| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB delivers reliable performance for high-frequency electronic applications.
PCB Details
| Item | Specification |
| Base material | TRF-45 |
| Layer count | Double sided |
| Board dimensions | 105mm x 76mm (per piece), +/- 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | None |
| Finished board thickness | 0.9mm |
| Finished Cu weight (outer layers) | 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical test | 100% electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Layer Type | Specification |
| Copper_layer_1 | 35 μm |
| TRF-45 Core | 0.813 mm (32mil) |
| Copper_layer_2 | 35 μm |
PCB Statistics
| Metric | Detail |
| Components | 42 |
| Total Pads | 38 |
| Thru Hole Pads | 25 |
| Top SMT Pads | 13 |
| Bottom SMT Pads | 0 |
| Vias | 15 |
| Nets | 2 |
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Artwork and Quality Standard
Gerber RS-274-X serves as the specified artwork format for this PCB, a globally acknowledged industry benchmark for printed circuit board manufacturing. This standard format ensures seamless interoperability with professional design software and fabrication machinery, facilitating the precise conversion of digital circuit layouts into physical PCB products. Moreover, this PCB complies with the IPC-Class-2 quality standard, which sets rigorous criteria for performance and dependability, thereby confirming its appropriateness for use in commercial and industrial operational scenarios.
Availability
This high-performance PCB is available for shipment worldwide, catering to both prototyping demands and large-volume production orders to ensure global accessibility for all customers.
Introduction of TRF-45
The TRF-45 laminated materials represent a new generation of low-loss, thermally-stable laminated material from Taconic Advanced Dielectric Division. TRF-45 is woven-glass reinforced for enhanced dimensional-stability and coupled with Taconic's expertise in ceramic technology. It exhibits low and consistent Z-axis expansion across a wide range of temperature including and up to soldering conditions. TRF-45 can be sheared, drilled and plated using standard methods for PTFE woven fibre-glass materials.
Typical Applications
TRF-45 – Low-Loss Ceramic-Filled PTFE
The TRF series of laminates represents a new generation of low-loss, thermally stable laminated materials from Taconic's Advanced Dielectric Division.
Reinforced with woven glass for enhanced dimensional stability and backed by Taconic's expertise in ceramic technology, TRF laminates exhibit low and consistent Z-axis expansion across a wide temperature range, including soldering conditions.
Benefits
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| TRF-45 Typical Values | |||
| Property | Test Method | Unit | Value |
| Material | / | / | RF-45 |
| Dielectric Constant @ 10GHz | IPC-TM-650 2.5.5.5.1(m) | / | 4.5 |
| Dissipation Factor @ 10GHz | IPC-TM-650 2.5.5.5.1(m) | / | 0.0035 |
| Moisture Absorption | IPC-TM-650 2.6.2.1 | % | ≤0.06 |
| Flexural Strength (Lengthwise) | IPC-TM-650.2.4.4 | lbs / in (N/mm2) | 17000 (177) |
| Flexural Strength (Transverse) | IPC-TM-650 2.4.4 | lbs / in (N/mm2) | 15000 (103) |
| Peel Strength | IPC-TM-650 2.4.8 (Thermal Stress) | lbs / in (N/mm) | >8 (>1.4) |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.43 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 8.0 x 107 |
| Surface Resistivity | IPC-TM-650.2.5.17.1 | Mohm | 3.0 x 107 |
| CTE (x) | ASTM D 3386 | ppm/℃ | 9 |
| CTE (y) | ASTM D 3386 | ppm/℃ | 9 |
| CTE (z) | ASTM D 3386 | ppm/℃ | 40 |
| Typical Thicknesses | |
| Inches | mm |
| 0.0080 | 0.20 |
| 0.0160 | 0.41 |
| 0.0240 | 0.61 |
| 0.0320 | 0.81 |
| 0.0400 | 1.02 |
| 0.0640 | 1.63* |
| 0.1200 | 3.05* |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB delivers reliable performance for high-frequency electronic applications.
