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Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit

Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit
Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit

Large Image :  Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO4533 PCB Size: 85.89mm X 161.45 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Layer Count: 2-layer PCB Thickness: 30 Mil

Introducing our newly shipped PCB featuring the RO4533 material, an advanced solution designed specifically for mobile infrastructure microstrip antenna applications. This ceramic-filled, glass-reinforced hydrocarbon-based laminate offers exceptional performance, controlled dielectric constant, low loss, and excellent passive intermodulation response.


The RO4533 laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processing, eliminating the need for special treatments required by traditional PTFE-based laminates. This makes it a cost-effective alternative to PTFE antenna technologies while allowing designers to optimize both price and performance. Additionally, RO4533 laminates are available in a halogen-free option, meeting stringent environmental standards.


The resin systems of RO4533 dielectric materials are carefully designed to deliver ideal antenna performance. The coefficients of thermal expansion (CTEs) in the X and Y directions closely match that of copper, reducing stresses in the printed circuit board antenna. These laminates have a high glass transition temperature (Tg) of over 280°C (536°F), resulting in a low z-axis CTE and excellent plated through-hole reliability.


Key Features:

Dielectric Constant (Dk): 3.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
X-axis CTE: 13ppm/°C, Y-axis CTE: 11ppm/°C, Z-axis CTE: 37ppm/°C
Tg >280°C
Low moisture absorption: 0.02%
Thermal conductivity: 0.6 W/mk


Property RO4533 Direction Units Condition Test Method
Dielectric Constant, er Process 3.3 ± 0.08 Z - 10 GHz/23℃ 2.5 GHz IPC-TM-650,
Dissipation Factor 0.002 Z - 2.5 GHz/23℃ IPC-TM-650,
0.0025 10 GHz/23℃
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650,
Dimensional Stability <0.2 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 13 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41
11 Y
37 Z
Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518
Moisture Absorption 0.02 - % D48/50 IPC-TM-650, ASTM D570
Tg >280 - ℃ TMA A IPC-TM-650,
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.9 (1.2) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -



Low loss, low Dk, and low passive intermodulation (PIM) response for a wide range of applications
Thermoset resin system compatible with standard PCB fabrication processes
Excellent dimensional stability, enabling greater yield on larger panel sizes
Uniform mechanical properties for maintaining mechanical form during handling
High thermal conductivity for improved power handling


The PCB stackup consists of Copper Layer 1, Rogers RO4533 Core, and Copper Layer 2. Copper Layer 1 has a thickness of 35 μm, ensuring efficient signal transmission and robust conductivity. The core of this PCB is composed of Rogers RO4533 material, with a thickness of 0.762 mm (30 mil). This advanced material delivers exceptional performance, controlled dielectric constant, and low loss, making it ideal for a wide range of applications. Completing the stackup is Copper Layer 2, also with a thickness of 35 μm, providing additional routing options and a solid ground plane for improved signal integrity and electromagnetic compatibility.


Moving on to the PCB construction details, the board dimensions are 85.89 mm x 161.45 mm (1PCS), offering a compact and versatile form factor for various applications. The minimum trace/space is 4/6 mils, ensuring precise routing and efficient use of PCB real estate. The minimum hole size is 0.3 mm, allowing for the accommodation of various components and connectors. The board does not include blind vias, simplifying the manufacturing process.


The finished board thickness is 0.8 mm, striking a balance between durability and space constraints. The finished copper weight on the outer layers is 1 oz (1.4 mils), providing sufficient conductivity and structural support. The via plating thickness is 20 μm, ensuring reliable electrical connections throughout the PCB.


Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit 0


For surface finishing, this PCB utilizes immersion silver, which offers excellent solderability and a flat surface for component mounting. The top silkscreen is in white, providing clear labeling and component identification. The bottom silkscreen is not present in this configuration. The top solder mask is green, offering protection against solder bridging and ensuring proper solder joint formation. The bottom solder mask is not applied in this case.


To ensure quality and reliability, each PCB undergoes a 100% electrical test prior to shipment, guaranteeing that all connections and circuits meet the required specifications.


In terms of PCB statistics, this board comprises 57 components and has a total of 137 pads. Among these pads, 92 are through-hole pads, while 45 are top surface-mount technology (SMT) pads. The bottom surface-mount pads are not present in this configuration. The PCB features 102 vias, facilitating interconnection between different layers and components. The board has 3 nets, representing the interconnected pathways for signal transmission.


PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4533
Dielectric constant: 3.3
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..


Artwork Supplied: Gerber RS-274-X


Quality Standard: IPC-Class-2


Availability: This PCB is available for worldwide shipping, ensuring easy access to this high-quality solution.


Typical Applications:

Cellular infrastructure base station antennas
WiMAX antenna networks


Experience the exceptional performance and reliability of this RO4533 PCB, designed to meet the demanding requirements of mobile infrastructure microstrip antennas. Elevate your antenna designs with this advanced material and unlock new possibilities for your wireless communication systems.


Double-Sided RO4533 PCB 30mil with Immersion Silver High Performance Circuit 1


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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