Send Message
Home ProductsRF PCB Board

2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free

2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free
2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free 2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free

Large Image :  2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Layer Count: 4-layer Thickness: 2.7mm
Copper Weight: 1OZ Surface Finish: HASL Lead Free
High Light:

High Frequency RO3010 Multilayer PCB

,

2.7mm RO3010 Multilayer PCB

,

HASL Lead Free RO3010 Multilayer PCB

Introducing our newly shipped PCB featuring the RO3010 advanced circuit material. Intended to meet the demands of modern electronics, this high-performance PCB offers exceptional stability and a wide range of applications across various frequencies. With its ceramic-filled PTFE composites and competitive pricing, our PCB is the ideal choice for circuit miniaturization and volume manufacturing processes.

 

Key Features:
- Dielectric constant of 10.2+/- .30 at 10 GHz/23°C
- Dissipation factor of 0.0022 at 10 GHz/23°C
- Low Coefficient of Thermal Expansion (-55 to 288 °C) of 13 ppm/°C(X), 11 ppm/°C (Y), 16 ppm/°C (Z) respectively
- Td> 500°C
- Thermal Conductivity of 0.95 W/mK
- Moisture Absorption of 0.05%

 

Benefits:
1. Dimensional stability with expansion coefficient matched to copper.
2. Economical laminate pricing for volume manufacturing processes.
3. Suitable for use with multi-layer board designs.

 

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

This PCB stackup consists of a 2-layer rigid design, featuring copper layers, Rogers RO3010 substrate, and prepreg. The finished board thickness is 2.7mm with a copper weight of 1 oz (1.4 mils) on the outer layers. The PCB dimensions are 30mm x 30mm, providing ample space for your circuitry. The board supports a minimum trace/space of 6/4 mils and a minimum hole size of 0.35mm. The via plating thickness is 20 μm, ensuring reliable connections.

 

For your convenience, this PCB comes with a HASL lead-free surface finish, eliminating the need for additional processing. The top and bottom silkscreens, as well as the solder masks, are not included, allowing you flexibility in customization. Prior to shipment, each PCB undergoes a 100% electrical test, ensuring quality and performance.

 

With 2 components, 5 pads, 3 vias, and 3 nets, our PCB is designed to meet IPC-Class-2 standards, guaranteeing reliability and adherence to industry standards. The artwork supplied is in Gerber RS-274-X format, widely accepted in the industry.

 

2.7mm RO3010 Multilayer PCB High Frequency Circuit With HASL Lead Free 0

 

This versatile PCB finds applications in various fields, including:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes

 

Our high-quality PCB is readily available for shipping worldwide, ensuring that you can access our advanced technology regardless of your location. Whether you're working on automotive radar applications, global positioning satellite antennas, cellular telecommunications systems, wireless communications, direct broadcast satellites, cable systems, remote meter readers, or power backplanes, our RO3010 PCB is the perfect choice. Experience the reliability, performance, and affordability of our PCB solution and bring your electronic designs to life with ease.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)