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Product Details:
Payment & Shipping Terms:
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| Material: | RO4003C+FR4 | PCB Size: | 356mm X 373mm (+/- 0.15mm) In 3 Types |
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| Copper Weight: | 1OZ Each Layer | Surface Finish: | HASL |
| Highlight: | RO4003C 6layer Hybrid PCB,HASL 6layer Hybrid PCB,FR4 6layer Hybrid PCB |
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Introducing our Hybrid PCB: a cutting-edge solution that combines the benefits of Tg170 FR-4 and 20mil RO4003C materials to deliver exceptional performance and versatility. This hybrid design allows for the integration of different functionalities, making it ideal for a wide range of applications.
Features:
Mixed-Signal Compatibility:
Our Hybrid PCB supports both analog and digital signals, thanks to the combination of Tg170 FR-4 and 20mil RO4003C materials. The FR-4 portion ensures reliable performance for standard circuitry, while the RO4003C portion provides excellent high-frequency characteristics for RF/microwave signals.
High-Frequency Performance:
The RO4003C material excels in high-frequency applications with its low dielectric loss and superior signal integrity. This results in efficient signal transmission, minimal loss, and reduced signal distortion, making it ideal for demanding RF/microwave applications.
Thermal Management:
The inclusion of FR-4 in our Hybrid PCB enhances thermal conductivity, enabling effective heat dissipation from components. This feature is particularly valuable for applications that require efficient thermal management to maintain optimal performance.
Design Flexibility:
Our Hybrid PCB offers unparalleled design flexibility, allowing for the integration of different technologies and materials. Designers can strategically optimize the layout and material selection for each section of the board, tailoring it precisely to the requirements of specific functionalities.
Cost Optimization:
By selectively incorporating RO4003C where high-frequency performance is required, our Hybrid PCB optimizes costs. The utilization of FR-4 for other sections provides a cost-effective solution without compromising performance, making it an economical choice compared to using high-frequency materials throughout the entire board.
Compatibility:
Both Tg170 FR-4 and RO4003C are fully compatible with standard PCB fabrication processes, ensuring seamless manufacturing and assembly. This compatibility simplifies the integration of our Hybrid PCB into existing production workflows.
PCB Stackup:
Our Hybrid PCB features a 6-layer rigid construction with the following stackup:
Copper Layer 1: 35 μm
RO4003C: 0.508 mm (20mil)
Copper Layer 2: 35 μm
Prepreg: 0.102 mm
Copper Layer 3: 35 μm
Tg170°C FR-4: 0.254 mm
Copper Layer 4: 35 μm
Prepreg: 0.102 mm
Copper Layer 5: 35 μm
Tg170°C FR-4: 0.508 mm
Copper Layer 6: 35 μm
PCB Construction Details:
Board Dimensions: 356mm x 373mm (+/- 0.15mm) in 3 types, totaling 3 pieces
Minimum Trace/Space: 4/4 mils, ensuring precise circuit design and layout
Minimum Hole Size: 0.35mm, supporting fine-pitch components and high-density interconnects
No Blind Vias: Simplicity in design and manufacturing process
Finished Board Thickness: 1.8mm, providing durability and structural integrity
Finished Copper Weight: 1oz (1.4 mils) on outer layers, guaranteeing optimal conductivity
Via Plating Thickness: 20 μm, ensuring reliable electrical connections
Surface Finish: HASL, providing excellent solderability and protection against oxidation
Top Silkscreen: White, facilitating component placement and identification
Bottom Silkscreen: Not applicable
Top Solder Mask: Blue, safeguarding copper traces and preventing solder bridges
Bottom Solder Mask: Blue, protecting copper traces on the bottom layer
100% Electrical Test: Each PCB undergoes a comprehensive electrical test before shipping, ensuring functionality and quality.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Statistics:
The Hybrid PCB incorporates a total of 127 components and features 413 pads for component connections. Out of these pads, 216 are dedicated to thru-hole components, while the remaining 197 pads are for surface mount technology (SMT) components on the top layer. There are no SMT pads on the bottom layer. The PCB includes 175 vias to establish connections between different layers. A total of 12 nets represent the interconnected paths between components, ensuring proper signal flow and functionality.
Artwork Supplied: Gerber RS-274-X
Quality Standard: Our Hybrid PCB adheres to IPC-Class-2 quality standards, ensuring high reliability and performance.
Availability: Our Hybrid PCB is available worldwide and can cater to diverse industries and applications.
Typical Applications:
- Telecommunications
- Radar systems, satellite communications, avionics
- Vehicle communication modules
- Patient monitoring systems
- Industrial automation systems
- Spectrum analyzers, network analyzers, and signal generators
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
