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5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold

5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold
5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold 5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold

Large Image :  5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO3010 Substrate PCB Size: 35mm X 19 Mm=1PCS
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 0.2 Mm
High Light:

5mil radio frequency circuit board

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Rogers RO3010 radio frequency circuit board

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Immersion Gold radio frequency circuit board

The RO3010 PCB utilizes advanced ceramic-filled PTFE composites, offering a high dielectric constant combined with exceptional mechanical and electrical stability. This makes RO3010 an ideal choice for broadband components and a wide range of applications across various frequencies. The unique characteristics of these laminates facilitate circuit miniaturization, providing a competitive edge in performance and cost-effectiveness.

 

Key Features
Dielectric Constant: 10.2 ±0.30 at 10 GHz/23°C for superior signal integrity.
Dissipation Factor: Low at 0.0022 at 10 GHz/23°C, minimizing energy loss.
Coefficient of Thermal Expansion (CTE):
X: 13 ppm/°C
Y: 11 ppm/°C
Z: 16 ppm/°C
Thermal Degradation Temperature (Td): > 500°C for enhanced thermal stability.
Thermal Conductivity: 0.95 W/mK for effective heat management.
Moisture Absorption: Only 0.05%, ensuring reliability in various environments.
Operating Temperature Range: -40°C to +85°C.

 

Benefits
The RO3010 PCB offers numerous advantages:

Dimensional Stability: Expansion coefficients are closely matched to copper, reducing the risk of warping.
Cost-Effective Laminate: Economically priced for volume manufacturing, making it ideal for high-production runs.
Versatile Design Compatibility: Suitable for multi-layer board designs, enhancing design flexibility.

 

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

PCB Stackup Configuration
The RO3010 PCB features a 2-layer rigid stackup:

 

Copper Layer 1: 35 μm
RO3010 Substrate: 5 mil (0.127 mm)
Copper Layer 2: 35 μm

 

This configuration results in a finished board thickness of 0.2 mm, with a total copper weight of 1 oz (1.4 mils) on the outer layers.

 

5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold 0

 

Construction Details
Board Dimensions: 35 mm x 19 mm (1 piece)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
No Blind Vias included in the design.
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen; no bottom silkscreen or solder mask applied.
Contour: Laser-cut profile for precise dimensions.
Quality Assurance: Each PCB undergoes a 100% electrical test prior to shipment to ensure reliability.

 

Quality Standards
This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.

 

Typical Applications
The RO3010 PCB is suitable for a variety of applications, including:

 

Automotive Radar Applications
Global Positioning Satellite Antennas
Cellular Telecommunications Systems: Including power amplifiers and antennas.
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes

 

Availability
The RO3010 PCB is available for global procurement, making it an excellent choice for engineers and designers in need of high-performance solutions for RF and microwave applications.

 

5mil Radio Frequency Circuit Board Rogers RO3010 PCB 2-Layer Immersion Gold 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)