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Product Details:
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| Material: | TLX-9 | PCB Size: | 33.5mm X 63.2mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 0.3mm |
| High Light: | Double-Sided TLX-9 PCB,10mil TLX-9 PCB Double-Sided,1OZ Circuit Boards TLX-9 PCB |
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The TLX-9 is a high-performance printed circuit board (PCB) composed of a specialized PTFE/woven glass laminate material. This composite construction provides excellent electrical and mechanical properties that make the TLX-9 well-suited for demanding RF and microwave applications.
Key Specifications:
Dielectric constant (Dk) of 2.5 ± 0.04 at 10 GHz
Dissipation factor (Df) of 0.0019 at 10 GHz
Moisture absorption less than 0.02%
Dielectric breakdown voltage over 60 kV
Volume resistivity of 10^7 MΩ-cm and surface resistivity of 10^7 MΩ
Arc resistance greater than 180 seconds
Flexural strength of over 23,000 lbs/in lengthwise and 19,000 lbs/in crosswise
Peel strength of 12 lbs/linear inch for 1oz copper
Thermal conductivity of 0.19 W/m/K
CTE of 9-12 ppm/°C in the X-Y plane and 130-145 ppm/°C in the Z-axis
| TLX-9 TYPICAL VALUES | |||||
| Property | Test Method | Units | Value | Units | Value |
| Dielectric Constant @ 10 GHz | IPC-TM 650 2.5.5.5 | 2.5 | 2.5 | ||
| Dissipation Factor @ 10 GHz | IPC-TM 650 2.5.5.5 | 0.0019 | 0.0019 | ||
| Moisture Absorption | IPC-TM 650 2.6.2.1 | % | <0.02 | % | <0.02 |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | >60 | kV | >60 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 10^7 | Mohm/cm | 10^7 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 10^7 | Mohm/cm | 10^7 |
| Arc Resistance | IPC-TM 650 2.5.1 | seconds | >180 | seconds | >180 |
| Flexural Strength Lengthwise | IPC-TM 650 2.4.4 | lbs./in. | >23,000 | N/mm2 | >159 |
| Flexural Strength Crosswise | IPC-TM 650 2.4.4 | lbs./in. | >19,000 | N/mm2 | >131 |
| Peel Strength (1oz copper) | IPC-TM 650 2.4.8 | lbs./linear in. | 12 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.19 | W/m/K | 0.19 |
| x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 9-12 | ppm/°C | 9-12 |
| z CTE | ASTM D 3386 (TMA) | ppm/°C | 130- 145 | ppm/°C | 130- 145 |
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
The PCB stackup consists of a 0.254 mm (10 mil) TLX-9 core with 35 μm (1 oz) copper layers on both sides. It is fabricated to tight tolerances, including a minimum trace/space of 5/6 mils, minimum hole size of 0.3 mm, and a finished thickness of 0.3 mm. 100% electrical testing is performed before shipment.
Typical applications for the TLX-9 PCB include:
Low-noise amplifiers (LNAs), low-noise blocks (LNBs), and low-noise converters (LNCs)
Personal communications service (PCS) and personal communications network (PCN) antennas
High-power amplifiers
Passive components
With its exceptional electrical and mechanical properties, the TLX-9 is an ideal choice for challenging RF and microwave designs that require high performance and reliability.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
