Rogers 3035 Pcb Rf 20mil Immersion Silver 1OZ Copper Circuits

The RO3035 PCB features high-frequency ceramic-filled PTFE laminates, part of Rogers' RO3000 series. Designed for exceptional performance in multi-layer board applications, RO3035 laminates provide a stable dielectric constant across varying temperatures, making them ideal for 5G, millimeter wave sub-6GHz, and massive MIMO applications. Their mechanical stability ensures reliability and minimizes warping, allowing for innovative designs without compromise.

Key Features
Material Composition: Ceramic-filled PTFE composites for superior performance.
Dielectric Constant: 3.5 ±0.05 at 10 GHz/23°C, ensuring excellent signal integrity.
Dissipation Factor: Low at 0.0015 at 10 GHz/23°C, reducing energy loss.
Thermal Degradation Temperature (Td): > 500°C for enhanced thermal stability.
Thermal Conductivity: 0.5 W/mK, effective for heat dissipation.
Moisture Absorption: Only 0.04%, ensuring reliability in diverse environments.
Coefficient of Thermal Expansion (CTE):
X-axis: 17 ppm/°C
Y-axis: 17 ppm/°C
Z-axis: 24 ppm/°C

Benefits
The RO3035 PCB provides several advantages:

High Frequency Capability: Can be used in applications up to 30-40 GHz.
Increased Reliability: Lower operating temperatures enhance performance in power amplifiers.
Uniform Mechanical Properties: Suitable for multi-layer board designs with varying dielectric constants, including epoxy glass hybrid designs.
Low In-Plane Expansion Coefficient: Matches closely with copper, ensuring reliable surface-mounted assemblies and excellent dimensional stability.
Cost-Effective: Economical laminate pricing makes it ideal for volume manufacturing.

PCB Stackup Configuration
The RO3035 PCB features a 2-layer rigid stackup:

Copper Layer 1: 35 μm
RO3035 Substrate: 20 mil (0.508 mm)
Copper Layer 2: 35 μm

This configuration yields a finished board thickness of 0.6 mm, with the outer layers featuring a total copper weight of 1 oz (1.4 mils).

Construction Details
Board Dimensions: 548 mm x 238 mm (1 piece)
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.35 mm
No Blind Vias included in the design.
Via Plating Thickness: 20 μm
Surface Finish: Immersion Silver for excellent solderability.
Silkscreen and Solder Mask: White top silkscreen; blue top solder mask; no bottom silkscreen or solder mask.
Quality Assurance: Each PCB undergoes a 100% electrical test prior to shipment to ensure reliability.

Quality Standards
This PCB adheres to the IPC-Class-2 quality standard, ensuring high reliability for a variety of applications.

Typical Applications
The RO3035 PCB is well-suited for a range of applications, including:

Automotive Radar Applications
Global Positioning Satellite Antennas
Cellular Telecommunications Systems: Including power amplifiers and antennas.
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes

Availability
The RO3035 PCB is available for worldwide customers, making it an excellent choice for engineers and designers seeking high-performance solutions for advanced RF applications.