F4BTMS255 PCB Material High Frequency Laminates Copper Clad Sheet

F4BTMS Series is an upgraded version of the F4BTM series, featuring technological breakthroughs in material formulation and manufacturing processes. The material incorporates a significant amount of ceramic fillers and is reinforced with ultra-thin, ultra-fine fiberglass cloth, resulting in substantially enhanced performance and a broader dielectric constant range. It is classified as an aerospace-grade, high-reliability material capable of replacing similar international products.

The combination of minimal ultra-thin, ultra-fine fiberglass cloth reinforcement with a matrix of uniformly dispersed specialized nano-ceramics and PTFE resin minimizes the glass fiber effect during electromagnetic wave propagation, reduces dielectric loss, and enhances dimensional stability. This formulation also lowers the material's X/Y/Z anisotropy, extends the usable frequency range, increases electrical strength, and improves thermal conductivity. Furthermore, the material exhibits excellent low thermal expansion coefficient and stable dielectric properties versus temperature.

The F4BTMS255 is standardly supplied with RTF low-profile copper foil, which reduces conductor loss while maintaining excellent peel strength. It can also be paired with copper or aluminum substrates. PCBs can be fabricated using standard PTFE processing techniques. The material's excellent mechanical and physical properties make it suitable for multilayer, high-layer count, and backplane applications. It also demonstrates good processability for dense hole patterns and fine line circuitry.

Product Features

• Tight dielectric constant tolerance with excellent batch-to-batch consistency
• Ultra-low dielectric loss
• Stable dielectric constant and low loss up to 40 GHz, suitable for phase-sensitive applications
• Excellent coefficient of dielectric constant and loss factor versus temperature, maintaining good frequency and phase stability from -55°C to 150°C
• Excellent radiation resistance; maintains stable dielectric and physical properties after radiation exposure
• Low outgassing performance, meeting space vacuum volatile content requirements per standard test methods
• Low coefficient of thermal expansion (CTE) in X/Y/Z directions, ensuring dimensional thermal stability and plated through-hole reliability
• Enhanced thermal conductivity, suitable for higher power applications
• Excellent dimensional stability
• Low moisture absorption

Typical Applications

• Aerospace equipment, space-borne and avionics systems
• Microwave and RF systems
• Radar, military radar systems
• Feed networks
• Phase-sensitive antennas, phased array antennas
• Satellite communications, etc.