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Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO4003C Core; S1000-2 FR-4
PCB Size:
82.5mm X 66 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Each Layer
Surface Finish:
Immersion Gold
Layer Count:
6-layer
PCB Thickness:
1.1mm
Highlight:

S1000-2 Multilayer Hybrid PCB

,

RO4003C Multilayer Hybrid PCB

,

Immersion Gold Multilayer Hybrid PCB

Product Description

Introducing our exceptional hybrid PCB, combining the advanced features of Rogers RO4003C and Shengyi S1000-2 materials. This meticulously crafted PCB offers outstanding electrical performance, low loss, and cost-effectiveness, making it an ideal choice for a wide range of applications, including point-to-point digital radio antennas, cellular base station antennas, automotive radar systems, and much more.

 

RO4003C Features:

RO4003C laminates from Rogers are proprietary woven glass reinforced hydrocarbon/ceramic materials designed to deliver exceptional electrical performance and manufacturability. Key features include:

 

- Tight Control on Dielectric Constant: RO4003C ensures precise control of dielectric constant (Dk) with a value of 3.38 +/- 0.05, providing reliable signal transmission.

 

- Low Loss Tangent: With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal loss and exhibits excellent high-frequency performance.

 

- Low Z-Axis CTE: RO4003C showcases a low coefficient of thermal expansion (CTE) of 46 ppm/°C in the Z-axis, ensuring outstanding dimensional stability and reliability.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

S1000-2 Features:

S1000-2 materials from Shengyi are lead-free compatible FR-4 laminates known for their high thermal resistance, low CTE, and excellent through-hole reliability. Notable features include:

 

- High Thermal Resistance and Tg: S1000-2 boasts a high glass transition temperature (Tg) of 170°C (DSC), making it suitable for applications with elevated operating temperatures. It also exhibits excellent UV blocking and AOI compatibility.

 

- Low Z-Axis CTE: With a low CTE of 45 ppm/°C before Tg, S1000-2 provides exceptional dimensional stability, ensuring reliable performance in various conditions.

 

- Outstanding Mechanical and Electrical Properties: S1000-2 offers excellent anti-CAF (Conductive Anodic Filament) performance, low water absorption of 0.1%, and reliable through-hole reliability.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 0

 

Hybrid PCB Construction:

This hybrid PCB combines the benefits of RO4003C and S1000-2 materials to meet specific requirements. RO4003C, known for its high-frequency performance and stability, is strategically used in critical areas such as RF transmission lines and sensitive signal paths. S1000-2, a cost-effective and versatile FR-4 material, is employed in other areas of the PCB where high-frequency performance is not as crucial, such as power distribution and mechanical support. This hybrid design achieves a balance between performance and cost-effectiveness.

 

PCB Construction and Specifications:

This hybrid PCB features a 6-layer rigid construction, meticulously designed to meet demanding requirements. Here are the key specifications:

 

- Board Dimensions: The PCB dimensions are precisely maintained at 82.5mm x 66mm (1PCS) with a tolerance of +/- 0.15mm.

 

- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.

 

- Stackup Configuration: The stackup consists of copper layers, RO4003C and S1000-2 cores, and prepreg layers, providing optimal performance and reliability.

 

- Finished Board Thickness and Copper Weight: The finished board thickness is 1.1mm, ensuring durability. Each layer has a copper weight of 1oz (1.4 mils), enabling efficient conductivity.

 

- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.

 

- Silkscreen and Solder Mask: The top silkscreen is in white, enhancing component visibility. The bottom silkscreen is not applied. The top and bottom solder masks are in matte green, offering reliable protection.

 

- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 1

 

Artwork, Availability, and Applications:

This hybrid PCB with RO4003C and S1000-2 materials is compatible with Gerber RS-274-X artwork, ensuring seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.

