Send Message
Home ProductsRF PCB Board

6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)
6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

Large Image :  6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: F4BTMS350 PCB Size: 76mm X 76mm
Copper Weight: 35um Surface Finish: Hot Air Soldering Level (HASL)
High Light:

1OZ 6.35mm F4BTMS350 RF PCB


6.35mm F4BTMS350 RF PCB



The newly shipped PCB which made of F4BTMS350, intended to use for high frequency applications.The F4BTMS350 substrate utilizes a unique blend of ultra-thin glass fiber cloth and specially engineered nano-ceramics mixed with polytetrafluoroethylene resin. This combination mitigates the negative effects of glass fiber on electromagnetic wave propagation, resulting in reduced dielectric loss, enhanced dimensional stability, and minimized X/Y/Z anisotropy. The advanced material composition enables a wider usable frequency range, improved electrical strength, and enhanced thermal conductivity. Moreover, the F4BTMS350 exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics, ensuring optimal performance across various environmental conditions.


Key Features of the F4BTMS350 PCB:

Unlock the potential of your electronic designs with the remarkable features of the F4BTMS350 PCB:


Dielectric Constant (Dk): Experience exceptional signal integrity and precise transmission capabilities with a Dk of 3.5 at 10GHz.


Dissipation Factor: Minimize signal loss and maximize performance with a low dissipation factor of .0016 at 10GHz, 0.0019 at 20GHz, and 0.0024 at 20GHz.


Thermal Stability: The F4BTMS350 PCB offers remarkable thermal stability with a CTE of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and 20 ppm/°C (z-axis) over a wide temperature range of -55°C to 288°C.


Low Thermal Coefficient: Benefit from excellent thermal stability with a low thermal coefficient of Dk at -39 ppm/°C between -55°C and 150°C.


High Thermal Conductivity: Facilitate efficient heat dissipation and maintain optimal temperature conditions with a high thermal conductivity of 0.6 W/mk.


Moisture Absorption: Ensure long-term reliability and performance with a moisture absorption rate of only 0.03%.


PCB Stackup and Construction Details:

Designed with precision and durability in mind, the F4BTMS350 PCB offers the following stackup and construction details:


Board Dimensions: The F4BTMS350 PCB measures 76mm x 76mm, providing ample space for component placement and circuit design, with a tolerance of +/- 0.15mm.


Minimum Trace/Space: Enable intricate designs and precise routing with a minimum trace/space requirement of 6/7 mils.


Minimum Hole Size: Accommodate miniaturized components and streamline assembly with a minimum hole size of 1.5mm.


Finished Board Thickness: The F4BTMS350 PCB boasts a finished board thickness of 6.42mm, ensuring robustness and reliability.


Surface Finish: The PCB features a reliable and widely used Hot Air Soldering Level (HASL) surface finish, guaranteeing excellent solderability and ease of assembly.


Silkscreen and Solder Mask: The F4BTMS350 PCB does not include top or bottom silkscreen or solder mask, offering a clean and minimalist appearance.


Electrical Testing: Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring optimal functionality and performance.


6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL) 0


Typical Applications:

The F4BTMS350 PCB excels in a wide range of demanding applications, including:

Aerospace Equipment: Meet the rigorous demands of aerospace equipment, including space and cabin applications, with the high-reliability performance of the F4BTMS350.


Microwave and RF Applications: Experience enhanced signal transmission and efficiency in microwave and RF systems, enabling superior performance.


Radar Systems: The F4BTMS350 PCB is an excellent choice for military radar applications, providing low interference and reliable signal propagation.


Antenna Systems: From feed networks to phase-sensitive antennas and phased array antennas, the F4BTMS350 delivers optimal performance and signal integrity.


Satellite Communications: Ensure stable and reliable communication in satellite systems, where the F4BTMS350 PCB excels in demanding environments.


6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL) 1


Discover Unmatched Performance:

With its cutting-edge features, robust construction, and global availability, the F4BTMS350 PCB represents the pinnacle of electronic advancements. Whether you're working on aerospace equipment, radar systems, or high-frequency applications, you can rely on the F4BTMS350 to deliver unparalleled performance and reliability. Embrace the future of PCB technology and unleash the true potential of your electronic designs with the F4BTMS350.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)