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2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold

2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
TRF-45
PCB Size:
105mm X 76mm (per Piece), +/- 0.15mm
PCB Thickness:
0.9mm
Layer Count:
2-layer
Copper Weight:
1 Oz (1.4 Mils)
Solder Mask:
Green
Silkscreen:
White
Surface Finish:
Immersion Gold
Highlight:

high frequency copper clad laminate

,

F4BTMS265 substrate laminate

,

copper clad sheet with warranty

Product Description

This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB delivers reliable performance for high-frequency electronic applications.

 

PCB Details

Item Specification
Base material TRF-45
Layer count Double sided
Board dimensions 105mm x 76mm (per piece), +/- 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.25mm
Blind vias None
Finished board thickness 0.9mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
TRF-45 Core 0.813 mm (32mil)
Copper_layer_2 35 μm

 

PCB Statistics

Metric Detail
Components 42
Total Pads 38
Thru Hole Pads 25
Top SMT Pads 13
Bottom SMT Pads 0
Vias 15
Nets 2

 

2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold 0

 

Artwork and Quality Standard

Gerber RS-274-X serves as the specified artwork format for this PCB, a globally acknowledged industry benchmark for printed circuit board manufacturing. This standard format ensures seamless interoperability with professional design software and fabrication machinery, facilitating the precise conversion of digital circuit layouts into physical PCB products. Moreover, this PCB complies with the IPC-Class-2 quality standard, which sets rigorous criteria for performance and dependability, thereby confirming its appropriateness for use in commercial and industrial operational scenarios.

 

Availability

This high-performance PCB is available for shipment worldwide, catering to both prototyping demands and large-volume production orders to ensure global accessibility for all customers.

 

Introduction of TRF-45

The TRF-45 laminated materials represent a new generation of low-loss, thermally-stable laminated material from Taconic Advanced Dielectric Division. TRF-45 is woven-glass reinforced for enhanced dimensional-stability and coupled with Taconic's expertise in ceramic technology. It exhibits low and consistent Z-axis expansion across a wide range of temperature including and up to soldering conditions. TRF-45 can be sheared, drilled and plated using standard methods for PTFE woven fibre-glass materials.

 

Typical Applications

  • Satellite radio antennas
  • RFID antennas
  • GPS antennas

 

TRF-45 – Low-Loss Ceramic-Filled PTFE

The TRF series of laminates represents a new generation of low-loss, thermally stable laminated materials from Taconic's Advanced Dielectric Division.

 

Reinforced with woven glass for enhanced dimensional stability and backed by Taconic's expertise in ceramic technology, TRF laminates exhibit low and consistent Z-axis expansion across a wide temperature range, including soldering conditions.

 

Benefits

  • Low-loss ceramic-filled PTFE
  • High thermal conductivity
  • Stable dielectric constant (Dk) over temperature
  • Stable dielectric constant (Dk) over frequency
  • Very low Z-axis coefficient of thermal expansion (CTE)

2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold 1

 

TRF-45 Typical Values
Property Test Method Unit Value
Material / / RF-45
Dielectric Constant @ 10GHz IPC-TM-650 2.5.5.5.1(m) / 4.5
Dissipation Factor @ 10GHz IPC-TM-650 2.5.5.5.1(m) / 0.0035
Moisture Absorption IPC-TM-650 2.6.2.1 % 0.06
Flexural Strength (Lengthwise) IPC-TM-650.2.4.4 lbs / in (N/mm2) 17000 (177)
Flexural Strength (Transverse) IPC-TM-650 2.4.4 lbs / in (N/mm2) 15000 (103)
Peel Strength IPC-TM-650 2.4.8 (Thermal Stress) lbs / in (N/mm) >8 (>1.4)
Thermal Conductivity ASTM F 433 W/m/K 0.43
Volume Resistivity IPC-TM-650 2.5.17.1 Mohm/cm 8.0 x 107
Surface Resistivity IPC-TM-650.2.5.17.1 Mohm 3.0 x 107
CTE (x) ASTM D 3386  ppm/ 9
CTE (y) ASTM D 3386  ppm/ 9
CTE (z) ASTM D 3386  ppm/ 40

 

Typical Thicknesses
Inches mm
0.0080 0.20
0.0160 0.41
0.0240 0.61
0.0320 0.81
0.0400 1.02
0.0640 1.63*
0.1200 3.05*
Products
PRODUCTS DETAILS
2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
TRF-45
PCB Size:
105mm X 76mm (per Piece), +/- 0.15mm
PCB Thickness:
0.9mm
Layer Count:
2-layer
Copper Weight:
1 Oz (1.4 Mils)
Solder Mask:
Green
Silkscreen:
White
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

high frequency copper clad laminate

,

F4BTMS265 substrate laminate

,

copper clad sheet with warranty

Product Description

This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB delivers reliable performance for high-frequency electronic applications.

