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Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold
Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

Large Image :  Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO4003C Core; S1000-2 FR-4 PCB Size: 82.5mm X 66 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Each Layer Surface Finish: Immersion Gold
Layer Count: 6-layer PCB Thickness: 1.1mm
Highlight:

S1000-2 Multilayer Hybrid PCB

,

RO4003C Multilayer Hybrid PCB

,

Immersion Gold Multilayer Hybrid PCB

Introducing our exceptional hybrid PCB, combining the advanced features of Rogers RO4003C and Shengyi S1000-2 materials. This meticulously crafted PCB offers outstanding electrical performance, low loss, and cost-effectiveness, making it an ideal choice for a wide range of applications, including point-to-point digital radio antennas, cellular base station antennas, automotive radar systems, and much more.

 

RO4003C Features:

RO4003C laminates from Rogers are proprietary woven glass reinforced hydrocarbon/ceramic materials designed to deliver exceptional electrical performance and manufacturability. Key features include:

 

- Tight Control on Dielectric Constant: RO4003C ensures precise control of dielectric constant (Dk) with a value of 3.38 +/- 0.05, providing reliable signal transmission.

 

- Low Loss Tangent: With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal loss and exhibits excellent high-frequency performance.

 

- Low Z-Axis CTE: RO4003C showcases a low coefficient of thermal expansion (CTE) of 46 ppm/°C in the Z-axis, ensuring outstanding dimensional stability and reliability.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

S1000-2 Features:

S1000-2 materials from Shengyi are lead-free compatible FR-4 laminates known for their high thermal resistance, low CTE, and excellent through-hole reliability. Notable features include:

 

- High Thermal Resistance and Tg: S1000-2 boasts a high glass transition temperature (Tg) of 170°C (DSC), making it suitable for applications with elevated operating temperatures. It also exhibits excellent UV blocking and AOI compatibility.

 

- Low Z-Axis CTE: With a low CTE of 45 ppm/°C before Tg, S1000-2 provides exceptional dimensional stability, ensuring reliable performance in various conditions.

 

- Outstanding Mechanical and Electrical Properties: S1000-2 offers excellent anti-CAF (Conductive Anodic Filament) performance, low water absorption of 0.1%, and reliable through-hole reliability.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 0

 

Hybrid PCB Construction:

This hybrid PCB combines the benefits of RO4003C and S1000-2 materials to meet specific requirements. RO4003C, known for its high-frequency performance and stability, is strategically used in critical areas such as RF transmission lines and sensitive signal paths. S1000-2, a cost-effective and versatile FR-4 material, is employed in other areas of the PCB where high-frequency performance is not as crucial, such as power distribution and mechanical support. This hybrid design achieves a balance between performance and cost-effectiveness.

 

PCB Construction and Specifications:

This hybrid PCB features a 6-layer rigid construction, meticulously designed to meet demanding requirements. Here are the key specifications:

 

- Board Dimensions: The PCB dimensions are precisely maintained at 82.5mm x 66mm (1PCS) with a tolerance of +/- 0.15mm.

 

- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.

 

- Stackup Configuration: The stackup consists of copper layers, RO4003C and S1000-2 cores, and prepreg layers, providing optimal performance and reliability.

 

- Finished Board Thickness and Copper Weight: The finished board thickness is 1.1mm, ensuring durability. Each layer has a copper weight of 1oz (1.4 mils), enabling efficient conductivity.

 

- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.

 

- Silkscreen and Solder Mask: The top silkscreen is in white, enhancing component visibility. The bottom silkscreen is not applied. The top and bottom solder masks are in matte green, offering reliable protection.

 

- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.

 

Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold 1

 

Artwork, Availability, and Applications:

This hybrid PCB with RO4003C and S1000-2 materials is compatible with Gerber RS-274-X artwork, ensuring seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.

 

Unlock the full potential of your high-frequency applications with our advanced hybrid PCB. Experience exceptional electrical performance, reliability, and cost-effectiveness by choosing our hybrid solution. Elevate your designs to new heights and enjoy the benefits of both RO4003C and S1000-2 materials.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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