4.8mm RO4003C RF PCB Copper Filled Vias With ENEPIG

Introducing our newly shipped PCB built on the RO4003C substrates. A high-performance laminate that combines the electrical properties of PTFE/woven glass with the manufacturability of epoxy/glass. The proprietary woven glass reinforced hydrocarbon/ceramic materials of RO4003C offer exceptional electrical performance and cost-effective circuit fabrication.

RO4003C laminates are available in various configurations utilizing 1080 and 1674 glass fabric styles, all meeting the same stringent electrical performance specifications. These laminates provide precise control over the dielectric constant (Dk) and low loss, while employing the same processing methods as standard epoxy/glass laminates. Unlike PTFE-based microwave materials, no specialized through-hole treatments or handling procedures are required, simplifying the manufacturing process.

Featuring a dielectric constant of DK 3.38 +/-0.05 at 10GHz and a dissipation factor of 0.0027 at 10GHz, the RO4003C PCB ensures accurate and reliable signal transmission. It exhibits a thermal conductivity of 0.71 W/m/°K, contributing to efficient heat dissipation. The PCB demonstrates a low coefficient of thermal expansion (CTE) with 11 ppm/°C for the X axis, 14 ppm/°C for the Y axis, and 46 ppm/°C for the Z axis. It also possesses a high Tg value of >280 °C, ensuring stability under elevated temperatures.

The RO4003C PCB offers numerous benefits for your applications. It is ideal for multi-layer board (MLB) constructions and can be processed like FR-4 at a lower fabrication cost, making it an attractive choice for performance-sensitive, high-volume applications. Additionally, it is competitively priced, providing excellent value for its performance capabilities.

This particular PCB is a 3-layer rigid board with a stackup consisting of copper_layer_1 (35 μm), a 0.508 mm (20mil) Rogers RO4003C core, a 0.200mm RO4450F prepreg, copper_layer_2 (35 μm), a 1.524mm Rogers RO4003C core, a 0.200mm RO4450F prepreg, another 1.524mm Rogers RO4003C core, a 0.200mm RO4450F prepreg, a 0.508mm Rogers RO4003C core, and copper_layer_3 (35 μm). This configuration offers structural integrity and optimal electrical performance.

This PCB has a board dimension of 66mm x 66mm, with a tolerance of +/- 0.15mm. It features a minimum trace/space of 10/10 mils and a minimum hole size of 0.5mm. There are no blind vias. The finished board thickness is 4.8mm, with a 1oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm. The surface finish is ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold). The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is black, and the bottom solder mask is not applied. The PCB features plugged vias filled with conductive paste (copper paste). Each board undergoes a comprehensive 100% electrical test to ensure its performance and reliability.

This PCB adheres to IPC-Class-2 quality standards, guaranteeing high-quality manufacturing processes and reliable performance. It is available worldwide, catering to customers globally.

The RO4003C PCB finds applications in various industries. It is well-suited for cellular base station antennas and power amplifiers, providing excellent signal transmission and reliability. It is also suitable for RF identification tags, automotive radar, sensors, and LNB's (Low-Noise Block Downconverters) for direct broadcast satellites. Choose the RO4003C PCB for outstanding electrical performance, cost-effective fabrication, and reliable functionality in demanding applications.