Base material:Rogers TMM6 ceramic thermoset polymer composite laminate
Layer count:2 Layers
PCB thickness:1.35mm
Base material:RT/Duroid 5880
Layer count:2 layers
PCB thickness:0.52mm
Base material:Glass reinforced hydrocarbon ceramic laminates
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
PCB thickness:8mil (0.203mm), 12mil (0.305mm), 20mil (0.508mm); 32mil (0.813mm), 60mil (1.524mm)
Base material:RO4350B
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
PCB thickness:10mil (0.254mm), 20mil (0.508mm); 30mil (0.762mm), 60mil (1.524mm)
Base material:RO3003
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid PCB
PCB thickness:10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Base material:RO4350B 0.102mm + Tg 170℃ FR4 0.30mm
PCB thickness:1.0mm
PCB size:55mm x 132mm = 1 type = 1 piece
Base material:Hydrocarbon Ceramic-filled Thermoset Materials
Layer count:Double Layer, Multilayer, Hybrid PCB
PCB thickness:8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
Base material:Hydrocarbon Ceramic-filled Thermoset Materials
Layer count:Double Layer, Multilayer, Hybrid PCB
PCB thickness:8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
Base material:Hydrocarbon Ceramic-filled Thermoset Materials
Layer count:Double Layer, Multilayer, Hybrid PCB
PCB thickness:8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB material:RT/duroid 6006
PCB thickness:0.4mm
Layer count:2 layers
PCB material:Rogers RO3003 + TG170 FR-4 mixed dielectric laminate
Layer count:4-layer
PCB thickness:0.8mm
PCB material:RO4533
PCB thickness:0.6mm
PCB size:123.5mm x 46mm (1PCS)