PCB Details
| Item | Specification |
| Base material | TRF-45 |
| Layer count | Double sided |
| Board dimensions | 105mm x 76mm (per piece), +/- 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | None |
| Finished board thickness | 0.9mm |
| Finished Cu weight (outer layers) | 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical test | 100% electrical test conducted prior to shipment |
PCB Stack-up
This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):
| Layer Type | Specification |
| Copper_layer_1 | 35 μm |
| TRF-45 Core | 0.813 mm (32mil) |
| Copper_layer_2 | 35 μm |
PCB Statistics
| Metric | Detail |
| Components | 42 |
| Total Pads | 38 |
| Thru Hole Pads | 25 |
| Top SMT Pads | 13 |
| Bottom SMT Pads | 0 |
| Vias | 15 |
| Nets | 2 |
![]()
Artwork and Quality Standard
Gerber RS-274-X serves as the specified artwork format for this PCB, a globally acknowledged industry benchmark for printed circuit board manufacturing. This standard format ensures seamless interoperability with professional design software and fabrication machinery, facilitating the precise conversion of digital circuit layouts into physical PCB products. Moreover, this PCB complies with the IPC-Class-2 quality standard, which sets rigorous criteria for performance and dependability, thereby confirming its appropriateness for use in commercial and industrial operational scenarios.
Availability
This high-performance PCB is available for shipment worldwide, catering to both prototyping demands and large-volume production orders to ensure global accessibility for all customers.
Introduction of TRF-45
The TRF-45 laminated materials represent a new generation of low-loss, thermally-stable laminated material from Taconic Advanced Dielectric Division. TRF-45 is woven-glass reinforced for enhanced dimensional-stability and coupled with Taconic's expertise in ceramic technology. It exhibits low and consistent Z-axis expansion across a wide range of temperature including and up to soldering conditions. TRF-45 can be sheared, drilled and plated using standard methods for PTFE woven fibre-glass materials.
Typical Applications
TRF-45 – Low-Loss Ceramic-Filled PTFE
The TRF series of laminates represents a new generation of low-loss, thermally stable laminated materials from Taconic's Advanced Dielectric Division.
Reinforced with woven glass for enhanced dimensional stability and backed by Taconic's expertise in ceramic technology, TRF laminates exhibit low and consistent Z-axis expansion across a wide temperature range, including soldering conditions.
Benefits
![]()
| TRF-45 Typical Values | |||
| Property | Test Method | Unit | Value |
| Material | / | / | RF-45 |
| Dielectric Constant @ 10GHz | IPC-TM-650 2.5.5.5.1(m) | / | 4.5 |
| Dissipation Factor @ 10GHz | IPC-TM-650 2.5.5.5.1(m) | / | 0.0035 |
| Moisture Absorption | IPC-TM-650 2.6.2.1 | % | ≤0.06 |
| Flexural Strength (Lengthwise) | IPC-TM-650.2.4.4 | lbs / in (N/mm2) | 17000 (177) |
| Flexural Strength (Transverse) | IPC-TM-650 2.4.4 | lbs / in (N/mm2) | 15000 (103) |
| Peel Strength | IPC-TM-650 2.4.8 (Thermal Stress) | lbs / in (N/mm) | >8 (>1.4) |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.43 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 8.0 x 107 |
| Surface Resistivity | IPC-TM-650.2.5.17.1 | Mohm | 3.0 x 107 |
| CTE (x) | ASTM D 3386 | ppm/℃ | 9 |
| CTE (y) | ASTM D 3386 | ppm/℃ | 9 |
| CTE (z) | ASTM D 3386 | ppm/℃ | 40 |
| Typical Thicknesses | |
| Inches | mm |
| 0.0080 | 0.20 |
| 0.0160 | 0.41 |
| 0.0240 | 0.61 |
| 0.0320 | 0.81 |
| 0.0400 | 1.02 |
| 0.0640 | 1.63* |
| 0.1200 | 3.05* |