 

PCB Details

Item Specification
Base material TRF-45
Layer count Double sided
Board dimensions 105mm x 76mm (per piece), +/- 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.25mm
Blind vias None
Finished board thickness 0.9mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
TRF-45 Core 0.813 mm (32mil)
Copper_layer_2 35 μm

 

PCB Statistics

Metric Detail
Components 42
Total Pads 38
Thru Hole Pads 25
Top SMT Pads 13
Bottom SMT Pads 0
Vias 15
Nets 2

 

2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold 0

 

Artwork and Quality Standard

Gerber RS-274-X serves as the specified artwork format for this PCB, a globally acknowledged industry benchmark for printed circuit board manufacturing. This standard format ensures seamless interoperability with professional design software and fabrication machinery, facilitating the precise conversion of digital circuit layouts into physical PCB products. Moreover, this PCB complies with the IPC-Class-2 quality standard, which sets rigorous criteria for performance and dependability, thereby confirming its appropriateness for use in commercial and industrial operational scenarios.

 

Availability

This high-performance PCB is available for shipment worldwide, catering to both prototyping demands and large-volume production orders to ensure global accessibility for all customers.

 

Introduction of TRF-45

The TRF-45 laminated materials represent a new generation of low-loss, thermally-stable laminated material from Taconic Advanced Dielectric Division. TRF-45 is woven-glass reinforced for enhanced dimensional-stability and coupled with Taconic's expertise in ceramic technology. It exhibits low and consistent Z-axis expansion across a wide range of temperature including and up to soldering conditions. TRF-45 can be sheared, drilled and plated using standard methods for PTFE woven fibre-glass materials.

 

Typical Applications

  • Satellite radio antennas
  • RFID antennas
  • GPS antennas

 

TRF-45 – Low-Loss Ceramic-Filled PTFE

The TRF series of laminates represents a new generation of low-loss, thermally stable laminated materials from Taconic's Advanced Dielectric Division.

 

Reinforced with woven glass for enhanced dimensional stability and backed by Taconic's expertise in ceramic technology, TRF laminates exhibit low and consistent Z-axis expansion across a wide temperature range, including soldering conditions.

 

Benefits

  • Low-loss ceramic-filled PTFE
  • High thermal conductivity
  • Stable dielectric constant (Dk) over temperature
  • Stable dielectric constant (Dk) over frequency
  • Very low Z-axis coefficient of thermal expansion (CTE)

2L TRF-45 PCB 32mil Material Green Solder Mask Immersion Gold 1

 

TRF-45 Typical Values
Property Test Method Unit Value
Material / / RF-45
Dielectric Constant @ 10GHz IPC-TM-650 2.5.5.5.1(m) / 4.5
Dissipation Factor @ 10GHz IPC-TM-650 2.5.5.5.1(m) / 0.0035
Moisture Absorption IPC-TM-650 2.6.2.1 % 0.06
Flexural Strength (Lengthwise) IPC-TM-650.2.4.4 lbs / in (N/mm2) 17000 (177)
Flexural Strength (Transverse) IPC-TM-650 2.4.4 lbs / in (N/mm2) 15000 (103)
Peel Strength IPC-TM-650 2.4.8 (Thermal Stress) lbs / in (N/mm) >8 (>1.4)
Thermal Conductivity ASTM F 433 W/m/K 0.43
Volume Resistivity IPC-TM-650 2.5.17.1 Mohm/cm 8.0 x 107
Surface Resistivity IPC-TM-650.2.5.17.1 Mohm 3.0 x 107
CTE (x) ASTM D 3386  ppm/ 9
CTE (y) ASTM D 3386  ppm/ 9
CTE (z) ASTM D 3386  ppm/ 40

 

Typical Thicknesses
Inches mm
0.0080 0.20
0.0160 0.41
0.0240 0.61
0.0320 0.81
0.0400 1.02
0.0640 1.63*
0.1200 3.05*
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