: M6 Core R5775G (HVLP) ensures low dielectric loss and high thermal reliability.

 

M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish 0

 

Advantages of Megtron6 (M6) R-5775G

 

High-Speed Performance
Megtron6 laminate is specifically formulated for high-frequency applications. With a dielectric constant of 3.4 at 1 GHz and 3.34 at 13 GHz, it minimizes signal loss, making it ideal for 5G communications and other high-speed technologies.

 

Low Dielectric Loss
The dissipation factor of 0.002 at 1 GHz and 0.0037 at 13 GHz ensures that energy is efficiently transmitted, reducing heat generation and improving overall performance.

 

Thermal Reliability
The high Tg value (>185 °C) and thermal decomposition temperature (Td) of 410 °C make this PCB suitable for environments with significant thermal challenges, such as automotive and aerospace applications.

 

Environmental Compliance
This PCB is RoHS compliant and halogen-free, aligning with global standards for green manufacturing. This commitment to sustainability is crucial for modern electronic design.

 

PCB Material: Low DK Glass Cloth
Designation: Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant: 3.61 10GHz
Dissipation Factor 0.004 10GHz
Layer count: Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Typical Applications

5G Communication: Base stations, millimeter-wave antennas, RF front-ends

 

Automotive Electronics: 77 GHz radar systems, ADAS


Data Centers: High-speed server motherboards, optical module PCBs


Aerospace: Circuit boards for satellite communication and radar


Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices

 

Conclusion
This PCB with Megtron6 material is a pivotal component in the landscape of modern electronics. From high-speed communication to automotive safety systems, its advanced features and materials provide the foundation for innovative designs. As technology continues to advance, this PCB stands ready to meet the challenges of tomorrow’s high-performance applications. Embrace the future of electronics with our sophisticated, reliable, and environmentally responsible PCB solutions.

 

M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish 1

products
PRODUCTS DETAILS
M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
M6 Core R5775G(HVLP) 500 μm;
Layer Count:
6-layer
PCB Thickness:
1.4mm
PCB Size:
81.9 Mm X 53.7 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers, 0.5oz Inner Layers
Surface Finish:
Electroless Nickle Electroless Palladium Immersion Gold (ENEPIG)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Low Loss PCB 6-layer

,

M6 PCB 6-layer

,

ENEPIG Finish 6 layer pcb

Product Description

This 6-layer PCB crafted from high-performance Megtron6 (M6) R-5775G. Engineered for high-speed, low-loss applications, it is ideal for cutting-edge technologies such as 5G communication, automotive electronics, and high-performance computing.

 

Construction Details

This 6-layer PCB is meticulously engineered to meet the rigorous demands of today’s electronic devices. Here are the key construction details:

 

- Base Material: Megtron6 (M6) - R5775G (HVLP)
- Layer Count: 6 layers, allowing for complex circuit designs.
- Board Dimensions: 81.9 mm x 53.7 mm, with a tolerance of ±0.15 mm, ensuring precise fit in device enclosures.
- Minimum Trace/Space: 4/5 mils, facilitating high-density layouts.
- Minimum Hole Size: 0.3 mm, accommodating various component types.
- Finished Board Thickness: 1.4 mm, optimized for durability.
- Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), providing excellent solderability and corrosion resistance.

 

Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
  DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0

 

Stackup Configuration

The stackup of our PCB is designed for optimal performance in high-frequency applications:

 

Copper Layers: Multiple layers of copper ranging from 17 μm to 35 μm, strategically placed for effective signal transmission.


Prepreg Materials: R-5670(G) prepregs provide stability and insulation between copper layers.


Core Material: M6 Core R5775G (HVLP) ensures low dielectric loss and high thermal reliability.

 

M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish 0

 

Advantages of Megtron6 (M6) R-5775G

 

High-Speed Performance
Megtron6 laminate is specifically formulated for high-frequency applications. With a dielectric constant of 3.4 at 1 GHz and 3.34 at 13 GHz, it minimizes signal loss, making it ideal for 5G communications and other high-speed technologies.

 

Low Dielectric Loss
The dissipation factor of 0.002 at 1 GHz and 0.0037 at 13 GHz ensures that energy is efficiently transmitted, reducing heat generation and improving overall performance.

 

Thermal Reliability
The high Tg value (>185 °C) and thermal decomposition temperature (Td) of 410 °C make this PCB suitable for environments with significant thermal challenges, such as automotive and aerospace applications.

 

Environmental Compliance
This PCB is RoHS compliant and halogen-free, aligning with global standards for green manufacturing. This commitment to sustainability is crucial for modern electronic design.

 

PCB Material: Low DK Glass Cloth
Designation: Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant: 3.61 10GHz
Dissipation Factor 0.004 10GHz
Layer count: Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Typical Applications

5G Communication: Base stations, millimeter-wave antennas, RF front-ends

 

Automotive Electronics: 77 GHz radar systems, ADAS


Data Centers: High-speed server motherboards, optical module PCBs


Aerospace: Circuit boards for satellite communication and radar


Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices

 

Conclusion
This PCB with Megtron6 material is a pivotal component in the landscape of modern electronics. From high-speed communication to automotive safety systems, its advanced features and materials provide the foundation for innovative designs. As technology continues to advance, this PCB stands ready to meet the challenges of tomorrow’s high-performance applications. Embrace the future of electronics with our sophisticated, reliable, and environmentally responsible PCB solutions.

 

M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish 1

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