We are excited to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-60TC, a high-frequency laminate designed for high-power RF and microwave applications. This advanced material combines ceramic-filled, glass-reinforced PTFE with exceptional thermal conductivity, making it ideal for miniaturized antenna designs and other high-efficiency applications.
Key Features
RF-60TC boasts a dielectric constant (Dk) of 6.15 at 10 GHz and a low dissipation factor of 0.002, providing improved gains and efficiencies in RF circuits. Its high thermal conductivity—1.0 W/m*K for 0.5 oz copper and 1.05 W/m*K for 1 oz—ensures effective heat dissipation, reducing operating temperatures and enhancing the reliability of active components. Additionally, RF-60TC has a low moisture absorption rate of 0.03% and a thermal coefficient of Dk of -3.58 ppm/°C, ensuring stable performance across a wide temperature range.
| Property |
Test Method |
Unit |
Value |
Unit |
Value |
| Dk @ 10 GHz |
IPC-650 2.5.5.5.1 (Modified) |
|
6.15 ± 0.15 |
|
6.15 ± 0.15 |
| Df @ 10 GHz |
IPC-650 2.5.5.5.1 (Modified) |
|
0.002 |
|
0.002 |
| TcK |
|
ppm/°C |
-3.581 |
ppm/°C |
-3.581 |
| Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
55 |
kV |
55 |
| Dielectric Strength |
IPC-650 2.5.6.2 |
V/mil |
550 |
V/mm |
21,654 |
| Arc Resistance |
IPC-650 2.5.1 |
Seconds |
>180 |
Seconds |
>180 |
| Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.03 |
% |
0.03 |
| Flexural Strength (MD) |
IPC-650 2.4.4 |
psi |
10,000 |
N/mm2 |
69 |
| Flexural Strength (CD) |
IPC-650 2.4.4 |
psi |
9,000 |
N/mm2 |
62 |
| Tensile Strength (MD) |
IPC-650 2.4.19 |
psi |
9,000 |
N/mm2 |
62 |
| Tensile Strength (CD) |
IPC-650 2.4.19 |
psi |
7,000 |
N/mm2 |
48 |
| Young’s Modulus (MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
kpsi |
721 |
N/mm2 |
4971 |
| Poisson’s Ratio (MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
|
0.155 |
|
0.155 |
| Peel Strength (1 oz. ED) |
IPC-650 2.4.8 |
lbs/in |
8 |
N/mm |
1.43 |
| Thermal Conductivity (Unclad) |
IPC-650 2.4.50 |
W/M*K |
0.9 |
W/M*K |
0.9 |
| Thermal Conductivity (CH/CH) |
IPC-650 2.4.50 |
W/M*K |
1 |
W/M*K |
1 |
| Thermal Conductivity (C1/C1) |
IPC-650 2.4.50 |
W/M*K |
1.05 |
W/M*K |
1.05 |
| Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
0.01 |
mm/M |
0.01 |
| Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
0.69 |
mm/M |
0.69 |
| Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) |
mils/in |
0.06 |
mm/M |
0.06 |
| Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) |
mils/in |
0.8 |
mm/M |
0.8 |
| Surface Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm |
1.0 x 108 |
Mohm |
1.0 x 108 |
| Volume Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm/cm |
1.0 x 108 |
Mohm/cm |
1.0 x 108 |
| CTE (X, Y axis) |
IPC-650 2.4.41 (RT- 150 °C) |
ppm/°C |
9.9 |
ppm/°C |
9.9 |
| CTE (Z axis) |
IPC-650 2.4.41 (RT- 150 °C) |
ppm/°C |
40 |
ppm/°C |
40 |
| Density (Specific Gravity) |
IPC-650 2.3.5 |
g/cm3 |
2.84 |
g/cm3 |
2.84 |
| Specific Heat |
IPC-650 2.4.50 |
J/gK |
0.94 |
J/gK |
0.94 |
| Td (2% Wt. Loss) |
IPC - 650 2.4.24.6 / TGA |
°F |
930 |
°C |
500 |
| Td (5% Wt. Loss) |
IPC - 650 2.4.24.6 / TGA |
°F |
960 |
°C |
515 |
| Flammability Rating |
UL 94 |
|
V-0 |
|
V-0 |
PCB Specifications
This PCB features a robust stackup consisting of:
- Copper Layer 1: 35 μm
- RF-60TC Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
The overall dimensions of the PCB are 49.44 mm x 36.88 mm ± 0.15 mm, with a finished thickness of 0.37 mm. It supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.25 mm. The PCB is designed without blind vias, featuring a finished copper weight of 1 oz (1.4 mils) on both outer layers.
For surface finish, the PCB uses immersion tin, and it has a white silkscreen on the top side, while the bottom remains clear of silkscreen and solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure optimal performance.
| PCB Material: |
PTFE based, ceramic filled fiberglass |
| Designation: |
RF-60TC |
| Dielectric constant: |
6.15 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: |
10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications
This versatile PCB is suitable for a range of applications, including:
- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID Readers
- Filters, Couplers, and Dividers
- Satellite Components
Quality Assurance and Availability
This PCB is produced in accordance with IPC-Class 2 standards and is available for global shipping. The artwork is supplied in Gerber RS-274-X format, ensuring it is compatible with standard PCB design workflows.
Utilizing RF-60TC material allows you to attain superior performance and reliability in high-frequency applications, making it an ideal option for sophisticated RF circuit designs.
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