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| Material: | Rogers RT/duroid 6010.2LM Core | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 78mm X 98 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 1.39mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
In the fast-evolving world of electronics, the quest for performance often demands innovative materials and technologies. The newly shipped RT/duroid 6010.2LM PCB stands out as a premier solution for engineers and designers working in electronic and microwave circuit applications. .
Understanding RT/duroid 6010.2LM Laminates
RT/duroid 6010.2LM is a ceramic-PTFE composite material renowned for its high dielectric constant and low loss characteristics. Designed specifically for high-frequency applications, this laminate is ideal for circuits operating at X-band frequencies and below. Its unique properties enable designers to reduce circuit sizes without sacrificing performance, making it a vital asset in modern electronic designs.
Key Features and Specifications
1. High Dielectric Constant (Dk):
The RT/duroid 6010.2LM boasts a dielectric constant of 10.2 ± 0.25 at 10GHz. This high Dk allows for miniaturization of circuits, which is particularly beneficial in compact electronic devices where space is at a premium.
2. Low Dissipation Factor:
With a dissipation factor of only 0.0023 at 10GHz, this PCB minimizes signal loss, ensuring that high-frequency signals maintain their integrity even over longer distances. This characteristic is crucial for applications such as satellite communications and radar systems.
3. Thermal Stability:
The PCB exhibits a decomposition temperature (Td) of 500°C, ensuring that it can withstand extreme operating conditions. This thermal resilience is essential for applications in environments where temperature fluctuations are common.
4. Moisture Resistance:
With a moisture absorption rate of just 0.01%, the RT/duroid 6010.2LM significantly reduces the risk of electrical loss due to humidity. This feature is particularly important in outdoor or high-humidity environments, where moisture can compromise circuit performance.
5. Controlled Thermal Expansion:
The PCB exhibits low coefficients of thermal expansion (CTE) of 24 ppm/°C in the X and Y directions and 47 ppm/°C in the Z direction. This property ensures reliable plated through holes and minimizes the risk of delamination in multilayer boards.
| RT/duroid 6010 Typical Value | |||||
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Construction Details
The RT/duroid 6010.2LM PCB is meticulously constructed with the following specifications:
- Stackup: 2-layer rigid PCB
- Copper Layers: Each copper layer is 35 μm thick, providing robust conductivity.
- Core Material: The 1.27 mm (50 mil) RT/duroid 6010.2LM core forms the heart of the PCB, providing the essential dielectric properties.
- Trace and Hole Specifications: The minimum trace/space is 5/6 mils, and the minimum hole size is 0.4mm, allowing for intricate designs.
- Surface Finish: The immersion gold finish enhances solderability and provides excellent protection against oxidation.
Quality Assurance
Quality is paramount in PCB manufacturing, and the RT/duroid 6010.2LM PCB adheres to IPC-Class-2 standards. Each unit undergoes rigorous 100% electrical testing prior to shipment, ensuring reliability and performance in critical applications.
Benefits of Using RT/duroid 6010.2LM PCB
1. Circuit Size Reduction: The high dielectric constant enables designers to create smaller, more efficient circuits, which is especially advantageous in modern compact devices.
2. Low Loss Performance: The low dissipation factor ensures that signals are transmitted with minimal loss, crucial for maintaining the integrity of high-frequency signals in applications such as power amplifiers and satellite communications.
3. Reliability in Harsh Environments: With low moisture absorption and high thermal stability, this PCB can operate reliably in a variety of challenging environments, making it suitable for applications in aviation, telecommunications, and defense.
4. Repeatable Circuit Performance: Tight control over dielectric constant and thickness translates to consistent performance across multiple boards, an essential factor for mass production.
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Typical Applications
The versatility of the RT/duroid 6010.2LM PCB makes it suitable for a wide range of applications, including:
- Patch Antennas: Ideal for wireless communication systems where space and efficiency are critical.
- Satellite Communication Systems: Its low loss characteristics enhance signal integrity over long distances.
- Power Amplifiers: Designed to handle high-frequency signals with minimal loss, making it suitable for RF applications.
- Aircraft Collision Avoidance Systems: Reliability and performance are crucial in aerospace applications, where safety is paramount.
- Ground Radar Warning Systems: The PCB’s high thermal stability and low moisture absorption contribute to effective performance in radar systems.
Conclusion
The RT/duroid 6010.2LM PCB represents a significant advancement in PCB technology, offering a unique combination of high dielectric constant, low loss, and robust thermal stability. With its meticulous construction and rigorous quality assurance, this PCB is poised to meet the demanding needs of modern electronic applications. Whether you’re developing satellite communication systems or advanced radar technologies, the RT/duroid 6010.2LM PCB is an essential component for achieving optimal performance and reliability.
Explore the possibilities with RT/duroid 6010.2LM and elevate your designs to new heights!
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
