2-layer Rogers TMM6 Thermoset Microwave PCB 50mil Laminate

PCB Specifications

PCB Layer Stack-up Structure

Fabrication & Quality Compliance

Fabrication File Format: Manufactured based on standard Gerber RS-274-X datasets, enabling precise circuit patterning and full compatibility with industrial PCB manufacturing workflows.

Quality Compliance: All production and inspection procedures strictly adhere to IPC-Class-2 reliability standards, ensuring consistent electrical performance and long-term structural durability for commercial and industrial RF applications.

Global Supply: Worldwide logistics support is available to deliver stable, standardized products for global high-frequency PCB projects.

Rogers TMM6 Material Profile

Rogers TMM6 is a premium ceramic-reinforced thermoset polymer composite microwave laminate, specifically engineered to deliver superior plated-through-hole reliability for stripline and microstrip circuit architectures. It synergizes the technical merits of ceramic dielectric materials and traditional PTFE microwave substrates while eliminating the complex manufacturing requirements of conventional high-frequency dielectrics. Featuring a distinctive, tightly stabilized dielectric constant within the TMM product family, this thermoset substrate delivers balanced electrical, thermal and mechanical performance, serving as a cost-efficient and highly dependable solution for diverse high-frequency circuit designs.

Material Advantages

Copper-Matched Thermal Expansion: Well-calibrated tri-axis CTE matches copper’s thermal expansion, alleviating thermal stress during temperature cycling and avoiding delamination, cracking and PTH defects for durable structural reliability.

Superior Mechanical Stability: Robust mechanical properties resist creep and cold flow under continuous operating load, retaining accurate circuit geometry and stable electrical performance over long-term service.

Excellent Chemical Resistance: Tolerates conventional PCB processing chemicals and cleaners, reducing substrate damage during production and optimizing fabrication yield and quality stability.

Wire-Bonding Adaptability: The inherent thermoset resin structure enables dependable wire-bonding capability, suitable for high-precision assembly and advanced packaging scenarios.

Full Process Compatibility: Compliant with standard PCB manufacturing workflows without specialized PTFE processing, lowering production costs and shortening lead time.

Typical Application Fields

Benefiting from stable dielectric characteristics, low high-frequency loss, copper-matched thermal stability and outstanding process adaptability, TMM6-based PCBs are widely applied in high-precision industrial and commercial RF and microwave systems:

• General RF and microwave circuitry modules
• High-frequency power amplifiers and power combiners
• RF filters, couplers and passive microwave components
• Satellite communication transceiver systems
• GPS and positioning navigation antenna systems
• Patch antennas and planar phased antenna arrays
• Microwave dielectric polarizers and lens components
• High-precision semiconductor chip testing equipment