F4BTMS265 Substrate High Frequency Laminates Copper Clad Sheet

The F4BTMS Series is an upgraded product of the F4BTM Series. Building upon its predecessor, it achieves technological breakthroughs in material formulation and manufacturing processes. The material incorporates a significant amount of ceramic fillers and is reinforced with ultra-thin, fine glass fabric, resulting in substantially enhanced material properties and a broader dielectric constant range. As an aerospace-grade, high-reliability material, it can effectively substitute for similar foreign products.

Reinforced with a small amount of ultra-thin, fine glass fabric and mixed with a large quantity of uniformly dispersed specialty nano-ceramics and polytetrafluoroethylene resin, this material minimizes the glass fiber effect during electromagnetic wave propagation, reduces dielectric loss, and enhances dimensional stability. It lowers the material's X/Y/Z anisotropy, increases the usable frequency, improves electrical strength, and raises thermal conductivity. The material also exhibits excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

The F4BTMS Series is standardly equipped with RTF low-profile copper foil, which reduces conductor loss while providing excellent peel strength. It can be paired with copper or aluminum bases.

Circuit boards can be processed using standard PTFE board processing technologies. The board's excellent mechanical and physical properties make it suitable for multilayer, high-multilayer, and backplane processing. It also demonstrates excellent machinability in dense-hole and fine-line circuit processing.

Product Features

• Tight dielectric constant tolerance with excellent batch-to-batch consistency;
• Ultra-low dielectric loss;
• Maintains stable dielectric constant and low loss values at frequencies up to 40 GHz, suitable for phase-sensitive applications;
• Excellent dielectric constant and dielectric loss temperature coefficients, maintaining excellent frequency and phase stability between -55°C and 150°C;
• Excellent radiation resistance; maintains stable dielectric and physical properties after high-dose radiation exposure.
• Low outgassing performance; tested according to standard methods for material volatility under vacuum conditions, meeting aerospace vacuum outgassing requirements;
• Low coefficient of thermal expansion in X, Y, and Z directions; ensures dimensional thermal stability and plated through-hole reliability;
• Improved thermal conductivity, suitable for higher power applications;
• Excellent dimensional stability;
• Low water absorption.

Typical Applications

• Aerospace equipment, space and cabin equipment
• Microwave and radio frequency applications
• Radar, military radar systems
• Feed networks
• Phase-sensitive antennas, phased array antennas
• Satellite communications, etc.