 

Unlock the full potential of your high-frequency applications with our advanced hybrid PCB. Experience exceptional electrical performance, reliability, and cost-effectiveness by choosing our hybrid solution. Elevate your designs to new heights and enjoy the benefits of both RO4003C and S1000-2 materials.

products
PRODUCTS DETAILS
Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO4003C Core; S1000-2 FR-4
PCB Size:
82.5mm X 66 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Each Layer
Surface Finish:
Immersion Gold
Layer Count:
6-layer
PCB Thickness:
1.1mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

S1000-2 Multilayer Hybrid PCB

,

RO4003C Multilayer Hybrid PCB

,

Immersion Gold Multilayer Hybrid PCB

Product Description

Introducing our exceptional hybrid PCB, combining the advanced features of Rogers RO4003C and Shengyi S1000-2 materials. This meticulously crafted PCB offers outstanding electrical performance, low loss, and cost-effectiveness, making it an ideal choice for a wide range of applications, including point-to-point digital radio antennas, cellular base station antennas, automotive radar systems, and much more.

 

RO4003C Features:

RO4003C laminates from Rogers are proprietary woven glass reinforced hydrocarbon/ceramic materials designed to deliver exceptional electrical performance and manufacturability. Key features include:

 

- Tight Control on Dielectric Constant: RO4003C ensures precise control of dielectric constant (Dk) with a value of 3.38 +/- 0.05, providing reliable signal transmission.

 

- Low Loss Tangent: With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal loss and exhibits excellent high-frequency performance.

 

- Low Z-Axis CTE: RO4003C showcases a low coefficient of thermal expansion (CTE) of 46 ppm/°C in the Z-axis, ensuring outstanding dimensional stability and reliability.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

S1000-2 Features:

S1000-2 materials from Shengyi are lead-free compatible FR-4 laminates known for their high thermal resistance, low CTE, and excellent through-hole reliability. Notable features include:

 

- High Thermal Resistance and Tg: S1000-2 boasts a high glass transition temperature (Tg) of 170°C (DSC), making it suitable for applications with elevated operating temperatures. It also exhibits excellent UV blocking and AOI compatibility.

 

- Low Z-Axis CTE: With a low CTE of 45 ppm/°C before Tg, S1000-2 provides exceptional dimensional stability, ensuring reliable performance in various conditions.

 

- Outstanding Mechanical and Electrical Properties: S1000-2 offers excellent anti-CAF (Conductive Anodic Filament) performance, low water absorption of 0.1%, and reliable through-hole reliability.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 0

 

Hybrid PCB Construction:

This hybrid PCB combines the benefits of RO4003C and S1000-2 materials to meet specific requirements. RO4003C, known for its high-frequency performance and stability, is strategically used in critical areas such as RF transmission lines and sensitive signal paths. S1000-2, a cost-effective and versatile FR-4 material, is employed in other areas of the PCB where high-frequency performance is not as crucial, such as power distribution and mechanical support. This hybrid design achieves a balance between performance and cost-effectiveness.

 

PCB Construction and Specifications:

This hybrid PCB features a 6-layer rigid construction, meticulously designed to meet demanding requirements. Here are the key specifications:

 

- Board Dimensions: The PCB dimensions are precisely maintained at 82.5mm x 66mm (1PCS) with a tolerance of +/- 0.15mm.

 

- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.

 

- Stackup Configuration: The stackup consists of copper layers, RO4003C and S1000-2 cores, and prepreg layers, providing optimal performance and reliability.

 

- Finished Board Thickness and Copper Weight: The finished board thickness is 1.1mm, ensuring durability. Each layer has a copper weight of 1oz (1.4 mils), enabling efficient conductivity.

 

- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.

 

- Silkscreen and Solder Mask: The top silkscreen is in white, enhancing component visibility. The bottom silkscreen is not applied. The top and bottom solder masks are in matte green, offering reliable protection.

 

- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 1

 

Artwork, Availability, and Applications:

This hybrid PCB with RO4003C and S1000-2 materials is compatible with Gerber RS-274-X artwork, ensuring seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.

 

Unlock the full potential of your high-frequency applications with our advanced hybrid PCB. Experience exceptional electrical performance, reliability, and cost-effectiveness by choosing our hybrid solution. Elevate your designs to new heights and enjoy the benefits of both RO4003C and S1000-2 materials.

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