We are excited to announce our newly shipped 3-layer printed circuit board (PCB) featuring Rogers RO3003 high-frequency laminates. Engineered for commercial microwave and RF applications, RO3003 is a ceramic-filled PTFE composite known for its exceptional stability in dielectric constant (Dk) across varied temperatures and frequencies. This makes it particularly suitable for advanced applications such as automotive radar, ADAS, and 5G wireless infrastructure.
Key Features
Rogers RO3003 offers a dielectric constant of 3 ± 0.04 at 10 GHz and a low dissipation factor of 0.001, allowing for reliable performance in applications up to 77 GHz. With a thermal conductivity of 0.5 W/mK and moisture absorption of just 0.04%, this material ensures efficient heat management and durability. The coefficient of thermal expansion (CTE) is well-matched to copper, with values of 17 ppm/°C (X-axis) and 16 ppm/°C (Y-axis), ensuring excellent dimensional stability.
| RO3003 Typical Value |
| Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.0±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign |
3 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
| Dissipation Factor,tanδ |
0.001 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
| Dimensional Stability |
0.06
0.07 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
| Volume Resistivity |
107 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
| Surface Resistivity |
107 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
| Tensile Modulus |
930
823 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
| Moisture Absorption |
0.04 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
| Specific Heat |
0.9 |
|
j/g/k |
|
Calculated |
| Thermal Conductivity |
0.5 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
16
25 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
| Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
| Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
| Copper Peel Stength |
12.7 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 |
| Lead-free Process Compatible |
Yes |
|
|
|
|
PCB Specifications
This PCB features a carefully designed stackup:
- Copper Layer 1: 35 μm
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 2: 35 μm
- RO4450F Bondply: 4 mil (0.102 mm)
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 3: 35 μm
The overall dimensions of this PCB are 115 mm x 115 mm. It supports a minimum trace/space of 5/7 mils and a minimum hole size of 0.35 mm, with no blind vias. The finished board thickness is 1.7 mm, and it has a finished copper weight of 1 oz (1.4 mils) on the outer layers.
This PCB features a bare copper surface finish, with no silkscreen or solder mask on either side. Each board undergoes 100% electrical testing prior to shipment to ensure optimal performance.
Applications
This PCB is suitable for a range of applications, including:
- Automotive Radar Applications
- Global Positioning Satellite Antennas
- Cellular Telecommunications Systems (Power Amplifiers and Antennas)
- Patch Antennas for Wireless Communications
- Direct Broadcast Satellites
- Datalink on Cable Systems
- Remote Meter Readers
- Power Backplanes
Quality Assurance and Availability
Manufactured to IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is provided in Gerber RS-274-X format, ensuring compatibility with standard PCB processes.
With Rogers RO3003, you can achieve reliable performance in high-frequency applications, making it an excellent choice for advanced RF circuit designs.
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