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Rogers RO3003 PCB 1.78mm 3 Layer With Bare Copper

Rogers RO3003 PCB 1.78mm 3 Layer With Bare Copper

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3003
PCB Thickness:
1.78mm
PCB Size:
115mm X 115 Mm=1PCS
Layer Count:
3-layer
Copper Weight:
1OZ
Surface Finish:
Bare Copper
Highlight:

Bare Copper PCB

,

1.78mm PCB

,

3-Layer PCB

Product Description

We are excited to announce our newly shipped 3-layer printed circuit board (PCB) featuring Rogers RO3003 high-frequency laminates. Engineered for commercial microwave and RF applications, RO3003 is a ceramic-filled PTFE composite known for its exceptional stability in dielectric constant (Dk) across varied temperatures and frequencies. This makes it particularly suitable for advanced applications such as automotive radar, ADAS, and 5G wireless infrastructure.

 

Key Features

Rogers RO3003 offers a dielectric constant of 3 ± 0.04 at 10 GHz and a low dissipation factor of 0.001, allowing for reliable performance in applications up to 77 GHz. With a thermal conductivity of 0.5 W/mK and moisture absorption of just 0.04%, this material ensures efficient heat management and durability. The coefficient of thermal expansion (CTE) is well-matched to copper, with values of 17 ppm/°C (X-axis) and 16 ppm/°C (Y-axis), ensuring excellent dimensional stability.

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA   ASTM D 3850
Density 2.1   gm/cm3 23 ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

PCB Specifications

This PCB features a carefully designed stackup:

 

- Copper Layer 1: 35 μm
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 2: 35 μm
- RO4450F Bondply: 4 mil (0.102 mm)
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 3: 35 μm

 

The overall dimensions of this PCB are 115 mm x 115 mm. It supports a minimum trace/space of 5/7 mils and a minimum hole size of 0.35 mm, with no blind vias. The finished board thickness is 1.7 mm, and it has a finished copper weight of 1 oz (1.4 mils) on the outer layers.

This PCB features a bare copper surface finish, with no silkscreen or solder mask on either side. Each board undergoes 100% electrical testing prior to shipment to ensure optimal performance.

 

Rogers RO3003 PCB 1.78mm 3 Layer With Bare Copper 0

 

Applications

This PCB is suitable for a range of applications, including:

 

- Automotive Radar Applications
- Global Positioning Satellite Antennas
- Cellular Telecommunications Systems (Power Amplifiers and Antennas)
- Patch Antennas for Wireless Communications
- Direct Broadcast Satellites
- Datalink on Cable Systems
- Remote Meter Readers
- Power Backplanes

 

Quality Assurance and Availability

Manufactured to IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is provided in Gerber RS-274-X format, ensuring compatibility with standard PCB processes.

 

With Rogers RO3003, you can achieve reliable performance in high-frequency applications, making it an excellent choice for advanced RF circuit designs.

products
PRODUCTS DETAILS
Rogers RO3003 PCB 1.78mm 3 Layer With Bare Copper
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3003
PCB Thickness:
1.78mm
PCB Size:
115mm X 115 Mm=1PCS
Layer Count:
3-layer
Copper Weight:
1OZ
Surface Finish:
Bare Copper
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Bare Copper PCB

,

1.78mm PCB

,

3-Layer PCB

Product Description

We are excited to announce our newly shipped 3-layer printed circuit board (PCB) featuring Rogers RO3003 high-frequency laminates. Engineered for commercial microwave and RF applications, RO3003 is a ceramic-filled PTFE composite known for its exceptional stability in dielectric constant (Dk) across varied temperatures and frequencies. This makes it particularly suitable for advanced applications such as automotive radar, ADAS, and 5G wireless infrastructure.

 

Key Features

Rogers RO3003 offers a dielectric constant of 3 ± 0.04 at 10 GHz and a low dissipation factor of 0.001, allowing for reliable performance in applications up to 77 GHz. With a thermal conductivity of 0.5 W/mK and moisture absorption of just 0.04%, this material ensures efficient heat management and durability. The coefficient of thermal expansion (CTE) is well-matched to copper, with values of 17 ppm/°C (X-axis) and 16 ppm/°C (Y-axis), ensuring excellent dimensional stability.

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA   ASTM D 3850
Density 2.1   gm/cm3 23 ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

PCB Specifications

This PCB features a carefully designed stackup:

 

- Copper Layer 1: 35 μm
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 2: 35 μm
- RO4450F Bondply: 4 mil (0.102 mm)
- Rogers RO3003 Substrate: 30 mil (0.762 mm)
- Copper Layer 3: 35 μm

 

The overall dimensions of this PCB are 115 mm x 115 mm. It supports a minimum trace/space of 5/7 mils and a minimum hole size of 0.35 mm, with no blind vias. The finished board thickness is 1.7 mm, and it has a finished copper weight of 1 oz (1.4 mils) on the outer layers.

This PCB features a bare copper surface finish, with no silkscreen or solder mask on either side. Each board undergoes 100% electrical testing prior to shipment to ensure optimal performance.

 

Rogers RO3003 PCB 1.78mm 3 Layer With Bare Copper 0

 

Applications

This PCB is suitable for a range of applications, including:

 

- Automotive Radar Applications
- Global Positioning Satellite Antennas
- Cellular Telecommunications Systems (Power Amplifiers and Antennas)
- Patch Antennas for Wireless Communications
- Direct Broadcast Satellites
- Datalink on Cable Systems
- Remote Meter Readers
- Power Backplanes

 

Quality Assurance and Availability

Manufactured to IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is provided in Gerber RS-274-X format, ensuring compatibility with standard PCB processes.

 

With Rogers RO3003, you can achieve reliable performance in high-frequency applications, making it an excellent choice for advanced RF circuit designs.

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