logo
Home ProductsRF PCB Board

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit
RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Large Image :  RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Description
Material: RT/duroid 6035HTC Layer Count: 2-layer
PCB Size: 49.23mm X 55.55 Mm=1PCS, +/- 0.15mm PCB Thickness: 30mil
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Highlight:

30mil Immersion Gold Circuit PCB

,

RT duroid 6035HTC PCB

,

30mil Immersion Gold Circuit

The RT/duroid 6035HTC PCB is engineered from high-frequency circuit materials designed specifically for high-power RF and microwave applications. Utilizing ceramic-filled PTFE composites, this PCB is an exceptional choice for demanding environments where thermal management and performance are critical. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, it ensures efficient heat dissipation, making it ideal for high-power applications.

 

Key features of the RT/duroid 6035HTC PCB include a dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and 23°C, along with an impressive dissipation factor of 0.0013 at the same frequency and temperature. The material exhibits a thermal coefficient of dielectric constant of -66 ppm/°C and a moisture absorption rate of just 0.06%. Additionally, with a thermal conductivity of 1.44 W/m/K at 80°C, this PCB provides excellent thermal performance, contributing to lower operating temperatures and enhanced reliability in high-power scenarios.

 

RT/duroid 6035HTC Typical Value
Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

The construction of this PCB features a 2-layer rigid stackup, comprising 35 μm of copper on both layers and a 0.762 mm (30 mil) core of RT/duroid 6035HTC. Precise board dimensions of 49.23 mm x 55.55 mm (± 0.15 mm) are complemented by a finished board thickness of 0.83 mm and a minimum trace/space of 6/5 mils. With a minimum hole size of 0.6 mm and no blind vias, this PCB is crafted to meet stringent performance specifications. The immersion gold surface finish ensures excellent solderability, while the blue top solder mask enhances visibility during assembly.

This PCB is compatible with the Gerber RS-274-X artwork format and adheres to the IPC-Class-2 quality standard, ensuring it meets industry expectations. Additionally, it is available for worldwide, making it accessible to engineers globally.

 

Typical applications for the RT/duroid 6035HTC PCB include high-power RF and microwave amplifiers, couplers, filters, combiners, and power dividers. With its advanced thermal management capabilities and excellent high-frequency performance, this PCB is an invaluable asset for modern electronic designs demanding reliability and efficiency.

 

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)