0.6mm RT Duroid 6035HTC 20mil 2-layer High Frequency PCB Immersion Gold

Introducing the High Frequency PCB based on RT/duroid 6035HTC. Engineered with ceramic filled PTFE composites, this cutting-edge circuit material offers exceptional performance and reliability, making it the ideal choice for demanding high power applications. Say goodbye to thermal concerns and welcome a new era of efficiency and precision.

Key Features:

The RT/duroid 6035HTC High Frequency PCB boasts impressive electrical properties that ensure precise signal propagation and long-term durability. With a DK of 3.5 +/- 0.05 at 10 GHz/23°C, it delivers accurate and reliable signal transmission. The low dissipation factor of 0.0013 at 10 GHz/23°C minimizes signal loss, guaranteeing optimal performance. Its thermal coefficient of dielectric constant of -66 ppm/°C provides exceptional thermal stability, enabling reliable operation even in varying temperature conditions. Additionally, the moisture absorption rate of only 0.06% ensures long-term durability and reliability.

Superior Thermal Conductivity:

One of the standout features of the RT/duroid 6035HTC High Frequency PCB is its superior thermal conductivity. With a thermal conductivity of 1.44 W/m/K at 80°C, this PCB enables efficient heat dissipation, preventing overheating and ensuring reliable performance even under high power conditions. By reducing operating temperatures, it enhances the overall performance and longevity of high power applications, making it an excellent choice for demanding environments.

Unmatched Performance:

The RT/duroid 6035HTC High Frequency PCB delivers unmatched performance across various aspects. It excels in high frequency performance, ensuring seamless signal transmission with minimal interference. With lower insertion loss, it guarantees enhanced signal integrity, maintaining the integrity of the transmitted signals. Moreover, it exhibits exceptional thermal stability of traces, enabling reliable operation and reducing the risk of signal degradation due to temperature fluctuations.

PCB Stackup and Construction Details:

This PCB features a 2-layer rigid PCB construction. The copper_layer_1, with a thickness of 35 μm, facilitates efficient signal conduction. The RT/duroid 6035HTC layer, measuring 0.508 mm (20 mil), ensures optimal electrical properties for superior performance. Finally, the copper_layer_2, also 35 μm thick, delivers consistent signal performance throughout the PCB.

Specifications:

- Board dimensions: 72.66mm x 83.2 mm, ensuring compactness and flexibility.
- Minimum Trace/Space: 5/6 mils for intricate circuit layouts.
- Minimum Hole Size: 0.4mm for precise component placement.
- Finished board thickness: 0.6mm, striking a balance between durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring reliable signal conduction.
- Via plating thickness: 20 μm for efficient interconnection.
- Surface finish: Immersion Gold, providing excellent conductivity and corrosion resistance.
- Top Silkscreen: White, facilitating clear component identification.
- Bottom Silkscreen: No, for a clean and minimalist appearance.
- Top Solder Mask: Green, ensuring effective soldering and protection.
- Bottom Solder Mask: No, offering flexibility for customization.
- 100% Electrical test used prior to shipment, guaranteeing quality assurance.

Additional Information:

- Components: 24, offering versatility for various applications.
- Total Pads: 74, providing ample connectivity options.
- Thru Hole Pads: 45, facilitating secure and stable component mounting.
- Top SMT Pads: 29, enabling efficient surface mount technology integration.
- Bottom SMT Pads: 0, providing flexibility for different assembly configurations.
- Vias: 45, ensuring efficient signal routing and interconnection.
- Nets: 3, simplifying circuit design and optimization.

Standards and Availability:

- Artwork supplied: Gerber RS-274-X, ensuring compatibility and ease of use.
- Accepted standard: IPC-Class-2, guaranteeing high-quality manufacturing.
- Availability: Worldwide, enabling accessibility for customers globally.

Applications:

The RT/duroid 6035HTC High Frequency PCB finds its utility in a wide range of applications, including:
 

- High power RF and microwave amplifiers, ensuring reliable and efficient signal amplification.
- Power amplifiers, couplers, filters, combiners, and power dividers, enabling seamless integration into various systems.

Elevate your high power RF and microwave applications to new heights with the RT/duroid 6035HTC High Frequency PCB. Immerse yourself in unrivaled performance, exceptional thermal conductivity, and unmatched reliability that exceeds all expectations. Take action today to unlock an extraordinary realm of possibilities.